The system architecture of a GPU-CPU server requires the CPU to initiate and manage memory transfers between the GPU and the InfiniBand network. The new software solution will enable Tesla GPUs to transfer data to pinned system memory that a Mellanox InfiniBand solution is able to read and transmit over the network. The result is increased overall system performance and efficiency.

"NVIDIA Tesla GPUs deliver large increases in performance across each node in a cluster, but in our production runs on TSUBAME 1 we have found that network communication becomes a bottleneck when using multiple GPUs," said Prof. Satoshi Matsuoka from Tokyo Institute of Technology. "Reducing the dependency on the CPU by using InfiniBand will deliver a major boost in performance in high performance GPU clusters, thanks to the work of NVIDIA and Mellanox, and will further enhance the architectural advances we will make in TSUBAME2.0."

'In GPU-based clusters, most of the compute intensive processing is running on the GPUs,' said Gilad Shainer, director of high performance computing and technical marketing at Mellanox Technologies. 'It's a natural evolution of the system architecture to enable GPUs to communicate more intelligently over InfiniBand. This helps create a computing platform that will enable future Exascale computing and dramatically increase performance for a broad spectrum of applications.'

'Anyone who cares about performance in their datacenter uses InfiniBand,' said Andy Keane, general manager, Tesla business at NVIDIA. 'This new feature will further improve application performance on GPU-based clusters by reducing the dependency on the CPU for communicating over InfiniBand.'

This software capability will be available in the NVIDIA CUDA™ architecture toolkit beginning in Q2 2010 and will work on existing Tesla S1070 1U computing systems and Tesla M1060 module-based clusters and also with the new Tesla 20-series S2050 and S2070 1U systems.

— WebWireID108187 —

* Researchers at a new European Intel lab will explore computers with a thousand times the performance of today's fastest supercomputers.
* Effort is part of Intel Labs Europe, Intel's research network of 900 researchers in the European region.
* Intel has committed a multi-million Euro investment toward a new lab. CEA, UVSQ and GENCI will jointly match Intel's contribution.

PARIS - Commissariat à l'Énergie Atomique, Grand Equipement National de Calcul Intensif, Intel Corporation and Université de Versailles Saint-Quentin-en-Yvelines have entered into an agreement to create an Exascale Computing Research Center. Part of Intel's European research network - Intel Labs Europe – the center will explore how to build high-performance computing systems with a thousand times the performance of today's fastest supercomputers. The term "exascale" refers to computers that are able to process 1 trillion – or 1 million million million – instructions per second.

Intel will support the Exascale Computing Research Center with a multi-million Euro investment over a 3-year period. The French Atomic Energy Commission (Commissariat à l'Énergie Atomique), the Versailles Saint-Quentin-en-Yvelines University (Université de Versailles Saint-Quentin-en-Yvelines) and the French National High-Performance Computing Agency (Grand Equipement National de Calcul Intensif) will combine to match Intel's contribution. This is Intel's first joint lab in Europe focused exclusively on high-performance computing. It will complement and extend Intel's existing high-performance computing research programs, investments and initiatives, including the Intel Academic Community Program and European Space Agency's "Mapping the Globe from Space" project.

"France has taken a leading role in driving high-performance computing research in Europe," said Steve Pawlowski, Intel senior fellow and general manager of Intel Architecture Group's central architecture and planning. "We chose to work with these three organizations because of their world-class software competency in exascale and high- performance computing."

The research agenda of the Exascale Computing Research Center will include integrating multi petaFLOPS systems, developing advanced performance optimization techniques, and collaborating with end users to optimize supercomputer performance in areas such as energy, seismology, computational fluid dynamics and health care.

The advent of exascale is expected to enable supercomputers to solve much more complex problems than today. For example in health care this capability should enable highly sophisticated genome calculations, enabling individualized patient treatment, or simulation of cell interactions to provide new cancer treatments. Another application can be found in seismology where exascale computing could enable more detailed prediction of ground movement at sites with high security requirements or where frequent movement is expected. In climate modeling, more accurate long-term forecasts and much more detailed local weather forecasts could be made.

The Exascale Computing Research Center will combine French research expertise and high-performance computing vision with Intel's leading products, technologies and experience in this area. The lab will employ about a dozen people initially and is expected to eventually grow to about three times that number.

Intel has a rich history of innovation and creativity in Europe with research and development programs encompassing areas such as chip design, software development, mobile communications and services, atomic-level chip research, development of key Intel products, and research on technologies that could help the aging population to lead healthier, better lives.

Intel's research and development efforts include Intel-owned labs focused on development of Intel products, joint research with European universities, open innovation and collaboration with industry and academia, participation in EU framework programs and cooperative standards development work with industry partners that deliver increased value and productivity to consumers.

About Intel Labs Europe
Intel R&D/Innovation in Europe is driven by a network of research labs, product labs and innovation labs spanning the region as well as a variety of Intel business units. Intel Labs Europe was formally established in early 2009 as the central means of coordinating activities across this diverse and extensive network, and to strengthen and improve Intel's alignment with European R&D. Today, Intel Labs Europe consists of 19 labs employing more than 900 research professionals.

About Intel
Intel (NASDAQ: INTC), the world leader in silicon innovation, develops technologies, products and initiatives to continually advance how people work and live. Additional information about Intel is available at www.intel.com/pressroom and blogs.intel.com.

Intel and the Intel logo are trademarks of Intel Corporation in the United States and other countries.

* Other names and brands may be claimed as the property of others.

— WebWireID108057 —

MOUNTAIN VIEW, Calif. - Actel Corporation (NASDAQ: ACTL) today announced several highly configurable DSP IP cores expanding the design creation capabilities for the RTAX2000D and RTAX4000D DSP FPGAs. The new cores enable designers to easily create common DSP functions such as filters (FIR, IIR) and transforms (FFT, IFT, DCT). Using a graphical user interface (GUI) embedded in Actel's Libero® Integrated Design Environment (IDE), the cores are targeted to RTAX-DSP space-flight FPGAs.

"By providing a simple but powerful user interface, these configurable DSP cores greatly simplify and shorten the design cycle for DSP applications targeting our new RTAX-DSP FPGAs for space-flight applications," said Ken O'Neill director, high reliability product marketing at Actel. "These new offerings expand the horizons of the RTAX series of FPGAs, which already have a well-established space-flight track record."
Actel's DSP IP Cores

The three new cores are supported through comprehensive software dialog windows allowing for the quick selection and configuration of multiple common DSP functions.

* Multiplier
* Multiplier with Adder or Subtractor
* Multiplier with Accumulator

The configurable DSP IP cores generate structural netlists in either Verilog or VHDL and can be easily instantiated into a complex RTAX-DSP FPGA design using Actel's Libero IDE and SmartDesign graphical block system design creation tool. Comprehensive handbooks are available to assist designers in building various DSP functions.

The IP cores take advantage of the embedded mathblocks available in RTAX-DSP devices. Each mathblock contains a fast 18-by-18 bit hardware multiplier, plus a 41-bit internal adder-subtractor and register that can be configured for accumulating multiplier results. The multiplier can be broken into two 9-by-9 multipliers when less precision and more multipliers are needed. A number of different pipelining options are available, with optional registers on all inputs and outputs. Mathblocks have cascade outputs and inputs so, for common applications like FIR filters, they may be chained for maximum performance, leaving FPGA fabric resources free. RTAX-DSP devices have up to 120 mathblocks, each of which can perform full-precision multiplications at up to 125 MHz and has built-in protection against radiation-induced single event upsets (SEU) and single event transients (SET).

Availability of the new IP cores marks another milestone in the introduction and support of the RTAX-DSP FPGA product family, which merges enhanced signal processing capabilities with the tried-and-trusted technology of the underlying RTAX architecture and process. This underscores Actel's commitment to provide designers of space-flight systems with the performance and reliability they need.
Pricing and Availability

The cores are available immediately and are included with an Actel Libero IDE Platinum software license, priced at $2495 per seat. Node-locked and floating licenses are available.

About Actel
Actel is the leader in low-power FPGAs and mixed-signal FPGAs, offering the most comprehensive portfolio of system and power management solutions. Power Matters. Learn more at www.actel.com.

— WebWireID107984 —

Infineon is the only ARM partner to have an ARM architecture license specifically for security applications. Under this agreement, Infineon is able to integrate its innovative security measures into the heart of the CPU core implementation, while maintaining compatibility with the standard ARM processor instruction set. This approach enables code reuse and access to the wide ARM development ecosystem. Infineon aims to have the first products in volume production by the second half of 2011, initially targeting the Multimedia SIM cards market. In addition, Infineon will combine the ARM architecture and its 'Integrity Guard' hardware security technology, designed for use in highly demanding chip card-based and security applications, in future products for high-end security segments.

'With this strategic cooperation, Infineon consequently follows its strategy to base its security products on its own cores. We will create proprietary security cores which combine our state-of-the-art security features along with the specific benefits of the ARM architecture, offering high performance, low power and the ARM ecosystem,' said Dr. Helmut Gassel, President of the Chip Card & Security Division at Infineon Technologies. 'In the forefront of hardware-based security developments, Infineon will continue to drive innovation, resulting in superior security products for the benefit of our customers.'

'Our agreement with Infineon is a clear demonstration of collaborative differentiation further extending the applicability of the ARM architecture to the most demanding security applications,' said Mike Inglis, EVP and GM, Processor Division, ARM. 'We continue to enjoy considerable success in the smartcard market with our SecurCore™ processors and our collaboration with Infineon is an element of our ongoing strategy to enable developers in the embedded security market to be able to utilize the ARM architecture in their future designs.'

ARM and Infineon look back on almost a decade of cooperation, mainly in wireless communication applications.

Together with energy efficiency and communication, security is one of the three focus areas of Infineon. Infineon is the number one chip card semiconductor vendor, with 25.5 percent of the worldwide market valued at US$2.4 billion in 2008. The company is contributing its quarter-century of security expertise to the effort to increase the security of today's solutions in communications, payment and banking, reliable identification of persons and goods, access protection for data and networks, and digital home entertainment electronics.

About ARM
ARM designs the technology that lies at the heart of advanced digital products, from wireless, networking and consumer entertainment solutions to imaging, automotive, security and storage devices. ARM's comprehensive product offering includes 32-bit RISC microprocessors, graphics processors, enabling software, cell libraries, embedded memories, high-speed connectivity products, peripherals and development tools. Combined with comprehensive design services, training, support and maintenance, and the company's broad Partner community, they provide a total system solution that offers a fast, reliable path to market for leading electronics companies. More information on ARM is available at http://www.arm.com.

About Infineon
Infineon Technologies AG, Neubiberg, Germany, offers semiconductor and system solutions addressing three central challenges to modern society: energy efficiency, communications, and security. In the 2008 fiscal year (ending September), the company reported sales of Euro 4.3 billion with approximately 29,100 employees worldwide. With a global presence, Infineon operates through its subsidiaries in the U.S. from Milpitas, CA, in the Asia-Pacific region from Singapore, and in Japan from Tokyo. Infineon is listed on the Frankfurt Stock Exchange (ticker symbol: IFX) and in the USA on the over-the-counter market OTCQX International Premier (ticker symbol: IFNNY). Further information is available at www.infineon.com

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PHOENIX -- The Avnet Electronics Marketing operating group of Avnet, Inc. (NYSE: AVT) and Fairchild Semiconductor (NYSE: FCS) are celebrating their 50-year alliance. The two companies commemorated their golden anniversary during a special award presentation in Phoenix on Friday, November 13th.

Over 50 years ago Fairchild Semiconductor began its history as a leading-edge innovator with the development of the planar transistor. Today, Fairchild is a global leader delivering energy-efficient power analog, power discrete and signal path solutions. Working together, the two companies have been providing high-performance semiconductor products and value-added services to the global power, interface, analog, mixed signal, logic, optoelectronic and configurable product markets.

Ed Smith, president of Avnet Electronics Marketing Americas, presented a 50-year commemorative award to Fairchild Semiconductor on behalf of the company. 'The electronics industry has seen many changes over the last half a century. Throughout, Avnet and Fairchild have worked together to provide the technology and services our customers need to make their visions a reality and in a faster and more efficient manner,' said Smith. 'We hope to continue helping our customers reach new heights with Fairchild well into the future.'

'Fairchild Semiconductor is proud to celebrate our 50-year partnership with Avnet. In 1959, the planar transistor marked the beginning of an industry revolution, and Fairchild became one of the first semiconductor lines at Avnet,' said Mark Norman, vice president, sales and marketing Americas, worldwide distribution for Fairchild Semiconductor. 'Avnet is still a valued partner today, and together we've maintained a long-term relationship, which is unique given the many changes in the industry over the past 50 years. Through this alliance, we're pleased to be able to continue to provide leading-edge semiconductor technology to drive energy-efficient electronic applications. We look forward to the next 50 years.'

— WebWireID107910 —

A fast, sensitive and inexpensive tool, MassCode Tags can be used to screen for specific pathogens that may be present in a biological sample. MassCode Tags are small molecules, each with a unique molecular weight. In MassTag PCR, individual tags are attached to DNA primers that correspond to microbial sequences. The primers are then used to amplify nucleic acid isolated from biological sample using PCR. The tags are released by applying UV irradiation, and mass spectroscopy is then used to identify the corresponding tags. The mass spectroscopy detection technique is highly multiplexed, faster and more sensitive than traditional detection technologies utilized for PCR analysis. Investigators at the Center for Infection and Immunity in the Mailman School of Public Health, Columbia University, developed the MassTag PCR application.

"By acquiring this technology and moving it forward, Agilent is creating a new solution that enables mid-range multiplex screening for the life science research market," said Gustavo Salem, Agilent vice president and general manager, Biological Systems Division. "This technology addresses a key need by reducing the cost to screen for a large number of pathogens that might be present in a given sample and will accelerate the life science research workflow."

"We are pleased that Agilent recognized the value of this technology and has made a commitment to ensuring that it will be available for public health research," said Ian Lipkin, M.D., John Snow professor of Epidemiology at Columbia University.

Dr. Lipkin, along with Dr. Thomas Briese, associate professor of Epidemiology at Columbia, have used this technology in their research to further innovative techniques of pathogen identification and discovery for unexplained respiratory infections, viral hemorrhagic fevers, and meningoencephalitis.

The patents Agilent has purchased cover differing aspects of the MassCode Tag technology and are valid in 34 countries including the United States, United Kingdom, Japan, and China.

— WebWireID107902 —

The new Agilent 33502A 2-channel 50 Vpp Isolated Amplifier is ideal for R&D development and test engineers who need signal sources greater than 20 Vpp without sacrificing accuracy. It also has a programmable pass-through mode for use in high-voltage applications including aerospace defense, automotive and industrial.

"Engineers in R&D and manufacturing need a convenient way to create accurate and reliable signal sources at higher voltages using their current function generators," said Gary Whitman, vice president and general manager of Agilent's System Products Division. "The Agilent 33502A extends their voltage range over 20 Vpp, which is important to engineers for testing and qualifying their designs and devices."

The Agilent 33502A has a fully isolated front end offering a superior 5x voltage amplification. It can be independently configured with input coupling (AC|DC) and input impedance (50?|1M?) to match specific circuits. The input path can also be switched from amplified to direct (unamplified) without removing or reconnecting cables. The 33502A has a two-unit, half-rack mechanical form factor, which fits well as a bench-top unit or in a test system, and is configured with LAN (LXI Class-C compliant) and USB interfaces. It also provides both a programmable interface and a soft-key-driven front panel, making it easy to configure.

U.S. Pricing and Availability

The Agilent 33502A 2-ch 50 Vpp Isolated Amplifier is available now and is priced at $2,600 for the base model.

High resolution images of the Agilent 33502A are available at www.agilent.com/find/33502A_images.

More information about the Agilent 33502A 2-ch 50 Vpp Isolated Amplifier is available at www.agilent.com/find/33502A.

— WebWireID107897 —

NEC will also continue to sell their existing SX vector processor-based products. A vector processor can perform a mathematical operation on several numbers simultaneously.

"Intel's substantial investment in the Intel architecture, including the development of processors, chipsets, software compilers and other related products has expanded the usages of Intel Xeon processors in both the volume and high-end HPC market segments," said Richard Dracott, general manager of Intel's High Performance Computing Group. "Now with NEC further innovating on Intel Xeon processor-based systems, Intel is poised to bring Intel Xeon processor performance to an even wider supercomputing audience."

"NEC's substantial experience in the development of vector processing systems, including vector pipeline management, memory sub-systems, and high speed interconnect technology is a natural fit for taking Intel architecture further into new markets ," said Fumihiko Hisamitsu, General manager of HPC Division at NEC. "NEC will enrich its HPC product portfolio through this collaboration as well as continuous enhancement of its vector supercomputer."

The initial focus of the companies' collaboration will be the development of hardware and software solutions to enhance the memory bandwidth and scalability of Intel Xeon processor-based platforms. Such enhancements are intended to benefit systems targeting not only the very high end of the scientific computing market segment, but also to benefit smaller HPC installations.

HPC or supercomputers are used by scientists, doctors, non-profit organizations and businesses such as oil and gas exploration to speed research and testing. Currently, about four out of five among the top 500 supercomputers have Intel processors inside.

About Intel
Intel (NASDAQ: INTC), the world leader in silicon innovation, develops technologies, products and initiatives to continually advance how people work and live. Additional information about Intel is available at www.intel.com/pressroom and blogs.intel.com.

About NEC Corporation
NEC Corporation is one of the world's leading providers of Internet, broadband network and enterprise business solutions dedicated to meeting the specialized needs of a diversified global base of customers. NEC delivers tailored solutions in the key fields of computer, networking and electron devices, by integrating its technical strengths in IT and Networks, and by providing advanced semiconductor solutions through NEC Electronics Corporation. The NEC Group employs more than 140,000 people worldwide. For additional information, please visit the NEC website at: www.nec.com.

Intel, Xeon and the Intel logo are trademarks of Intel Corporation in the United States and other countries.

* Other names and brands may be claimed as the property of others.

— WebWireID107838 —

"We're extremely pleased to have Doug join the Intel team," Otellini said. "His breadth of experience and legal expertise combined with his background in government are an outstanding fit for us."

Melamed, 63, was most recently a partner at WilmerHale, a global law firm where he was a leader in its Regulatory and Government Affairs Department and served as a member of the Antitrust and Competition Practice Group in the Washington, DC office. He joined the firm in 1971.

With more than 30 years experience, Melamed has an extensive background in all aspects of antitrust practice. He has secured clearance for major acquisitions in the merger clearance process, argued cases in the United States Supreme Court and other appellate courts, litigated in federal and state trial courts and before the Federal Trade Commission, and has counseled numerous firms on a wide range of antitrust matters.

Melamed served in the U.S. Department of Justice from October 1996 to January 2001 as acting assistant attorney general in charge of the Antitrust Division and as principal deputy assistant attorney general. While principal deputy, he was responsible for civil non-merger and merger investigations and litigation involving most of the division's litigating sections; the division's appellate matters; policy matters involving, among others, the communications, electricity and tobacco industries; and international antitrust enforcement matters.

Melamed has been an adjunct professor at the Georgetown University Law Center and has authored numerous articles on antitrust in addition to law and economics. He is a contributing editor of the Antitrust Law Journal and a member of the Board of Academic Advisors of the Journal of Law, Economics and Policy at George Mason University. He is also a member of the American Law Institute and the Yale University Council, and a past member of Sidwell Friends School's board of trustees.

About Intel
Intel (NASDAQ: INTC), the world leader in silicon innovation, develops technologies, products and initiatives to continually advance how people work and live. Additional information about Intel is available at www.intel.com/pressroom and blogs.intel.com.

Intel and the Intel logo are trademarks of Intel Corporation in the United States and other countries.

* Other names and brands may be claimed as the property of others.

— WebWireID107752 —

Milipitas, CA. Appro (http://www.appro.com), a leading provider of supercomputing solutions, today announces that it will support AMD's upcoming server platform, currently codenamed 'Maranello,' which is scheduled for availability in Q1 2010. AMD's upcoming server platform is expected to fit within the new G34 socket and feature the eight- and twelve-core AMD Opteron™ 6100 Series processor variant currently codenamed 'Magny-Cours'. Appro plans to showcase a technology sample of this new platform at the Supercomputing show in Portland, OR, booth # 1200, November 17-19, 2009.

Appro expects to refresh its dual and quad-socket performance optimized and power-efficient supercomputing building block server lines based on the next-generation 'Maranello' platform. Appro expects that its Hyper™ Cluster Series based on these new server platforms will offer the latest optimized technologies for HPC such as DDR3, quad 16-bit HyperTransport™ 3 technology links with up to 6.4 GT/s per link, and the AMD SR56x0 chipset with AMD-Vi technology and PCIe® Gen 2.

'Appro is proud to collaborate with AMD for the upcoming AMD Opteron 6100 Series processor-based server clusters solutions,' John Lee, VP of Advanced Technology Solutions of Appro. 'Working together, Appro and AMD provide industry-leading performance-per-watt capabilities to meet the demands of our High-Performance computing customers.'

'AMD and Appro have a commitment to delivering HPC solutions to customers that address both performance and energy efficiency, while continuing to push the envelope on scalability for critical workloads,' said Patrick Patla, vice president and general manager, Server/Workstation and Embedded division, AMD (NYSE: AMD). 'AMD's next-generation server technology is not only expected to deliver outstanding eight- and twelve-core performance, but also to adapt to evolving market demands. New enhancements, in addition to the inherent architectural advantages of the AMD Opteron processor, deliver advanced memory bandwidth and performance-per-watt, and allow customers to tackle important high performance computing applications with efficiency.'

— WebWireID107727 —

The spread of widescreen, high-definition content via digital broadcasts and high-definition video players has also driven improvements in the image quality and features of the camcorders that record the content. At the same time, camcorders are becoming smaller and lighter to improve mobility.
These demands have created an increasing need for high-performance electronic viewfinders, and in response Epson has developed a panel that can be used in LCD electronic viewfinders suitable for professional use.

Epson's new panel offers the resolution and fidelity needed to focus the image while providing a number of other benefits such as the ability to recreate smooth gradations and a natural softness. In addition, the use of a color filter prevents the color breakup that tends to occur with other color systems when shooting fast-moving subjects and while panning.

Epson has developed for many years HTPS panels to meet the high-definition, high-resolution needs of its market-leading projector business. This new panel adds another option to the ULTIMICRON series, which includes the previously-announced 0.47-inch SVGA panel. Epson will continue to offer new solutions for electronic viewfinders in digital interchangeable lens system cameras and camcorders, as well as for a variety of other applications such as head-mounted displays.
Features of the new panel

* Compact
o Small 0.52-inch diagonal screen ideal for electronic viewfinders in compact camcorders
* High resolution
o Enables accurate focusing
o QHD resolution (960 x RGB x 540, 1.56 megapixels)
o Excellent compatibility with full HD—exactly one-quarter the resolution
* Color filter
o Not affected by color breakup that occurs with fast-moving subjects and panning shots when using a field-sequential color system

New panel specifications
Name L3F05Q-80200
LCD type TN mode, organic alignment layer
Color display system Color filter (RGB stripe)
Effective pixels 960 x RGB x 540 (QHD)
Panel size (diagonal) 0.52 inch (1.3 cm)
Pixel pitch 12 µm (4 x RGB) x 12 µm
Displayable colors Approx. 16.77 million colors
Color space* 92% of sRGB
Contrast ratio 280:1
Backlight No
Surface luminance Depends on backlight

* When using standard Epson white LED
Related information

To learn more about the advantages of HTPS panels, visit:
http://www.epson.jp/e/products/device/htps/.
Product exhibition

The new panel will be on display at the International Broadcast Equipment Exhibition (Inter BEE 2009) to be held at Makuhari Messe, Chiba, Japan, from November 18 to 20. Epson will be at booth number 8205 in hall 8.

For sales enquiries, please locate your regional Epson electronic device sales office at:
http://www.epson.jp/device/e/device_worldwide.htm.

About Epson
Epson is a global imaging and innovation leader that is dedicated to exceeding the vision of customers worldwide through its compact, energy-saving, high-precision technologies, with a product lineup ranging from printers and 3LCD projectors for business and the home, to electronic and crystal devices.
Led by the Japan-based Seiko Epson Corporation, the Epson Group comprises over 70,000 employees in 106 companies around the world, and is proud of its ongoing contributions to the global environment and the communities in which it operates. http://www.epson.co.jp/e/

— WebWireID107653 —

In a joint statement the two companies commented, "While the relationship between the two companies has been difficult in the past, this agreement ends the legal disputes and enables the companies to focus all of our efforts on product innovation and development."

Under terms of the agreement, AMD and Intel obtain patent rights from a new 5-year cross license agreement, Intel and AMD will give up any claims of breach from the previous license agreement, and Intel will pay AMD $1.25 billion. Intel has also agreed to abide by a set of business practice provisions. As a result, AMD will drop all pending litigation including the case in U.S. District Court in Delaware and two cases pending in Japan. AMD will also withdraw all of its regulatory complaints worldwide. The agreement will be made public in filings with the Securities and Exchange Commission.

Editors Notes:
AMD will conduct a media and analyst call at 7am PST.
Participant Dial-In Number(s):
US/Canada Dial-In: (866) 766-4082
Int'l/Local Dial-In: (678) 401-0688
Conference ID: 1413480
*An audio webcast is also available

Intel will conduct a media and analyst call at 8am PST.
Participant Dial-In Number(s):
US/Canada Dial-in: (877) 236-2192
Int'l/Local Dial-In: (816) 249-4176
Conference ID: 41626993
*An audio webcast is also available at www.INTC.com

About AMD
Advanced Micro Devices (NYSE: AMD) is an innovative technology company dedicated to collaborating with customers and technology partners to ignite the next generation of computing and graphics solutions at work, home and play. For more information, visit http://www.amd.com.

About Intel
Intel (NASDAQ: INTC), the world leader in silicon innovation, develops technologies, products and initiatives to continually advance how people work and live. Additional information about Intel is available at www.intel.com/pressroom and blogs.intel.com.

Intel is a trademark of Intel Corporation in the United States and other countries.

* Other names and brands may be claimed as the property of others.

— WebWireID107643 —

In China, two ministries are involved in electronic passport programs: The Ministry of Public Security is responsible for citizens, the Ministry of Foreign Affairs for diplomats and government workers. Infineon is the only semiconductor supplier delivering into both of China's electronic passport projects.

All Chinese electronic passports include a security microcontroller in the back cover that stores, securely encrypted, the same information about the bearer's identity that is printed on the document, such as the bearer's name, date of birth, and photo, and the passport's validity period and number.

Special Administration Regions Hong Kong and Macao also use Infineon's security microcontrollers

Both China Special Administration Regions, Hong Kong and Macao, trust in Infineon and it's almost 25 years of expertise in security and contactless technology. Infineon is sole chip supplier for their electronic passport programs. Hong Kong, with its approximately nine million inhabitants, annually issued about 1.2 million electronic passports since 2007. And Macao, with its population of about 300,000, handed out about 100,000 electronic passports per year since the beginning of 2008. In addition, Infineon also exclusively supplies the security microcontrollers for Hong Kong's and Macao's National electronic Identity Cards issued to citizens as well as permanent and non-permanent residents since 2004. These identity cards enable identification and other services such as automatic border control and e-government.

'We are deeply honored by the trust awarded to Infineon by the Chinese Ministry of Public Security and the Ministry of Foreign Affairs as well as both the Hong Kong and Macao Special Administration Regions to be the silicon partner for their electronic passport programs,' said Dr. Helmut Gassel, President of the Chip Card & Security Division at Infineon Technologies. 'Security being a key area for Infineon we feel confirmed in our efforts to provide high-quality, superior security products that successfully passed the world's most stringent security tests.'

Infineon ranks number one in chips for card and security applications

Roughly every second electronic Government ID document (not including the China National ID card project) issued in 2008 incorporated a security chip of Infineon. Government ID applications include electronic documents, such as passports, national ID, health cards, drivers licenses and social security cards. Today, Infineon's products are used in the public domain of about one third of the 192 UN member states, which represent a total population of more than three billion people.

Infineon is the world's number one chip card semiconductor vendor, already for the twelfth year in a row. According to the US market research company Frost & Sullivan Infineon holds a 25.5 percent market share of the overall chip card IC (integrated circuit) market that totaled about US $2.4 billion in 2008.

Technical details on Infineon's security chip used in Chinese passports, the SLE 66CLX800PE

Specifically designed for use in electronic passports, identity cards, e-government cards and other high-security applications, the SLE 66CLX800PE security microcontroller features a crypto-coprocessor and provides advanced performance and high execution speeds of up to 848 kbits/s even if elevated encryption and decryption operations have to be calculated. The SLE 66CLX800PE features 80 kilobytes (kb) of EEPROM, 240 kb of ROM, and 6 kb of RAM. With its tailored set of EEPROM/ROM and RAM memory sizes, the SLE 66CLX800PE adheres to the ICAO requirements for the secure storage of the biometric and personal data in travel documents.

The SLE 66CLX800PE is certified according to Common Criteria EAL 5+ high (BSI-PP-0002 protection profile) security certification. Infineon's security microcontrollers build on underlying hardware-based integral security, with data encryption, memory firewall system and other security mechanisms to safeguard the privacy of data.

For more information on Infineon's semiconductor product portfolio for chip card and security applications, please go to www.infineon.com/security
About Infineon

Infineon Technologies AG, Neubiberg, Germany, offers semiconductor and system solutions addressing three central challenges to modern society: energy efficiency, communications, and security. In the 2008 fiscal year (ending September), the company reported sales of Euro 4.3 billion with approximately 29,100 employees worldwide. With a global presence, Infineon operates through its subsidiaries in the U.S. from Milpitas, CA, in the Asia-Pacific region from Singapore, and in Japan from Tokyo. Infineon is listed on the Frankfurt Stock Exchange (ticker symbol: IFX) and in the USA on the over-the-counter market OTCQX International Premier (ticker symbol: IFNNY).

— WebWireID107588 —

KAWASAKI, Japan, DUESSELDORF, Germany, NEC Electronics (TSE: 6723) today introduced its three new 16-bit All FlashTM microcontrollers (MCUs) with embedded IEEE802.15.4-compliant 2.4 gigahertz (GHz) radio frequency (RF) transceiver for ZigBee® RF4CE, an industry standard for remote control in consumer electronics. The new MCUs are ideal for RF remote control and provide the lowest level of power consumption in the industry. The three new MCUs come with 56 pins and 8x8mm quad flat no-leads (QFN) packages, and part numbers differ according to their flash memory capacity: the µPD78F8056 offers 64 kilobytes (KB) of flash memory, the µPD78F8057 has 96 KB, and the µPD78F8058 has 128 KB.
To support development tasks of the ZigBee RF4CE applications, NEC Electronics also provides a ZigBee RF4CE software development kit (SDK), which includes a ZigBee RF4CE stack library and a three-channel real-time sniffer, capable of simultaneously monitoring packets from the three RF4CE frequency channels, as well as an evaluation board with NEC Electronics' µPD78F8058 MCU.
To align with advanced digital TVs, set-top boxes (STBs), Blu-rayTM disc devices and other audio-visual (AV) home entertainment devices, radio frequency remote controls alleviates several shortcomings of infra-red remote controls, such as unidirectional communication and line-of-sight limitations. The two-way communication in RF4CE remote controls enables advanced home entertainment systems to support sophisticated features. By eliminating line-of-sight problems, AV systems can form networks of their own for command-and-control purpose, thereby enhancing the user's experience. Security features of the RF4CE standard authenticate legitimate devices and protect data exchanges within its network.
NEC Electronics began providing ZigBee-based solutions in 2004. To meet market expectations for RF remote control based on ZigBee RF4CE specifications, NEC Electronics developed these ultra-low-power MCUs integrated with a low-power IEEE802.15.4-compliant radio transceiver in one package. In addition to the RF4CE application, these MCUs also can be used for 802.14.5 wireless networking.

The primary features of the new MCUs are as follows:

* (1)Lowest level of power consumption in the industry
The new MCUs combine NEC Electronics' ultra-low-power 78K0R/Kx3-L 16-bit CPU and the ultra-low-power IEEE802.15.4 compliant 2.4 GHz RF transceiver with hardware MAC functions, realizing the lowest level of power consumption in the industry. These three offer current consumption of 18 milliamps (mA) during reception and 19 mA during transmission.
* (2)Flash EEPROM programmable and erasable at 1.8V
With a built-in voltage booster, NEC Electronics' new MCUs with radio connectivity allow applications to program and erase flash EEPROM at 1.8 V, offering longer lifetime with two dry batteries while counting frames and storing the non-volatile count values, which are key elements for security.
* (3)Development support
NEC Electronics' ZigBee RF4CE SDK includes a ZigBee RF4CE library, automatic transmission (AT) commands and its interpreter, and a three-channel real-time sniffer that can simultaneously observe packets in the three RF4CE frequency channels. An evaluation kit, which is comprised of an RF module board with an NEC Electronics µPD78F8058 MCU and a flash programming and debugging board, is also available for evaluation and prototyping.

NEC Electronics believes these new MCUs will contribute to the evolution of the next-generation remote-control functionality in consumer electronics.

Exhibition at Embedded Technology 2009
NEC Electronics' three new MCUs will be showcased in the company's booth at the Embedded Technology 2009 (ET 2009), to be held in Yokohama, Japan from November 18 to 21.

Pricing and Availability
Samples of the new chips are currently available and pricing varies depending on memory capacity. For example, the unit price of the µPD78F8058 MCU with 128 KB of flash memory and 8 KB of RAM is priced at US$5 each. Mass production is scheduled to begin in the first half of 2010, and is expected to reach a monthly production of 1,200,000 units by 2011. A ZigBee RF4CE SDK and evaluation kit are also available now. More information about NEC Electronics' extensive MCU product offerings can be found at here
(Pricing and availability are subject to change without notice.)

Please refer to the attachment for the main specifications of NEC Electronics' new MCUs.

About ZigBee
ZigBee: Control your world
ZigBee is the global wireless language connecting dramatically different devices to work together and enhance everyday life. The ZigBee Alliance is a non-profit association of more than 300 member companies driving development of ZigBee wireless technology. The Alliance promotes worldwide adoption of ZigBee as the leading wirelessly networked, sensing and control standard for use in consumer electronic, energy, home, commercial and industrial areas.
For more information, visit: www.ZigBee.org.

About ZigBee RF4CE
ZigBee RF4CE: More flexibility and control
The ZigBee RF4CE specification is based on IEEE 802.15.4. MAC/PHY radio technology in the 2.4GHz unlicensed frequency band and enables worldwide operation, low power consumption and instantaneous response time. It allows omni-directional and reliable two-way wireless communication, channel agility for enhanced co-existence with other 2.4GHz wireless technologies, simple secure set-up and configuration. For more details, visit www.zigbee.org/rf4ce.

About NEC Electronics

NEC Electronics Corporation (TSE: 6723) specializes in semiconductor products encompassing advanced technology solutions for the high-end computing and broadband networking markets; system solutions for the mobile handset, PC peripheral, automotive and digital consumer markets; and multi-market solutions for a wide range of customer applications. NEC Electronics Corporation has subsidiaries worldwide including NEC Electronics America, Inc. and NEC Electronics (Europe) GmbH. More information about NEC Electronics worldwide can be found at www.necel.com.

(Remarks)
All Flash is a trademark of NEC Electronics Corporation in Japan and other countries. SuperFlash memory technology used in NEC Electronics' 32-bit devices is licensed from Silicon Storage Technology Inc. SuperFlash is a registered trademark of Silicon Storage Technology in the U.S., Japan, and other countries. ZigBee is a registered trademark of the ZigBee Alliance. Blu-ray is a trademark of Blu-ray Disc Association. All other registered trademarks or trademarks are the property of their respective owners.

— WebWireID107585 —

IRVINE, Calif. - Broadcom Corporation (Nasdaq: BRCM), a global leader in semiconductors for wired and wireless communications, today announced that it is offering its BroadVoice® family of voice codecs royalty-free and without any licensing fees. As a direct response to customer demand for advanced, high-quality voice solutions and development tools, Broadcom is releasing its wideband and narrowband BroadVoice codecs in both floating-point and fixed-point C code as open source software under the GNU Lesser General Public License (LGPL), version 2.1, as published by the Free Software Foundation.

By eliminating the royalties and licensing fees (required by competitive solutions), Broadcom is driving a cost effective transition to HD voice-over IP (VoIP) applications by enhancing the quality of voice transmissions enabling a higher quality audio experience. The availability of BroadVoice source code, under an open source software license, provides the industry with maximum flexibility in how it can be deployed and has the potential of addressing a wide range of next generation voice-related applications.

Highlights/Key Facts:

-- Broadcom developed the BroadVoice family of voice codecs with two
variants including a 32 kb/s version called BroadVoice32 for wideband
(HD) speech sampled at 16 kHz, and a 16 kb/s version called BroadVoice16
for narrowband telephone-bandwidth speech sampled at 8 kHz.
-- BroadVoice advanced voice codecs reduce the latency, complexity and
bandwidth usage on a wide range of wideband and narrowband voice
applications including voice-over-cable, voice-over-DSL, Ethernet IP
phones, Wi-Fi® VoIP phones and software-based VoIP client solutions.
Additionally, for VoIP applications, distortion and echo are also
reduced.
-- BroadVoice is available on Broadcom's cable, DSL and VoIP
system-on-a-chip (SoC) solutions enabling manufacturers and service
providers to improve the customer's audio experience.
-- When standardized by SCTE and ANSI, the BroadVoice16 and BroadVoice32
codecs are called BV16 and BV32, respectively. BV16 is a standard codec
in PacketCable™ 1.5, PacketCable 2.0, ANSI/SCTE 24-21 2006, and ITU-T
Recommendation J.161 specifications. BV32 is a standard codec in
PacketCable 2.0, ANSI/SCTE 24-23 2007, and ITU-T Recommendation J.361
specifications.
-- The real-time transport protocol (RTP) payload formats for BroadVoice16
and BroadVoice32 are specified in RFC4298.
-- BroadVoice16 and BroadVoice32 have very similar codec structures. Both
variants share most of the algorithm modules so when implemented
together, substantial code sharing and memory reduction can be achieved.
-- Broadcom is providing both the floating-point and fixed-point C source
code of BroadVoice16 and BroadVoice 32 under an open source license
(LGPL version 2.1) and on a royalty-free basis.

-- For more technical information on BroadVoice codecs, or to download the
BroadVoice open source C code, please visit:
http://www.broadcom.com/broadvoice.

Supporting Quotes:

Norm Bogen, VP Research, Digital Entertainment, In-Stat

"Widespread deployment of HD VoIP is being inhibited by high cost. Broadband operators are looking for cost-effective ways to upgrade infrastructure and customer premises equipment to support enhanced voice services. By eliminating cost as a major constraint, the adoption of HD voice services should grow significantly, enabling service providers to significantly enhance the audio experience for their subscribers."

Dan Marotta, Senior Vice President & General Manager, Broadcom's Broadband Communications Group

"We are seeing an increase in the number of requests for HD voice support from service providers who want to differentiate their telephony services from their competition. By offering high performance and highly efficient BroadVoice voice codecs royalty-free, we are enabling manufacturers and service providers to transition to HD VoIP as a means to significantly improve their customers' audio experience."

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About Broadcom

Broadcom Corporation is a major technology innovator and global leader in semiconductors for wired and wireless communications. Broadcom products enable the delivery of voice, video, data and multimedia to and throughout the home, the office and the mobile environment. We provide the industry's broadest portfolio of state-of-the-art system-on-a-chip and software solutions to manufacturers of computing and networking equipment, digital entertainment and broadband access products, and mobile devices. These solutions support our core mission: Connecting everything®.

Broadcom is one of the world's largest fabless semiconductor companies, with 2008 revenue of $4.66 billion, and holds over 3,650 U.S. and over 1,450 foreign patents, more than 7,750 additional pending patent applications, and one of the broadest intellectual property portfolios addressing both wired and wireless transmission of voice, video, data and multimedia.

A FORTUNE 500® company, Broadcom is headquartered in Irvine, Calif., and has offices and research facilities in North America, Asia and Europe. Broadcom may be contacted at +1.949.926.5000 or at www.broadcom.com.

Cautions regarding Forward Looking Statements:

All statements included or incorporated by reference in this release, other than statements or characterizations of historical fact, are forward-looking statements. These forward-looking statements are based on our current expectations, estimates and projections about our industry and business, management's beliefs, and certain assumptions made by us, all of which are subject to change. Forward-looking statements can often be identified by words such as "anticipates," "expects," "intends," "plans," "predicts," "believes," "seeks," "estimates," "may," "will," "should," "would," "could," "potential," "continue," "ongoing," similar expressions, and variations or negatives of these words. Examples of such forward-looking statements include, but are not limited to, the demand for high definition VoIP applications, our position in that market, and the use of Broadcom BroadVoice wideband and narrowband voice codecs. These forward-looking statements are not guarantees of future results and are subject to risks, uncertainties and assumptions that could cause our actual results to differ materially and adversely from those expressed in any forward-looking statement.

Important factors that may cause such a difference for Broadcom in connection with the BroadVoice16 and BroadVoice32 voice codecs include, but are not limited to:

-- intellectual property disputes, customer indemnification claims, and
other types of litigation risk;
-- potentially longer than expected time to see significant growth of HD
voice services;

-- potential reduction of the expected enhancement of audio experience
caused by other system impairments unrelated to voice codec.

Additional factors that may cause Broadcom's actual results to differ materially from those expressed in forward-looking statements include, but are not limited to the list that can be found at http://www.broadcom.com/press/additional_risk_factors/Q42009.php.

Our Annual Report on Form 10-K, subsequent Quarterly Reports on Form 10-Q, recent Current Reports on Form 8-K, and other Securities and Exchange Commission filings discuss the foregoing risks as well as other important risk factors that could contribute to such differences or otherwise affect our business, results of operations and financial condition. The forward-looking statements in this release speak only as of this date. We undertake no obligation to revise or update publicly any forward-looking statement, except as required by law.

Broadcom, the pulse logo, Connecting everything, the Connecting everything logo and BroadVoice® are among the trademarks of Broadcom Corporation and/or its affiliates in the United States, certain other countries and/or the EU. Any other trademarks or trade names mentioned are the property of their respective owners.

— WebWireID107408 —

The market for wireless communications has exploded over the last several years, as key features such as real-time streaming audio/video as well as increased power efficiencies are not only expected, but demanded by savvy consumers. The wireless space has never been more critical and complex for SoC designers as they navigate the maze of new protocols and market changes, especially in the 3G/4G, WiMAX, base station and femtocell segments.

Presenters Mark Throndson, MIPS Technologies Director of Product Marketing, and Frank Ferro, Sonics Director of Business Development, will discuss how SoC designers can stay competitive with wireless communications designs.

For more information and to register for the event, visit http://www.techonline.com/learning/webinar/220800125.

About Sonics, Inc.

Sonics is a pioneer of network-on-chip (NoC) technology and today offers SoC designers the largest portfolio of intelligent, on-chip communications solutions. Sonics' products optimize memory access, seamlessly manage on-chip network traffic, accelerate system performance and reduce power consumption in SoCs with advanced voice, data and video features-including those found in home entertainment, networking, wireless and mobile devices. With a broad array of silicon-proven IP, Sonics helps designers eliminate memory bottlenecks associated with complex, high-speed SoC design, streamline and unify data flows and solve persistent network challenges in embedded systems with multiple cores. As the leading supplier of on-chip communications networks for the embedded market, Sonics has enabled its customers, including semiconductor leaders Broadcom Corporation, Samsung, Texas Instruments and Toshiba, to ship more than 500 million units worldwide. Founded in 1996, Sonics is headquartered in Milpitas, California with offices worldwide. For more information, please visit www.sonicsinc.com and www.sonicsinc.com/blog.

About MIPS Technologies, Inc.

MIPS Technologies, Inc. (Nasdaq: MIPS) is a leading provider of industry-standard processor architectures and cores that power some of the world's most popular products for the home entertainment, communications, networking and portable multimedia markets. These include broadband devices from Linksys, DTVs and digital consumer devices from Sony, DVD recordable devices from Pioneer, digital set-top boxes from Motorola, network routers from Cisco, 32-bit microcontrollers from Microchip Technology and laser printers from Hewlett-Packard. Founded in 1998, MIPS Technologies is headquartered in Sunnyvale, California, with offices worldwide. For more information, contact (408) 530-5000 or visit www.mips.com.

— WebWireID107394 —

AUSTIN, Texas - Freescale Semiconductor is introducing a mini USB interface IC that helps mobile device designers and manufacturers create smaller, sleeker consumer products by enabling a single mini USB connector for external accessories including chargers, headsets, microphones and audio/data connections.

In addition to saving valuable board space by eliminating the need for multiple connections, the MC34825 analog IC also lowers power consumption and extends battery life by supporting all-passive audio accessories such as stereo audio, microphone and cord remote control functionality.

'The MC34825 leverages Freescale's 15 years of experience in delivering portable power management solutions that help our customers differentiate in competitive consumer electronics markets,' said Scott Ward, vice president and general manager of Freescale's Analog, Mixed-Signal & Power Division. 'This IC helps consumer device manufacturers give consumers what they want – smaller form factors and a single connection that eliminates the need for multiple adapters and cords.'

Applications for the MC34825 include smartbooks, netbooks, eBooks, mobile phones, smartphones, portable media players, portable navigation devices, digital still cameras and camcorders.

The MC34825 uses intelligent switching to identify up to 32 different accessory types, such as headsets, microphones and chargers. It automatically identifies the attachment and informs the host system, switching the signal or setting the charge current based on the plugged-in charger.

As a universal charging solution, the MC34825 supports multiple charger types including AC, DC and USB. The IC identifies the battery charger type and sets the charge current level accordingly. Additional battery charging features include up to 28V OVP for the VBUS power input, ultra low operating current (less than 10uA at standby), a power-save mode and automatic detachment detection.

Availability and pricing
The MC34825 USB interface IC is available now from Freescale and its distributors. Suggested resale pricing for the MC34825 is 82 cents (USD) in 10,000-piece quantities.

About Freescale Semiconductor
Freescale Semiconductor is a global leader in the design and manufacture of embedded semiconductors for the automotive, consumer, industrial and networking markets. The privately held company is based in Austin, Texas, and has design, research and development, manufacturing or sales operations around the world. www.freescale.com.

— WebWireID107336 —

Projector applications continue to expand. In addition to being used for business presentations, projectors are gaining wider use in the classroom, in auditoriums and at big events. Meanwhile, demand for high-performance products is expected to grow as more and more households enjoy full HD content via digital broadcasts and high definition video players.
With a resolution of nearly 8.85 megapixels, 4K panels offer four times the resolution of full HD (1920 × 1080), making them ideal for the high resolutions required by special applications such as industrial design, architectural design and simulations, as well as for presentations and projecting four full HD images at the same time.

To meet this market demand, Epson employed the latest process and C2 Fine technologies in the new panels and developed a new, original driving method optimized for 4K resolution to achieve high-resolution projected images with outstanding brightness and contrast.
Epson is committed to supporting the growing range of projector applications by combining its original technologies to expand and enhance its HTPS lineup with panels that further raise the performance of 3LCD projectors.

* Source: Epson research, as of the end of October 2009
Panel features

* High-resolution 4K-compatible
o 1.64": 4K (4096 x 2160 pixels) - the world's first 4K HTPS panel*
* Includes Epson's original LCD driver optimized for 4K resolution
* Benefits of using C2 Fine:
1. High contrast
2. Smooth images
3. Jet-black color reproduction

* C2Fine: An original Epson technology for achieving high-quality, vivid images with high contrast by combining an inorganic liquid crystal alignment layer with vertical alignment technology
Panel specification
LCD type C2 Fine (VA inorganic alignment layer)
Process technology D7
Effective pixels 4096 x 2160
Panel size (diagonal) 1.64 inch (4.2 cm)
Pixel pitch 9 µm
Related information

To learn more about the advantages of HTPS panels, visit:
http://www.epson.jp/e/products/device/htps/.

To learn more about 3LCD technology, visit:
http://www.3lcd.com/.New window
Product exhibition

Epson will show ultra-high resolution images including 3D when it exhibits a prototype ultra-high resolution projector using the panel at the International Broadcast Equipment Exhibition (Inter BEE 2009) to be held at Makuhari Messe, Chiba, Japan, from November 18 to 20.

About Epson
Epson is a global imaging and innovation leader that is dedicated to exceeding the vision of customers worldwide through its compact, energy-saving, high-precision technologies, with a product lineup ranging from printers and 3LCD projectors for business and the home, to electronic and crystal devices.
Led by the Japan-based Seiko Epson Corporation, the Epson Group comprises over 70,000 employees in 106 companies around the world, and is proud of its ongoing contributions to the global environment and the communities in which it operates. http://www.epson.co.jp/e/

— WebWireID107289 —

1. Reason for the Changes
In accordance with the plan to integrate business operations at NEC Electronics and Renesas (the "Business Integration"), the five companies announced on September 16 that Renesas will issue shares of Renesas common stock to Hitachi and Mitsubishi Electric, the sole shareholders of Renesas before the effective date of the Business Integration (the "Pre-merger Capital Injection"). In addition, after the scheduled date of the Business Integration, April 1, 2010, the new integrated company after the Business Integration (the "Integrated Company") will issue shares of its common stock to NEC, Hitachi and Mitsubishi Electric (the "Post-merger Capital Injection").
The five companies also announced that the amount of the Pre-merger Capital Injection could be reduced and the amount of the Post-merger Capital Injection could be increased depending on the business result of NEC Electronics for the first half of the fiscal year ending March 31, 2010.
Today's changes were made in due to NEC Electronics' financial results, which were settled today, November 9, 2009. The changes in Post-merger Capital Injection were resolved at NEC Electronics' meeting of the Board of Directors held earlier today.

2. Outline of the Changes
The changes are underlined.

2.1 Outline of reinforcement of capital
As a condition to the Business Integration, Renesas will issue shares of Renesas common stock to Hitachi and Mitsubishi Electric, the sole shareholders of Renesas, in exchange for an aggregate of 71.7 billion yen before the effective date of the Business Integration (including shares issued on September 29, 2009 in exchange for an aggregate of 55.0 billion yen). In addition, on the effective date of the Business Integration (scheduled to be April 1, 2010), the Integrated Company will issue shares of its common stock to NEC, Hitachi and Mitsubishi Electric in exchange for an aggregate of approximately 134.6 billion yen.

2.2 Outline of the third-party allotment of new shares after Business Integration

2.2.1 Outline of Post-merger Capital Injection
(1) Issuer Renesas Electronics Corporation (Tentative name)
(2) Date of issuance April 1, 2010 (Note 1)
(3) Number of new shares to be issued 146,782,990 of common shares
(4) Issue price 917 yen
(5) Total proceeds 134,600,001,830 yen
(6) Purchaser Purchaser
(EC: 61,395,857shares,
Hitachi: 46,962,923shares,
Mitsubishi Electric: 38,424,210shares)
(7) Others None
(Note 1)
The new shares will be issued at the same date as the effective date of the Business Integration. The schedule is subject to change based upon the effective date of the Business Integration.
(Note 2)
In accordance with Art. 124 §4 of the Corporation Law, on the day of the ordinary shareholders meeting of the Integrated Company which is scheduled to be held in June 2010, NEC, Hitachi and Mitsubishi Electric will acquire voting rights of the new Integrated Company.

2.2.2 Major stockholders and ownership ratio of Renesas Electronics Corporation after the execution of the Business Integration and the third-party allotment
NEC Corporation 33.97%
Hitachi, Ltd. 30.62%
Mitsubishi Electric Corporation 25.05%
Japan Trustee Services Bank, Ltd. (Note) 1.49%
(Trust Account from The Sumitomo Trust and Banking Co., Ltd. for retirement benefit Trust Account of NEC Corporation)
(Note)
1.49% of shares which are owned by Japan Trustee Services Bank, Ltd. (Re-trust of The Sumitomo Trust and Banking Co., Ltd./NEC Corporation pension and severance payments Trust Account) were shares that were contributed by NEC as severance indemnities trusts. The voting rights of such shares will be exercised at the instruction of NEC.

About NEC Electronics

NEC Electronics Corporation (TSE: 6723) specializes in semiconductor products encompassing advanced technology solutions for the high-end computing and broadband networking markets; system solutions for the mobile handset, PC peripheral, automotive and digital consumer markets; and multi-market solutions for a wide range of customer applications. NEC Electronics Corporation has subsidiaries worldwide including NEC Electronics America, Inc. and NEC Electronics (Europe) GmbH. More information about NEC Electronics worldwide can be found at www.necel.com.

About Renesas Technology Corp.

Renesas Technology Corp. is the world's No.1 supplier of microcontrollers and one of the world's leading semiconductor system solutions providers for mobile, automotive and PC/AV (Audio Visual) markets. It is also a leading provider of Power MOSFETs, Smart Card microcontrollers, RF-ICs, High Power Amplifiers, Mixed Signal ICs, System-on-Chip (SoC), System-in-Package (SiP) and more. Established in 2003 as a joint venture between Hitachi, Ltd. (TSE:6501, NYSE:HIT) and Mitsubishi Electric Corporation (TSE:6503), Renesas Technology achieved consolidated revenue of 702.7 billion JPY in FY2008 (end of March 2009). Renesas Technology is based in Tokyo, Japan and has a global network of manufacturing, design and sales operations in 16 countries with 25,000 employees worldwide. For further information, please visit http://www.renesas.com

About NEC Corporation

NEC Corporation is one of the world's leading providers of broadband network and enterprise business solutions dedicated to meeting the specialized needs of a diversified global base of customers. NEC delivers tailored solutions in the key fields of computer, networking and electron devices, by integrating its technical strengths in IT and Networks, and by providing advanced semiconductor solutions through NEC Electronics Corporation. The NEC Group employs more than 140,000 people worldwide. For additional information, please visit the NEC website at: http://www.nec.com.

About Hitachi

Hitachi, Ltd., (NYSE: HIT / TSE: 6501), headquartered in Tokyo, Japan, is a leading global electronics company with approximately 400,000 employees worldwide. Fiscal 2008 (ended March 31, 2009) consolidated revenues totaled 10,000 billion yen ($102.0 billion). The company offers a wide range of systems, products and services in market sectors including information systems, electronic devices, power and industrial systems, consumer products, materials, logistics and financial services. For more information on Hitachi, please visit the company's website at http://www.hitachi.com.

About Mitsubishi Electric

With over 80 years of experience in providing reliable, high-quality products to both corporate clients and general consumers all over the world, Mitsubishi Electric Corporation (TOKYO: 6503) is a recognized world leader in the manufacture, marketing and sales of electrical and electronic equipment used in information processing and communications, space development and satellite communications, consumer electronics, industrial technology, energy, transportation and building equipment. The company recorded consolidated group sales of 3,665.1 billion yen (US$ 37.4 billion*) in the fiscal year ended March 31, 2009. For more information visit http://global.mitsubishielectric.com
*At an exchange rate of 98 yen to the US dollar, the rate given by the Tokyo Foreign Exchange Market on March 31, 2009.

— WebWireID107282 —

'We are very pleased that we successfully finalized this transaction with Golden Gate Capital. I am glad to see our former WLC division well prepared and supported to take a leadership position in its core market. As Infineon, we actively assist a smooth transition process for our joint customers and partners from Infineon to Lantiq', said Peter Bauer, CEO of Infineon Technologies. 'This transaction is a positive example for our efforts to stronger focus our R&D investments in our lead business segments. Infineon will continue to drive its leading technological position in the three key sectors energy efficiency, communications and security.'

The new company, Lantiq, is a fabless semiconductor company with over 20 years of experience in Wireline communication and a strong technical foundation with over 800 patent families. Lantiq will continue to drive innovation for the Next-Generation Access and Home Networks.

'It is an exciting day and an important milestone for Lantiq. We are looking forward to developing our market presence further and serving our customers even better by enhancing our product portfolio', said Christian Wolff, CEO of Lantiq. 'Lantiq's recently announced first acquisition in the Home Networking segment shows our focus and commitment to the wireline communication market.'

The sale of Infineon WLC to Golden Gate Capital was announced in July this year. The final purchase price will amount to approximately EUR 243 Million resulting from customary adjustments in the asset purchase agreement with Golden Gate Capital. Infineon is expected to record a book gain of more than Euro 100 Million as a result of this transaction in the first quarter of its fiscal year ending September 30, 2010.

Lantiq is a market leader in the broadband access market and has approximately 900 employees around the globe. It is among the world's Top 15 fabless semiconductor companies and fifth largest among the companies headquartered in Europe.

About Lantiq
Lantiq offers a broad and innovative product portfolio for Next Generation Networks and the Digital Home. The company employs about 900 people in Europe, North America and the Asia Pacific region. Headquartered in Neubiberg, Germany, Lantiq specializes on broadband communications, encompassing analog, digital and mixed-signal ICs along with comprehensive software suites. Lantiq is a fabless company, and its semiconductor solutions are deployed by major carriers and in home networks in every region of the world. Further information is available at www.Lantiq.com

About Infineon
Infineon Technologies AG, Neubiberg, Germany, offers semiconductor and system solutions addressing three central challenges to modern society: energy efficiency, communications, and security. In the 2008 fiscal year (ending September), the company reported sales of Euro 4.3 billion with approximately 29,100 employees worldwide in continuing operations. With a global presence, Infineon operates through its subsidiaries in the U.S. from Milpitas, CA, in the Asia-Pacific region from Singapore, and in Japan from Tokyo. Infineon is listed on the Frankfurt Stock Exchange (ticker symbol: IFX) and in the USA on the over-the-counter market OTCQX International Premier (ticker symbol: IFNNY). Further information is available at www.infineon.com.

— WebWireID107203 —