WebWire | News by Industry : Semiconductors

Architect Labs Unveils Redwood: The World's First Fully AI-Designed AI Chip That Runs AI Models

Thu, 27 Aug 2026 13:28:04 EDT

Architect Labs announced today that its AI system generated and fully verified, end-to-end from a human-written specification, a production-worthy AI accelerator called Redwood. With only two human architects writing the architectural specification, the AI system designed and fully verified the chip in under two weeks, while also co-designing the firmware, custom kernels, and mapping modern AI models to the chip. The AI accelerator is currently deployed on an FPGA platform, running infer...

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Commercialization of a New Negative Thermal Expansion Filler that Suppresses Warpage of Semiconductor Packages　—Launch of "M-Filleris™ NTE," a new material that contributes to thermal management of semiconductors—

Thu, 27 Aug 2026 13:19:21 EDT

Mitsubishi Chemical Corporation (Head Office: Chiyoda-ku, Tokyo, President: Manabu Chikumoto, hereinafter referred to as “the Company”) has decided to commercialize a new negative thermal expansion filler* developed for semiconductor packaging materials. We will begin selling pilot products by the end of FY2026, proceed with customer evaluations and certifications, and launch sales of mass produced products in the second half of FY2027. - - *Filler that contracts when heated. - - The newly...

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STMicroelectronics and NUS launch Corporate Lab to power the future of Edge AI in Singapore

Mon, 24 Aug 2026 11:22:43 EDT

- - • HELIX joint R&D initiative to enable new generative and embodied AI use cases at the edge through system-to-silicon innovation - • Research will focus on memory-centric architectures, innovative in-memory computing, scalable compute-and-memory systems, and advanced silicon and embedded-memory technologies - • Corporate Lab will strengthen Singapore's advanced semiconductor research capabilities and support the development of future edge AI talent and innovation - - - STMicroelectroni...

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MHI-AC&R Develops and Launches “N-Bleath“ Compact Ultra-Low Temperature Brine Chiller Using Nitrogen Refrigerant - -- Electric Turbo from MHIET Allows for Compactness and High Efficiency --

Sat, 22 Aug 2026 11:30:43 EDT

- Using the natural refrigerant nitrogen helps protect the ozone layer and curb global warming, and being PFAS-free reduces the environmental impact - The compact electric turbo provides both weight reduction and high energy-saving performance, improving the energy-saving performance of N-Bleath - - Mitsubishi Heavy Industries Air-Conditioning & Refrigeration Corporation (MHI-AC&R), a part of Mitsubishi Heavy Industries (MHI) Group, has developed N-Bleath,(Note1) a compact brine chiller th...

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Commercialization of Ultra-High-Purity Colloidal Silica for State-of-the-Art Semiconductors —New production facilities to be established at Kyushu Plant (Fukuoka Area)—

Thu, 20 Aug 2026 09:38:44 EDT

Mitsubishi Chemical Corporation (Head Office: Chiyoda-ku, Tokyo; President: Manabu Chikumoto; hereinafter “the Company”) hereby announces that it has decided to commercialize ultra-high-purity colloidal silica (hereinafter “the Product”) for use as a raw material for polishing agents in cutting-edge semiconductors. The Company plans to establish new production facilities at its Kyushu Plant (Fukuoka Area) in Kitakyushu City, Fukuoka Prefecture, and begin commercial operations there in Octo...

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Henkel launches LOCTITE ABLESTIK CDF900 series conductive die attach film

Thu, 20 Aug 2026 07:59:33 EDT

Henkel Adhesive Technologies announced the launch of Loctite ABLESTIK CDF900, its next-generation conductive die attach film (cDAF) series, at SEMICON Taiwan 2026. Delivering thermal conductivity exceeding 8 W/m-K, the new material is designed to help semiconductor manufacturers overcome rising thermal and stress challenges in AI, 5G and emerging 6G telecommunications, and high-performance computing (HPC) applications. - - As AI, HPC, and next-generation communications drive higher chip fre...

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