'We are very pleased that we successfully finalized this transaction with Golden Gate Capital. I am glad to see our former WLC division well prepared and supported to take a leadership position in its core market. As Infineon, we actively assist a smooth transition process for our joint customers and partners from Infineon to Lantiq', said Peter Bauer, CEO of Infineon Technologies. 'This transaction is a positive example for our efforts to stronger focus our R&D investments in our lead business segments. Infineon will continue to drive its leading technological position in the three key sectors energy efficiency, communications and security.'

The new company, Lantiq, is a fabless semiconductor company with over 20 years of experience in Wireline communication and a strong technical foundation with over 800 patent families. Lantiq will continue to drive innovation for the Next-Generation Access and Home Networks.

'It is an exciting day and an important milestone for Lantiq. We are looking forward to developing our market presence further and serving our customers even better by enhancing our product portfolio', said Christian Wolff, CEO of Lantiq. 'Lantiq's recently announced first acquisition in the Home Networking segment shows our focus and commitment to the wireline communication market.'

The sale of Infineon WLC to Golden Gate Capital was announced in July this year. The final purchase price will amount to approximately EUR 243 Million resulting from customary adjustments in the asset purchase agreement with Golden Gate Capital. Infineon is expected to record a book gain of more than Euro 100 Million as a result of this transaction in the first quarter of its fiscal year ending September 30, 2010.

Lantiq is a market leader in the broadband access market and has approximately 900 employees around the globe. It is among the world's Top 15 fabless semiconductor companies and fifth largest among the companies headquartered in Europe.

About Lantiq
Lantiq offers a broad and innovative product portfolio for Next Generation Networks and the Digital Home. The company employs about 900 people in Europe, North America and the Asia Pacific region. Headquartered in Neubiberg, Germany, Lantiq specializes on broadband communications, encompassing analog, digital and mixed-signal ICs along with comprehensive software suites. Lantiq is a fabless company, and its semiconductor solutions are deployed by major carriers and in home networks in every region of the world. Further information is available at www.Lantiq.com

About Infineon
Infineon Technologies AG, Neubiberg, Germany, offers semiconductor and system solutions addressing three central challenges to modern society: energy efficiency, communications, and security. In the 2008 fiscal year (ending September), the company reported sales of Euro 4.3 billion with approximately 29,100 employees worldwide in continuing operations. With a global presence, Infineon operates through its subsidiaries in the U.S. from Milpitas, CA, in the Asia-Pacific region from Singapore, and in Japan from Tokyo. Infineon is listed on the Frankfurt Stock Exchange (ticker symbol: IFX) and in the USA on the over-the-counter market OTCQX International Premier (ticker symbol: IFNNY). Further information is available at www.infineon.com.

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KAWASAKI (Japan), DUESSELDORF and DORTMUND (Germany) - ELMOS Semiconductor AG (FSE: ELG) and NEC Electronics (TSE: 6723) today announced the availability of its four new single-chip IO-Link solutions for IO-Link slave applications. This project is based on a close cooperation with TMG-Karlsruhe. The new IO-Link solutions combine NEC Electronics' All Flash™ 78K0R 16-bit microcontroller and ELMOS IO-Link transceiver, with integrated IO-Link slave protocol stack in a single package. The part numbers differ according to their flash memory capacity; uPD78F8040 offers 32 kilobytes (KB), uPD78F8041 offers 64 KB, uPD78F8042 offers 96 KB, and uPD78F8043 offers 128 KB of flash memory.

IO-Link is the preferred standard serial digital communications protocol used for sensors and actuators in industrial automation systems. IO-Link offers the following advantages:

* Compatible integration into existing fieldbus or Industrial Ethernet environment
* Process, parameter and diagnosis data in one cable
* compatible cabling to existing sensor communication

One key advantage of using the IO-Link slave protocol stack offered with the NEC Electronics' solutions is that minor upgrades could be included if the IO-Link specification is enhanced, significantly reducing development time and effort. Alternatively, designers can opt to develop and maintain their own software stacks. The ELMOS transceiver integrates significant analogue components, which enable system designers to eliminate use of additional external components and develop a complete IO-Link slave product at low cost.

NEC Electronics provides extensive product range to include a choice of memory variants all in the same device package. Developers can choose from 4 pin-compatible memory configurations in an 8mm x 8mm 56-pin QFN package making it easy to switch to a larger memory if more software is needed. Flash sizes from 32 KB to 128 KB will be available. This also allows developers to use the same PCB for multiple designs even though different amounts of software may be required. A 32 KB device can easily be replaced by a 128 KB device without having to re-design the PCB.

To support system designers in using the IO-Link single-chip solution, NEC Electronics and ELMOS can also provide a comprehensive development kit at lower cost than most of the other kits in the market. The 78K0R Link-It! kit is available now.

The IO-Link market is now beginning to show real promise and ELMOS and NEC Electronics are working with several vendors some of whom are already engaged in development projects. ELMOS and NEC Electronics are well placed to enable system designers to quickly and easily achieve differentiated designs using the only single-chip IO-Link solution available on the market

Availability

Samples of the new single-chip IO-Link solutions are available now. Mass production of the new devices is slated to begin in April 2010, with expected monthly mass production of 500,000 units. (Availability is subject to change without notice.)

More information about ELMOS and NEC Electronics' solutions for the industrial automation market can be found at http://www.elmos.de/german/produkte/know-how/io-link.html or http://www.eu.necel.com/iolink

(Remark)

All Flash is a trademark or registered trademark of NEC Electronics in Japan, America, Singapore, Hong Kong, UK, German, and China. NEC Electronics is a registered trademark or trademark of NEC Corporation. All other marks are property of their respective owners.

About ELMOS Semiconductor AG
ELMOS Semiconductor AG (FSE: ELG) is a leading developer and producer of customer-specific system solutions in the automotive sector. Based on the modular high-voltage CMOS technology, a great amount of analog mixed-signal circuitry elements such as voltage regulators, analog/digital converters, power-drives and NVM storage offer a huge range of integration possibilities for customers' ideas. In addition, MEMS-based sensor systems and dedicated packages both developed and manufactured within the ELMOS-Group, enable ELMOS to supply silicon-based microsystems. About 90 percent of sales are achieved with ASICs for automotive electronics. ELMOS is listed on the Prime Standard of the German Stock Exchange. For additional information about ELMOS Semiconductor, visit www.elmos.de.

About NEC Electronics Corporation
NEC Electronics Corporation (TSE: 6723) specializes in semiconductor products encompassing advanced technology solutions for the high-end computing and broadband networking markets; system solutions for the mobile handset, PC peripheral, automotive and digital consumer markets; and multi-market solutions for a wide range of customer applications. NEC Electronics Corporation has subsidiaries worldwide including NEC Electronics America, Inc. (www.am.necel.com) and NEC Electronics (Europe) GmbH (www.eu.necel.com). More information about NEC Electronics worldwide can be found at www.necel.com.

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SAN JOSE, Calif., Cadence Design Systems, Inc. (NASDAQ: CDNS), the leader in global design innovation, announced today that Exar Corporation (NASDAQ: EXAR) has signed an expanded business agreement to establish Cadence® as its leading chip planning and mixed-signal design solutions provider. As a result of the new multi-year agreement, the Cadence Virtuoso® and Encounter® platforms, as well as the Cadence Chip Planning Solution, will make up Exar's key mixed-signal design environment for designs at 65 nanometers and below.

'We have a longstanding relationship with Cadence as they have consistently provided the technology required for our project needs,' said George Apostol, senior vice president and CTO, Exar Corporation. 'We also believe that they have the technology leadership and outstanding technical support that is vital to helping us deliver highly differentiated silicon solutions to our customers. Cadence tools, especially for mixed-signal designs, are ideal for our forthcoming data communications, storage, interface and power-management products.'

With the new agreement, Exar has chosen the Cadence Virtuoso platform for its analog and custom design and implementation technology. Additionally, the company will use Cadence Multi-mode Simulation technology for RF, FastSpice, and mixed-signal simulations. Exar will use the Cadence Encounter Digital Implementation System for digital design prototyping and floorplanning. And lastly, Exar has adopted the Cadence Chip Planning Solution as the standard for its IC conceptualization, analysis, and planning activities across the organization.

'Companies like Exar succeed through their ability to create highly differentiated designs, and are justifiably selective when it comes to the partners with whom they entrust their design flows,' said Steve Carlson, vice president of marketing at Cadence. 'Cadence welcomes the opportunity for a long-term relationship with Exar, and we look forward to helping them further distinguish their products through technical innovation and rapid market introduction.'

About Cadence
Cadence enables global electronic design innovation and plays an essential role in the creation of today's integrated circuits and electronics. Customers use Cadence software and hardware, methodologies, and services to design and verify advanced semiconductors, consumer electronics, networking and telecommunications equipment, and computer systems. The company is headquartered in San Jose, Calif., with sales offices, design centers, and research facilities around the world to serve the global electronics industry. More information about the company, its products, and services is available at www.cadence.com.

About Exar
Exar Corporation delivers highly differentiated silicon, software and subsystem solutions for industrial, datacom and storage applications. For nearly 40 years, Exar's comprehensive knowledge of end-user markets along with the underlying analog, mixed signal and digital technology has enabled innovative solutions that meet the needs of the evolving connected world. Exar's product portfolio includes power management and interface components, communications products, storage optimization solutions, network security and applied service processors. Exar has locations worldwide providing real-time customer support to drive rapid product development. For more information about Exar, visit: www.exar.com.

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The XTM Suite delivers a complete range of tools for the translator, reviewer and project manager via the web. In AMD's case, the XTM Suite will be tightly integrated with their existing Content Management System, the DITA CMS Framework from IXIASOFT. XML Int'l is working on integrating the XTM Suite tools with this CMS to provide its users access to powerful translation memory tools directly within the system. As a result, AMD will be able to maximize their reuse strategy and continue to drive down localization costs.

Global product releases depend on consistent, localized product documentation that is produced on-time and on-budget. XTM is XML-based, fundamentally using industry-led Open Standards instead of the proprietary file formats common to other translation systems. Combined with AMD's CMS system, the XTM Suite will facilitate much greater leverage of the company's existing Translation Memory assets, and its workflow will reduce the amount of time AMD QA staff spends administrating work with Localization Service Providers – all potentially resulting in direct cost savings for AMD.

'We chose XTM to integrate with our CMS because it is an XML based solution, non-proprietary and that they are willing and excited to work with our CMS vendor,' said Keith Schengili-Roberts, the Manager for Documentation & Localization at AMD.
'XTM's cutting-edge, standards based translation management technology is designed to allow us to streamline our localization process. We spent the better part of a year assessing potential vendors, and we found XTM Suite to be the most cost effective solution for our needs.'

'We are extremely proud to be supplying AMD with our translation tool, XTM. It is a positive endorsement of our technology that they selected it for the critical job of product and engineering documentation localization. Managing localized content directly from within the DITA CMS Framework makes perfect sense as it improves content reuse and ensures an efficient delivery of translated content' said Elliot Nedas, Business Development Manager, at XML-INTL.

About XML-INTL
XML-INTL Ltd is a leader in web 2.0 XML based translation technology. Their modular translation Suite XTM is ideally suited to integration with Content Management Systems.

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Applications for the Agilent E5061B, part of the ENA series of network analyzers, include general RF-network measurements, such as filters or amplifier tests, and LF (low frequency) measurements necessary for loop-gain evaluation of DC-DC converters. The E5061B's frequency coverage is suitable for power distribution networks (PDN) measurements, which evaluate the quality of a DC power supply circuit. This type of evaluation is increasingly important, especially in high-speed digital communication equipment.

Features of the Agilent E5061B include:

* S-parameter test port, 5 Hz to 3 GHz, with a wide dynamic range of 120 dB at more than 1MHz, 90 dB at less than 100 Hz;
* gain-phase test port, 5 Hz to 30 MHz, switchable 1 MO/50 O input;
* DC bias source from 0 to ±40 Vdc, which can be added to AC test signal (for both S-parameter and gain-phase test port) or can be used as a sweepable DC source; and
* compact form factor with a 254-mm depth, requiring less desktop space.

"The new E5061B represents an extension of a recognized industry standard in RF network analysis capabilities from Agilent," said Akira Nukiyama, vice president and general manager of Agilent's Component Test Division, Kobe. "Delivering the excellent RF performance that is common to the ENA series, the E5061B also offers accurate LF measurement capability. It's the ideal, general-purpose LF-to-RF network analyzer that meets a variety of network measurements."

Agilent's ENA Series addresses a broad array of component and circuit tests, including EMC-related applications and automotive, wireless communications, aerospace and defense, education and medical applications. The series includes the Agilent E5071C (9 kHz to 8.5 GHz /300 kHz to 20 GHz), the Agilent E5061A/62A (300 kHz to 1.5/3.0 GHz) and now the Agilent E5061B, expanding coverage to LF measurement requirements down to 5 Hz.

U.S. Pricing and Availability

The Agilent E5061B network analyzer is available now and is priced at $31,900.

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Micron is currently sampling the 4Gb NAND-2Gb LPDDR MCP with customers and expects to be in volume production in early 2010. The 4Gb NAND-2Gb LPDDR combination is targeted at mainstream densities in today's mobile devices, but Micron has the flexibility to support higher densities – up to 8Gb NAND and 8Gb LPDDR – as the mobile market integrates sophisticated multimedia functionality. Visit the Micron Innovations blog to learn more about Micron's new MCP products and read an insider's perspective on the shifting mobile memory landscape.

'With Micron's 34nm 4Gb NAND and 50nm 2Gb LPDDR monolithic die used in this package, we are providing customers with the most advanced solution available in NAND-based MCPs,' said Eric Spanneut, director of mobile memory marketing. 'By combining the industry's leading NAND and DRAM processes within our new generation of MCPs, we are able to easily accommodate the shift to high-density NAND devices as the industry progresses toward multi-function mobile devices.'

In addition to its MCP portfolio, Micron also offers a host of memory products for the mobile market, including discrete NAND and LPDRAM parts, e∙MMC 4.4 managed NAND solutions and NANDcode software. By working closely with the entire mobile value chain, including operating system and chipset vendors, Micron is in a unique position to offer customers a rich portfolio of engineering support and solutions for their respective design needs.

Relevant Links
There are other ways to stay up-to-date on Micron news:

* Micron Innovations Blog: www.micronblogs.com
* Micron on Twitter: http://twitter.com/microntechnews
* Micron Pressroom: www.micron.com/media

About Micron
Micron Technology, Inc., is one of the world's leading providers of advanced semiconductor solutions. Through its worldwide operations, Micron manufactures and markets DRAMs, NAND flash memory, other semiconductor components, and memory modules for use in leading-edge computing, consumer, networking, and mobile products. Micron's common stock is traded on the New York Stock Exchange (NYSE) under the MU symbol. To learn more about Micron Technology, Inc., visit www.micron.com.

Micron and the Micron orbit logo are trademarks of Micron Technology, Inc. All other trademarks are the property of their respective owners.

This press release contains forward-looking statements regarding the production of Micron's new MCP portfolio. Actual events or results may differ materially from those contained in the forward-looking statements. Please refer to the documents Micron files on a consolidated basis from time to time with the Securities and Exchange Commission, specifically Micron's most recent Form 10-K and Form 10-Q. These documents contain and identify important factors that could cause the actual results for Micron on a consolidated basis to differ materially from those contained in our forward-looking statements (see Certain Factors). Although we believe that the expectations reflected in the forward-looking statements are reasonable, we cannot guarantee future results, levels of activity, performance or achievements.

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SUNNYVALE, Calif. - MIPS Technologies, Inc. (Nasdaq: MIPS), a leading provider of industry-standard processor architectures and cores, today introduced a new core family providing the highest levels of system performance for extremely cost-sensitive embedded applications such as 32-bit microcontrollers (MCUs), home entertainment, personal entertainment and home networking. The new MIPS32® M14KTM and M14KcTM cores are the first MIPS32-compatible cores that also execute the new microMIPSTM instruction set architecture (ISA), achieving high performance of
1.5 DMIPS/MHz with an advanced level of code compression. The microMIPS ISA maintains 98% of MIPS32 performance while reducing code size by 35%, translating to significant silicon cost savings.

According to Art Swift, vice president of marketing at MIPS Technologies, "Growing amounts of signal processing and higher speed connectivity are driving up the performance requirements in MCUs and many cost-sensitive embedded applications, while still requiring a very small silicon footprint. We're enabling our customers to develop high-performance devices in smaller form factors to significantly decrease development costs. We're pleased to enhance and expand our offering for MCU and system designers with these groundbreaking new cores."

"MCUs continue to migrate towards 32-bit to address the needs of more sophisticated, performance-intensive applications," said Tony Massimini, chief of technology, Semico Research. "Processors that support 32-bit MCUs and other high-performance, low-footprint embedded devices must not only provide the requisite performance and right feature set, but they also need to be extremely compact to keep flash memory and silicon costs down. This enables smaller die area which allows for further integration. The specifications of the new M14K cores suggest great promise for the next generation of these devices."

The M14K Core for Microcontrollers

The M14K core combines high performance with an advanced level of code compression for the 32-bit MCU market, achieving performance of 1.5 DMIPS/MHz and 180 MHz in 130nm. The M14K core offers advanced features that are optimized for MCU and real-time embedded applications, including reduced interrupt latency, flash acceleration, advanced debug features including iFlowTraceTM and support for AHB Lite as the interconnect interface. Designed on the MIPS32 4K® micro-architecture that is already proven in hundreds of millions of SoCs, the M14K core is highly configurable and extendable, offering a wide range of implementation options to minimize cost and maximize reusability.

"Microchip is delighted to see continued innovation and commitment from MIPS Technologies in the 32-bit MCU market. The new M14K and M14Kc cores, and the microMIPS ISA offer enhancements important to MCU users, including even faster interrupt latency and smaller code size," said Sumit Mitra, vice president, High Performance Microcontroller Division, Microchip Technology. "Microchip is pleased with the enthusiastic acceptance of its MIPS-based PIC32 MCU family offering best-in-class performance. As with our 8-bit and 16-bit microcontroller businesses, Microchip is committed to a long term roadmap with our MIPS-based 32-bit MCU products."

The M14Kc Core for High Performance, Low Footprint Applications

The M14Kc core builds on the base M14K core with additional features for embedded applications such as home entertainment, home networking and personal mobile entertainment. These applications require a compact footprint but also the ability to execute increasingly complex software algorithms on an RTOS or Linux. Based on the popular MIPS32 4KEcTM micro-architecture, which provides a powerful Linux and Java engine and superior performance for the Android platform, the M14Kc core has a full cache controller and translation lookaside buffer (TLB) memory management unit (MMU).

microMIPS ISA for Advanced Code Compression

At the heart of the M14K and M14Kc cores is the new microMIPS ISA that offers 32-bit performance with 16-bit code size for most instructions. The microMIPS ISA combines recoded and new 16- and 32-bit instructions to achieve an ideal balance of performance and code density. It incorporates all MIPS32 instructions and Application Specific Extensions (ASEs) including MIPS-3D® ASE, MIPS DSP ASE, MIPS MT ASE and SmartMIPS® ASE, as well as new instructions for advanced code size reduction. The microMIPS ISA is backward compatible, enabling reuse of optimized MIPS micro-architecture. With smaller memory accesses and efficient use of the instruction cache, the microMIPS ISA also helps to reduce system power consumption.

Ecosystem and Tool Support

MIPS Technologies is providing complete software development tool support for the new M14K and M14Kc cores, with the Eclipse-based MIPS NavigatorTM Integrated Component Suite (ICS) and System NavigatorTM probes for debugging. MIPS Technologies is also working with leading third party software vendors for broad tool and OS support.

"With Sourcery G++TM, CodeSourcery's industry-leading software development environment based on the GNU Toolchain and the Eclipse IDE, we already support the entire range of MIPS32 cores, and we will soon be providing support for the M14K and M14Kc cores (including the new MicroMIPS ISA) as well," said Mark Mitchell, chief sourcerer, CodeSourcery. "We are pleased to continue our partnership with MIPS Technologies to deliver the tools MIPS developers need to quickly bring products to market."

"The new MIPS32 M14K and M14Kc cores and microMIPS ISA provide the ultimate platforms to leverage the low power and high performance characteristics of the Nucleus OS," said Glenn Perry, general manager of the Embedded Systems Division of Mentor Graphics. "Combining cores like the M14Kc with Mentor's multiOS solutions for Linux, Android and Nucleus will enable our mutual customers to develop innovative multi-OS solutions with world-class support and performance quality from Mentor Graphics."

"Express Logic's ThreadX® RTOS is ideal for deeply embedded systems where small code size and real-time performance are critical, and the microMIPS ISA appears to be a great fit for enabling the next generation of these systems," said William E. Lamie, president and CEO ExpressLogic. "With ThreadX on MIPS cores, developers have a powerful solution to help them get to market quickly. We have worked closely with MIPS Technologies for many years, and we're continuing that work with them on microMIPS and the M14K family."

"Micrium currently provides embedded software support for the MIPS32 architecture with our small-footprint µC/OS-II RTOS," said Christian Legare, Micrium vice president. "Micrium is known for saving precious design time, resulting in a substantial cost advantage for such embedded applications as industrial, medical and automotive. With its M14K core, MIPS Technologies offers a unique value proposition for developers in these markets. Micrium recognizes the benefits and importance of porting to the M14K core."

"We recently announced support for MIPS32 cores in our new MontaVista Linux 6 Market Specific Distributions (MSDs), offering a tailored combination of features and functionality specific for those cores. MontaVista Linux 6 will also provide support for the M14Kc core to enable MIPS developers to quickly create differentiated products by building on an optimized, commercial-quality embedded Linux," said Scott Mullarkey, vice president, worldwide business development, MontaVista Software.

"With Timesys LinuxLink support for the complete family of MIPS32 cores, including the new M14Kc core, MIPS Technologies' licensees can provide Linux solutions for their processors and reference platforms within days," said Maciej Halasz, director of product management at Timesys. "Licensees can quickly assemble Linux images for reference kits, while their OEM customers can accelerate their time-to-market and build Linux-based products for a wide range of applications through the unique productivity features in the LinuxLink software development framework. We are pleased to extend our comprehensive support for the MIPS architecture by adding LinuxLink support for this new core."

Simulation Support

MIPS will also provide both accurate and fast simulation models for the M14K and M14Kc cores. SoC developers can leverage 100% cycle accurate models-built with technology from Carbon Design Systems-for verification in SystemC and co-simulation environments. Software developers can also take advantage of fast instruction set simulators-developed in conjunction with Imperas-for use in software development and virtual platforms.

"We are pleased to provide MIPS Technologies with our Carbon Model Studio tools to generate cycle accurate models of its new cores," said Bill Neifert, CTO and vice president, business development, Carbon Design Systems. "With models of the M14K and M14Kc cores created using Carbon's leading technology, SoC developers get 100 percent cycle accurate models that work in many different design environments, enabling accurate architectural analysis and pre-silicon performance analysis."

"We are working together with MIPS to create MIPS-VerifiedTM instruction-accurate models of its newest cores that MIPS will provide to its licensees," said Simon Davidmann, CEO of Imperas. "With our instruction accurate simulation technology and these models, developers can simulate complete embedded systems running real application code at very fast speeds on typical desktop PCs-helping them get to market quickly at the lowest possible cost."

Availability

The new M14K and M14Kc cores will be available in the first quarter of 2010. For more information, contact info@mips.com or visit www.mips.com/microcontrollers.

About MIPS Technologies, Inc.

MIPS Technologies, Inc. (NasdaqGS: MIPS) is a leading provider of industry-standard processor architectures and cores that power some of the world's most popular products for the home entertainment, communications, networking and portable multimedia markets. These include broadband devices from Linksys, DTVs and digital consumer devices from Sony, DVD recordable devices from Pioneer, digital set-top boxes from Motorola, network routers from Cisco, 32-bit microcontrollers from Microchip Technology and laser printers from Hewlett-Packard. Founded in 1998, MIPS Technologies is headquartered in Sunnyvale, California, with offices worldwide. For more information, contact (408) 530-5000 or visit www.mips.com.

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'It has been an exhilarating three years for WirelessHD,' said John Marshall, Chairman of WirelessHD. 'We're thrilled with the Consortium's continued success marked with WirelessHD CE products available to consumers worldwide from tier 1 CE manufacturers like Panasonic, LGE, Best Buy and Monster. We remain committed to our objective of bringing to life the promise of interoperable WirelessHD technology as the best wireless home entertainment experience and look forward to expanding the WirelessHD ecosystem in areas such as portable device connectivity and wireless local area networking (WLAN).'

In just three years of existence, WirelessHD boasts over 40 leading technology companies and the world's only open 60GHz standard with an available specification and an active Authorized Test Center (ATC). Several WirelessHD consumer products have successfully passed rigorous compliance tests and are now available in Asia, North America and Europe such as the Panasonic Z1 plasma TV and LG Electronics LH85 and LHX LCD TVs. These key achievements highlight the rapid growth in membership and products, application development and interest in the Consortium.

About WirelessHD
Formed in 2006, Broadcom Corporation, Intel Corporation, LG Electronics Inc., Panasonic Corporation, NEC Corporation, Royal Philips Electronics, Samsung Electronics Co., Ltd, SiBEAM Inc., Sony Corporation and Toshiba Corporation, joined together to define the next generation worldwide 60GHz multi-gigabit millimeter wave technology for mobile and stationary consumer and enterprise applications. WirelessHD is the first consumer electronics and technology industry-supported, digital wireless interface for instantaneous file transfers, wireless display and docking, and simplified and lossless HD media streaming. For more information on WirelessHD, please visit www.wirelesshd.org.

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NEW YORK — Juniper Networks® (NYSE: JNPR) today announced that Juniper has reached a significant milestone with its Original Equipment Manufacturer (OEM) relationship with IBM, announced in July. IBM is now delivering to customers a suite of Ethernet networking products manufactured by Juniper. In addition, the two companies have extended the OEM agreement to include Juniper's SRX Series Services Gateways, providing customers with a best-in-class choice of network offerings that can reduce costs, improve services and manage risk.

"We are continuing to combine breakthrough technology with a world class partnership to help customers reinvent the experience and economics of networking," said Mark Bauhaus, executive vice president and general manager, Service Layer Technology Business Group, Juniper Networks. "The continued expansion of the IBM and Juniper OEM demonstrates our joint commitment to propelling a dynamic infrastructure network that is open, scalable, simple and secure to address the exploding scale of Internet services for personal and business productivity."

"IBM is focused on providing its customers with the best networking choices and flexibility in their solutions, which is why we're pleased to offer IBM j-type Ethernet networking products running JUNOS Software as part of our data center networking portfolio," said Barry Rudolph, vice president, IBM System Storage. "The continued success of our relationship and expansion of our OEM partnership will help us reach our shared vision of advancing the economics of networking and the data center."

Today's data centers require higher performance and less complex networks as an essential element of their evolution. While there are extreme cost pressures on IT budgets, the demand on data centers only increases with exploding data volumes, demand for new services, speed and security, and always-on reliability. In addition, cloud computing will further drive the need for massive scale, efficiency, elasticity and security from networks and data center architectures. The IBM and Juniper relationship is further evidence of the growing importance of the high-performance network in the progression of data centers toward cloud computing or cloud-like infrastructures. Both companies agree a high-performance, secure network is vital to the operations of both the data center (enabling service production) and the global network (enabling service delivery).

IBM and Juniper entered into the OEM agreement in July 2009. The agreement allows the IBM System & Technology Group (STG) to brand, label and sell select Juniper EX Series Ethernet switches as IBM j-type e-series Ethernet switches and MX Series Ethernet Services routers as IBM j-type m-series Ethernet routers. The suite of six Ethernet networking products are now generally available within IBM's data center portfolio. The expanded OEM agreement adds the SRX Series Services Gateways, which will be available in the first half of 2010. For more information on IBM and Juniper, please visit: https://simplifymydatacenter.com/ibm.

About Juniper Networks

From devices to data centers, from consumers to the cloud, Juniper Networks delivers innovative software, silicon and systems that transform the experience and economics of networking. The company serves more than 30,000 customers and partners worldwide, and earned more than $3 billion in revenue over the last year. Additional information can be found at www.juniper.net.

Juniper Networks and Junos are registered trademarks of Juniper Networks, Inc. in the United States and other countries. The Juniper Networks and Junos logos are trademarks of Juniper Networks, Inc. All other trademarks, service marks, registered trademarks, or registered service marks are the property of their respective owners.

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SANTA CLARA, Calif., and GENEVA . – Intel Corporation and Numonyx B.V. today announced a key breakthrough in the research of phase change memory (PCM), a new non-volatile memory technology that combines many of the benefits of today's various memory types. For the first time, researchers have demonstrated a 64Mb test chip that enables the ability to stack, or place, multiple layers of PCM arrays within a single die. These findings pave the way for building memory devices with greater capacity, lower power consumption and optimal space savings for random access non-volatile memory and storage applications.

The achievements are a result of an ongoing joint research program between Numonyx and Intel that has been focusing on the exploration of multi-layered or stacked PCM cell arrays. Intel and Numonyx researchers are now able to demonstrate a vertically integrated memory cell – called PCMS (phase change memory and switch). PCMS is comprised of one PCM element layered with a newly used Ovonic Threshold Switch (OTS) in a true cross point array. The ability to layer or stack arrays of PCMS provides the scalability to higher memory densities while maintaining the performance characteristics of PCM, a challenge that is becoming increasingly more difficult to maintain with traditional memory technologies.

"We continue to develop the technology pipeline for memories in order to advance the computing platform," said Al Fazio, Intel Fellow and director, memory technology development. "We are encouraged by this research milestone and see future memory technologies, such as PCMS, as critical for extending the role of memory in computing solutions and in expanding the capabilities for performance and memory scaling."

"The results are extremely promising," said Greg Atwood, senior technology fellow at Numonyx. "The results show the potential for higher density, scalable arrays and NAND-like usage models for PCM products in the future. This is important as traditional flash memory technologies face certain physical limits and reliability issues, yet demand for memory continues to rise in everything from mobile phones to data centers."

Memory cells are built by stacking a storage element and a selector, with several cells creating memory arrays. Intel and Numonyx researchers were able to deploy a thin film, two-terminal OTS as the selector, matching the physical and electrical properties for PCM scaling. With the compatibility of thin-film PCMS, multiple layers of cross point memory arrays are now possible. Once integrated together and embedded in a true cross point array, layered arrays are combined with CMOS circuits for decoding, sensing and logic functions.

More information about the memory cell, cross point array, experiment and results will be published in a joint paper titled "A Stackable Cross Point Phase Change Memory," and will be presented at the 2009 International Electron Devices Meeting in Baltimore, Md., on Dec. 9. The paper is co-authored by Intel and Numonyx technologists and will be presented by DerChang Kau, Intel senior principal engineer.

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Tempe, Ariz.-Avnet Technology Solutions, the solutions distribution leader and an operating group of Avnet, Inc. (NYSE: AVT), announced today that it was named AMD's (NYSE:AMD) top-performing global distributor during the recent AMD Executive Forum 2009, held in Austin, Texas. AMD selected Avnet for this honor based on its ability to expand AMD's market presence and revenues globally. AMD also awarded Avnet three regional distinctions, naming Avnet as distributor of the year in ANZ, EMEA and North America.

"This prestigious award from AMD validates that Avnet's solutions-driven approach to technology sales and marketing is helping both our customers and suppliers accelerate their success around the globe," said Phil Gallagher, president, Avnet Technology Solutions global. "Avnet has helped support our OEM, system builder and value-added partners in the AMD market by offering the tools, technical expertise and distribution resources needed to develop complete white box solutions that leverage best-in-class technology from AMD and complementary suppliers."

Avnet has been supporting AMD's customers for more than 35 years and has consistently been recognized as one of its top distributor partners. Avnet focuses on creating growth opportunities for its customers through a solutions-based approach to selling AMD Opteron processors for white box servers, embedded applications and workstations, and AMD Athlon II and Phenom II processors for OEM and white box desktops. For example, Avnet provides its system builder, OEM and value-added partners with access to complementary supplier relationships and a variety of services, such as integration, logistics, design engineering and financing, to ensure they are able to offer complete solutions.

"Avnet understands the intricacies of the global technology market," said John Byrne, vice president, world-wide channel sales, AMD. "They work hand-in-hand with our customers to provide global supply chain support, coupled with the technology, knowledge and services required to enable long-term growth opportunities. Avnet has consistently proven that they are dedicated to helping us create an outstanding customer experience."

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GENEVA, SWITZERLAND AND CAMBRIDGE, UK - STMicroelectronics (NYSE: STM), one of the world's leading set-top-box chip makers, and ARM [(LSE: ARM); (Nasdaq: ARMH)], announced today that ST has adopted the ARM® Cortex™-A9 MPCore™ processor, in addition to the Mali®-400 graphics processor, for its upcoming set-top-box and digital TV system-on-chip (SoC) ICs.

The Cortex-A9 MPCore processor provides ST with the scalable high performance required to enable the high-bandwidth broadband and broadcast content being streamed into homes, while significantly improving power efficiency when compared to alternative solutions. The adoption of ARM technology enables ST to build upon the expertise accumulated during its SoC development with its successful ST-40 processor, and also signals the company's intention to base its next-generation range of HDTV SoCs on ARM technology.

ST already has vast experience in developing cutting-edge complex SoCs based on ARM technology for various applications in wireless, computer, automotive and industrial markets. By adopting the Cortex-A9 MPCore processor for home-entertainment markets, ST is also able to access the comprehensive and expanding software ecosystem around the Cortex-A9 MPCore processor, including Adobe® Flash® technology and leading web browsers such as Opera, to provide compelling multimedia performance.

'Building our next-generation HDTV consumer devices around the high-performance ARM architecture will enable us to continue to deliver best-in-class devices for our customers, while providing a simple migration route from our existing ST-40 based chips,' said Philippe Lambinet, executive vice president, Home Entertainment and Display Group, STMicroelectronics. 'In addition, our customers now gain access to the broad ARM ecosystem of support around the processors.'

'The adoption of ARM technology by ST, one of the world leaders for home-entertainment ICs, is a highly visible demonstration of the growing momentum behind our Cortex processors and Mali GPUs (Graphics Processor Units) in applications such as DTV and set-top boxes,' said Mike Inglis, executive vice president, Processor Division, ARM. 'Our leadership position in the development of high-performance, low-power multicore technology enables ARM to provide the scalable performance demanded by next-generation consumer devices.'

'Sky welcomes the collaboration between ST and ARM to provide cost-effective, low-power set-top-box technology,' said Roger Lambert, BSkyB. 'Reducing power consumption across our business is a key pillar of Sky's strategy – utilizing the lowest power technology in our set-top boxes is a vital element of this ongoing strategy.'

ST has also licensed the ARM Mali-400 MP multicore scalable graphics processing unit (GPU) technology to meet the growing demand for exciting new graphical user interfaces and the needs of increasingly sophisticated web-based services. The Mali-400 GPU enables ST to provide '1080p' 3D user interfaces conforming to the Khronos OpenGL ES 2.0 API (Application Programming Interface), and helps deliver the seamless composition of graphics and video for the best possible user experience from the next wave of web-based interactive services.

'Flash Player 10 is essential to deliver rich, compelling Web content on advanced consumer devices,' said Danny Winokur, senior director, Business Development, Platform Business Unit at Adobe. 'ST and ARM are enabling the underlying hardware platform, based on Open GLES 2.0, and the high-performance ARM Cortex-A9 processor, to deliver the full Flash experience to consumer entertainment systems.'

The first ST devices for home entertainment applications integrating the Cortex-A9 MPCore and Mali-400MP will be available in mid-2010.

About ARM
ARM designs the technology that lies at the heart of advanced digital products, from wireless, networking and consumer entertainment solutions to imaging, automotive, security and storage devices. ARM's comprehensive product offering includes 32-bit RISC microprocessors, graphics processors, video engines, enabling software, cell libraries, embedded memories, high-speed connectivity products, peripherals and development tools. Combined with comprehensive design services, training, support and maintenance, and the company's broad Partner community, they provide a total system solution that offers a fast, reliable path to market for leading electronics companies. More information on ARM is available at http://www.arm.com.

About STMicroelectronics
STMicroelectronics is a global leader serving customers across the spectrum of electronics applications with innovative semiconductor solutions. ST aims to be the undisputed leader in multimedia convergence and power applications leveraging its vast array of technologies, design expertise and combination of intellectual property portfolio, strategic partnerships and manufacturing strength. In 2008, the Company's net revenues were $9.84 billion. Further information on ST can be found at www.st.com.

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SUNNYVALE, Calif. - MIPS Technologies, Inc. (Nasdaq: MIPS), a leading provider of industry-standard processor architectures and cores for digital consumer, home networking, wireless, communications and business applications, today announced that Avnet ASIC Israel (AAI), an ASIC and COT design, backend, and turnkey manufacturing services provider, has successfully obtained the highest level of accreditation as a certified design center for MIPS. Through the companies' expanding relationship, MIPS Technologies will support AAI with extensive training, tools and support.

AAI provides VLSI back-end and production management services, as well as front-end design services to the rapidly expanding base of MIPS licensees in Israel and worldwide. AAI was first selected by MIPS as an approved design center in 2005, and has worked extensively with a broad range of MIPS licensees including Amimon and BroadLight. Through these engagements, AAI has gained deep experience with MIPS cores, including MIPS32® 4KE®, M4K® and 24K® core implementations.

"This agreement is yet another step in broadening access to the MIPS architecture across the globe," said Art Swift, vice president of marketing, MIPS Technologies. "AAI continues to demonstrate deep technical knowledge, expertise and dedication to our customers, and we are pleased to work closely with the company to streamline and speed SoC development for our licensees."

"MIPS Technologies' industry-standard architecture and cores have established the company as a leading provider of processor IP, and we are proud to support its licensees as they continue to deliver cutting-edge designs to market," said Nadav Ben-Ezer, managing director, AAI. "The Israel SoC market is growing quickly, and we are seeing an increasing number of opportunities for MIPS-Based solutions."

About Avnet ASIC Israel, Ltd.
Avnet ASIC Israel Ltd. (AAI), is a wholly-owned subsidiary of Avnet Israel, the Israeli branch of Avnet, Inc., one of the largest global B2B distributors of the world's leading technology manufacturers. Avnet ASIC Israel is a leading provider of a complete range of design and turnkey manufacturing services for fabless companies and OEMs, which develop advanced SoC devices. AAI's portfolio includes design and manufacturing services for ASIC, COT, Analog, Structured ASIC, and FPGA. In the past 20 years AAI has successfully completed more than 250 tape-outs. Partnering with the world leading library, IP and manufacturing vendors, Avnet ASIC Israel secures to its customers access to the latest technology, flexible pricing, fast deliveries, and top class performance.

AAI is based in Tel Mond, Israel, and can be reached at 972.9.7780273 or www.avnet-asic.com.

About MIPS Technologies, Inc.

MIPS Technologies, Inc. (Nasdaq: MIPS) is a leading provider of industry-standard processor architectures and cores that power some of the world's most popular products for the home entertainment, communications, networking and portable multimedia markets. These include broadband devices from Linksys, DTVs and digital consumer devices from Sony, DVD recordable devices from Pioneer, digital set-top boxes from Motorola, network routers from Cisco, 32-bit microcontrollers from Microchip Technology and laser printers from Hewlett-Packard. Founded in 1998, MIPS Technologies is headquartered in Sunnyvale, California, with offices worldwide. For more information, contact (408) 530-5000 or visit www.mips.com.

MIPS, MIPS-Based, MIPS32, 4KE, M4K and 24K are trademarks or registered trademarks in the United States and other countries of MIPS Technologies, Inc. All other trademarks referred to herein are the property of their respective owners.

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Details of the new measures are as follows:

1) Realignment of assembly and test bases at NEC Semiconductors Kyushu Yamaguchi
Currently, NEC Semiconductors Kyushu Yamaguchi's Fukuoka facility operates as an assembly and test plant for manufacturing leading-edge FCBGA (flip-chip ball grid array) packages Note 1. To accelerate the productivity advance in FCBGA package manufacturing at the Oita plant, which started as of October 2009, NEC Electronics decided to close the Fukuoka plant by September 2011, and will transfer its production volume at the Fukuoka plant into NEC Semiconductors Kyushu Yamaguchi's assembly and test plant in Oita. NEC Electronics will also transfer majority of its QFP (quad flat packs) and other package manufacturing to its assembly and test facility in Oita plant as well as Kumamoto Nishiki plant. The buildings and the ground at Fukuoka plant are schedule to be sold.
By consolidating the company's advanced chip package technology, the Oita plant will ramp up its capacity of FCBGA package manufacturing to a monthly production of 2.0 million units. NEC Semiconductors Kyushu Yamaguchi's Oita plant currently manufactures microcontrollers and SoCs (QFP package products) with a monthly production of approximately 14.0 million units. In order to improve its manufacturing efficiency through scale expansion, NEC Electronics aims to expand its overall production capacity to 18.0 billion units per month during the fiscal year ending March 2012.

2) Consolidation of the 5-inch wafer line at NEC Semiconductors Kansai's Shiga facility
NEC Electronics has two 5-inch wafer lines, and one of the lines at NEC Semiconductors Kansai's Shiga facility will be closed by March, 2012. Some of the products that are currently manufactured at the Shiga facility will be transferred to its 6-inch wafer line as well as NEC Semiconductors Yamagata's 5-inch wafer line in Tsuruoka, Yamagata.

NEC Electronics believes that these reforms will ultimately benefit the company's cost competitiveness, and will implement these new changes diligently with the aim of improving the company's business structure.
Please refer to the attachment for more information on NEC Semiconductors Kyushu Yamaguchi and NEC Semiconductors Kansai.

About NEC Electronics
NEC Electronics Corporation (TSE: 6723) specializes in semiconductor products encompassing advanced technology solutions for the high-end computing and broadband networking markets; system solutions for the mobile handset, PC peripheral, automotive and digital consumer markets; and multi-market solutions for a wide range of customer applications. NEC Electronics Corporation has subsidiaries worldwide including NEC Electronics America, Inc. and NEC Electronics (Europe) GmbH. More information about NEC Electronics worldwide can be found at www.necel.com.

(Note 1)
Flip-Chip Ball Grid Array (FCBGA) package: The most advanced packaging method with excellent electrical characteristics. It enables two-dimensional pin layout by setting the pins directly underneath the chip. FCBGA also has finer radiation performance by allowing the heat to be released from the bottom of the chip.

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To make increasingly efficient electronic devices, the semiconductor industry must rely on new chip materials.

Ruthenium is one such material poised to become a crucial element, particularly in data storage and memories.

Ruthenium is notably used in manufacturing new generation hard disk reading heads based on a novel physical effect, known as giant magnetoresistance. Its discovery by Albert Fert (France) and Peter Grünberg (Germany) earned them both the Nobel Prize in Physics for 2007.

To develop these new reading heads, as well as memories and other electronic components, Air Liquide Group's research teams created and patented a new advanced precursor, ToRuSTM, which is used to deposit of very thin ruthenium layers only a few atoms thick. Today, ToRuSTM is used by several of the Group's customers.

At SEMICON Europa 2009, the results of votes cast by 25,000 professionals in the electronics industry designated ToRuSTM the winner of the Enabling Material prize, which recognizes inventions that allow for significant progress in electronic components manufacturing.

Air Liquide's Electronics activity recorded revenue of €1,044 million in 2008. Its sales were mostly ultra-pure gases, specialty gases, new molecules, equipment for the use of these products, and customized services.

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'The increased bandwidth offered by PCI Express® 2.0 is useful in improving network data throughput when combined with an appropriate increase in the number of CPUs or CPU cores to help accurately route the additional traffic,' said Patrick Patla, vice president and general manager, Server and Embedded Business, AMD. 'The Quad-Core AMD Opteron processor delivers this compute power and with 50W and 71W versions available, is a great option for the 200W power budget of the ATCA specification.'

'Our research shows the market for ATCA applications remains quite strong, despite the downturn. This is in part due to the industry's shift from proprietary designs to interoperable standards and commercial off the shelf building blocks,' said Erik Heikkila, Director, Embedded Hardware and Systems, VDC Research. 'Improvements to AMD's blade platform are a great example of this building block concept. Customers who have implemented a previous AMD Opteron processor-based ATCA system now have the option to further extend their design with an easy upgrade.'1

'With the new AMD embedded platform, we are able to deliver superior performance on high-bandwidth networks and still maintain the strict overall system power limit of the ATCA specification,' said Patrick Welzien, vice president, Engineering, Diversified Technology, Inc. 'Our newest blade, the ATC6239, features two 45nm Quad-Core AMD Opteron processors and by relying on this scalable COTS platform, we've been able to extend the life of the system and recognize cost efficiencies.'

Learn more about AMD's numerous commercial embedded platforms for networking and telecommunications, storage, digital signage, thin client and point-of-sale systems at http://www.amd.com/embedded.
About AMD

Advanced Micro Devices (NYSE: AMD) is an innovative technology company dedicated to collaborating with customers and technology partners to ignite the next generation of computing and graphics solutions at work, home and play. For more information, visit http://www.amd.com.

AMD, the AMD Arrow logo, AMD Opteron, and combinations thereof are trademarks of Advanced Micro Devices, Inc. HyperTransport is a licensed trademark of the HyperTransport Technology Consortium. Other names are for informational purposes only and may be trademarks of their respective owners.

1. BIOS update may be required.

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An SSD is built to replace a traditional hard disk drive (HDD) with added performance, lower power consumption and higher reliability. The Intel SSD Toolbox allows users to more effectively monitor and manage the SSD's health. The firmware upgrade and Intel SSD Optimizer use the Windows* 7 ATA Data Set Management Command (known as Trim) to help keep the Intel SSD running at continued high performance. In addition, the SSD Toolbox and Optimizer also allow the respective enhancements to work with Windows* XP and Vista* operating systems.

"Fast and reliable access to data is critical for our SSD users," said Pete Hazen, director of marketing, Intel NAND Solutions Group. "The latest firmware and toolbox upgrade for Intel 34nm SSD users provide a host of new management, information and diagnostic tools to help SSDs retain out-of-box performance. We are encouraging our 34nm customers to download the new firmware update today. Not only will Windows 7 users receive the performance enhancements of the Trim command, but so will our Windows XP and Vista users."

For 34nm X25-M 160GB owners, the firmware update also offers a performance boost to sequential write speeds by delivering up to 100MB per second, a 40 percent performance improvement over the existing firmware version.

The Trim attribute of the ATA Data Set Management Command, often referred to as Trim, synchs the operating system's view of deleted files with those that are deleted, but not erased on the drive. Trim tells the SSD which data blocks are no longer in use. This helps stabilize the performance and health of the SSD over time.

The Intel SSD Toolbox provides SSD management tools and information about the drive, including comparing Self-Monitoring and Reporting Technology (S.M.A.R.T.) drive attributes to manufacturer threshold. It provides basic and full diagnostics, along with recommended actions. The Toolbox also features an easy-to-use graphical user interface that will allow end users to schedule and run the Trim command independent of the operating system. The company recommends users install the firmware update and toolbox, and run the Trim function daily to ensure best performance. The firmware upgrade can be found at www.intel.com/go/ssdfirmware and the Intel SSD Toolbox and Optimizer at www.intel.com/go/ssdtoolbox.

Intel's award-winning X25-M SSD began shipping on 34nm in July. The multi-level cell (MLC) Intel® X25-M Mainstream SATA SSD is aimed at laptop and desktop PCs, and available in 80 Gigabyte (GB) and 160GB versions. SSDs are data storage devices found inside computers. Because SSDs have no moving parts they offer faster performance and greater energy efficiency and durability than traditional HDDs. A draw for gamers, media creators and technology enthusiasts, SSDs have also played a key role in the emergence of ultra-thin and light notebook PCs that are becoming increasingly popular due to their design, size and longer battery life. For more information on Intel SSDs visit www.intel.com/go/ssd.

About Intel
Intel (NASDAQ: INTC), the world leader in silicon innovation, develops technologies, products and initiatives to continually advance how people work and live. Additional information about Intel is available at www.intel.com/pressroom and blogs.intel.com.

Intel is a trademark of Intel Corporation in the United States and other countries.

* Other names and brands may be claimed as the property of others.

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IRVINE, Calif., Broadcom Corporation (Nasdaq: BRCM), a global leader in semiconductors for wired and wireless communications, today announced its fourth generation of advanced Bluetooth® headset system-on-a-chip (SoC) solutions delivering the best power savings platform and premium audio quality for compelling next generation headset designs. Featuring the industry's first 65 nanometer (65nm) CMOS headset chips, this new family of Bluetooth solutions leapfrogs the competition by delivering superior audio quality, key user interface enhancements and unrivaled power performance and talk time.

Announced today is the Broadcom® BCM2074x family of Bluetooth headset SoC solutions that builds upon the field proven benefits of the previous generation BCM2044 and BCM2044S devices (which are available in popular headsets). The new BCM2074x family adds powerful 'industry-first' features, including new wind noise reduction algorithms, multi-language 'voice prompt' technology and integrated fast-charging power innovations that enable headsets to charge five times faster than existing products. These advancements are delivered in an architecture that allows consumers to pay less for better quality and higher performing headsets.

"We have leveraged our leadership in the Bluetooth market to integrate superior audio quality and ease of use. This new family of chips extends our technology leadership with the industry's lowest power consumption that is convenient to the end-user and friendly to the environment," said Craig Ochikubo, Vice President & General Manager of Broadcom's Wireless Personal Area Networking line of business. "This level of feature integration is optimized by the use of 65nm technology, providing more value, features and capabilities to consumers than devices using older, less efficient technologies."

SmartAudio® Improvements Reduce Annoying Wind Noise

"Consumers are sold on the concept of Bluetooth headsets, but usability and sound quality must improve in order for them to become a ubiquitous part of mobile communications," said Emma Naudo, wireless analyst from IMS Research. "By focusing on ways to improve the consumers' headset experience, companies like Broadcom are helping to dispel the myths about Bluetooth headsets and enable the market to reach its full potential."

Broadcom's SmartAudio® technology, which benefits from a company-wide effort to deliver superior voice and audio quality across all its communications products, has been a key driver of the company's growth in the Bluetooth headset market. With the new BCM2074x family, Broadcom adds enhanced noise suppression capabilities that can reduce background noise by nearly 40 percent when compared with existing noise cancellation techniques. The SmartAudio upgrades include dynamic wind noise suppression and near-end speech enhancement algorithms (such as dynamic compression and spectral shaping) that overcome the most challenging and annoying audio interferers.

Wind noise is a particularly challenging issue frequently complained about. Regular noise reduction techniques have little effect on wind noise because its characteristics are very different from babble, car and other types of noise. The signal contamination caused by wind becomes spectrally indistinguishable from speech at higher wind speeds making it difficult to filter out. The BCM2074x family combats this interference by utilizing innovative algorithmic techniques in both single and dual microphone configurations to identify and detect wind in real-time and then applies high-speed suppression to deliver a clearer, more enjoyable audio experience.

Making Bluetooth Headsets Easier to Use

Broadcom continues to drive innovation in the headset market, integrating key enhancements based on customer feedback and consumer preference data. New headsets based on the BCM2074x platform can provide more than 4 hours of talk time after a 5 minute charge versus older generation and competing technologies that can only deliver 30 minutes or less after a similar charge. In addition, this new platform enables double the talk time overall of other devices.

As new headsets increasingly add sophisticated features, existing user interfaces that lack displays and are limited to using blinking LEDs to convey status information undermine the user's ability to take full advantage of these advancements. Headset pairing, battery life, muting and multipoint status can now be easily conveyed via an integrated voice prompt decoder, allowing users to hear multi-language voice prompts when they use their headsets both in basic and advanced modes.

While the Bluetooth SIG continues to drive improvements in the 'pairing' process, this task often remains a challenge for first time users. In an effort to alleviate these consumer challenges, Broadcom has also added innovations in the applications design for an improved pairing experience, both in the basic as well as advanced use cases, including multipoint, where users can access multiple phone handsets with a single headset device.

Product Information

The BCM2074x family of SoC solutions is based on Broadcom's field proven Bluetooth technology that supports Bluetooth Versions 2.0, 2.1 and 3.0. Each chip solution in the new family provides all of the major functional blocks required for a mono headset including the power management unit (PMU), a 'fast-charge' capable charger and audio codecs providing a highly integrated, low system cost solution with reduced power consumption and superior audio quality.

Availability and Pricing

The Broadcom BCM2074x family of Bluetooth headset SoC solutions, including the Broadcom BCM20740 SoC (single microphone), the Broadcom BCM20741 SoC (single microphone with SmartAudio) and the Broadcom BCM20742 SoC (dual microphone with SmartAudio) are all sampling to early access customers. Pricing is available upon request.

About Broadcom

Broadcom Corporation is a major technology innovator and global leader in semiconductors for wired and wireless communications. Broadcom products enable the delivery of voice, video, data and multimedia to and throughout the home, the office and the mobile environment. We provide the industry's broadest portfolio of state-of-the-art system-on-a-chip and software solutions to manufacturers of computing and networking equipment, digital entertainment and broadband access products, and mobile devices. These solutions support our core mission: Connecting everything®.

Broadcom, one of the world's largest fabless semiconductor companies, with 2008 revenue of $4.66 billion, holds more than 3,650 U.S. and 1,450 foreign patents, and has more than 7,750 additional pending patent applications, and one of the broadest intellectual property portfolios addressing both wired and wireless transmission of voice, video, data and multimedia.

A FORTUNE 500® company, Broadcom is headquartered in Irvine, Calif., and has offices and research facilities in North America, Asia and Europe. Broadcom may be contacted at +1.949.926.5000 or at www.broadcom.com.

Cautions regarding Forward Looking Statements:

All statements included or incorporated by reference in this release, other than statements or characterizations of historical fact, are forward-looking statements. These forward-looking statements are based on our current expectations, estimates and projections about our industry and business, management's beliefs, and certain assumptions made by us, all of which are subject to change. Forward-looking statements can often be identified by words such as "anticipates," "expects," "intends," "plans," "predicts," "believes," "seeks," "estimates," "may," "will," "should," "would," "could," "potential," "continue," "ongoing," similar expressions, and variations or negatives of these words. Examples of such forward-looking statements include, but are not limited to, the capabilities of Broadcom's SmartAudio technology and headsets based on the BCM2074x platform, demand for Bluetooth-enabled mono headset products, our position in that market, and the timing of volume production for Broadcom Bluetooth transceivers. These forward-looking statements are not guarantees of future results and are subject to risks, uncertainties and assumptions that could cause our actual results to differ materially and adversely from those expressed in any forward-looking statement.

Important factors that may cause such a difference for Broadcom in connection with the BCM2074x family of Bluetooth mono headset SoCs include, but are not limited to

-- the rate at which our present and future customers and end-users adopt
Broadcom's Bluetooth technologies for wireless headset applications;
-- trends in the wireless networking markets in various geographic regions,
including seasonality in sales of consumer products into which our
products are incorporated, and possible disruption in commercial
activities related to terrorist activity or armed conflict in the United
States and other locations;
-- the gain or loss of a key customer, design win or order;
-- the volume of our product sales and pricing concessions on volume sales;
-- our ability to timely and accurately predict market requirements and
evolving industry standards and to identify opportunities in new
markets; and

-- competitive pressures and other factors such as the qualification,
availability and pricing of competing products and technologies and the
resulting effects on sales and pricing of our products.

Additional factors that may cause Broadcom's actual results to differ materially from those expressed in forward-looking statements include, but are not limited to the list that can be found at http://www.broadcom.com/press/additional_risk_factors/Q42009.php.

Our Annual Report on Form 10-K, subsequent Quarterly Reports on Form 10-Q, recent Current Reports on Form 8-K, and other Securities and Exchange Commission filings discuss the foregoing risks as well as other important risk factors that could contribute to such differences or otherwise affect our business, results of operations and financial condition. The forward-looking statements in this release speak only as of this date. We undertake no obligation to revise or update publicly any forward-looking statement, except as required by law.

Broadcom, the pulse logo, Connecting everything, the Connecting everything logo and SmartAudio are among the trademarks of Broadcom Corporation and/or its affiliates in the United States, certain other countries and/or the EU. Any other trademarks or trade names mentioned are the property of their respective owners.

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About Test Equipment Connection Corporation

Test Equipment Connection Corporation, Test Equipment Connection Pte. Ltd., and TE Connection Asia Limited are industry-leading suppliers of new, refurbished and second-hand electronic test and measurement ('T&M') equipment. The companies sell, buy, lease, rent, trade, repair and calibrate over 315 manufacturers including Agilent, Tektronix, Anritsu, Rohde & Schwarz, Advantest, Megger, LeCroy, Chroma and Fluke, with thousands of products available. The companies are a single source supplier with in-house calibration laboratories assuring that customers receive only the highest quality T&M equipment and support. Test Equipment Connection Corporation has over 250,000 customers, a 45,000 square foot warehouse and repair facility in the US, and 16 years of profitability and financial strength. Visit www.TestEquipmentConnection.com or email Info@Teconnectionasia.com for more information.

Test Equipment Connection Pte. Ltd.
6 Battery Road
#31-00 Standard Chartered Bank Building
Singapore 049909
Telephone: 65-6320-8596
TE Connection Asia, Ltd.
Unit 13, 16 / FL Fotan Industrial Centre
26-28 Au Pui Wan Street
Fotan Shatin N.T. Hong Kong: 852-2690-1360 China: 86 136-3217-2095
###
Test Equipment Connection Corporation
30 Skyline Drive
Lake Mary, FL 32746 USA (800) 615-8378 x 141
Press Release Contact Information:
Phil Vogel business@testequipmentconnection.com

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SAN JOSE, Calif., Cadence Design Systems, Inc. (NASDAQ: CDNS), the leader in global electronic design innovation, today announced that it will collaborate with STARC to develop the Japanese electronic design consortium's next-generation analog/mixed-signal reference flow. Cadence and STARC will use Cadence® Virtuoso® IC 6.1 technology as the platform for developing the STARCAD-AMS flow.

STARC is a consortium made up of 10 electronics companies, six of whom participate in the areas of analog and mixed-signal design. One of STARC's key roles is to validate and support the best design flow for client companies, and members stated that they selected Cadence for the flow project because Virtuoso IC 6.1 technology met STARC's strict criteria. STARC previously built its reference flow for digital designs on the Cadence Encounter® Digital Implementation System. This new project represents STARC's first reference flow for analog/mixed-signal designs.

'We are excited to work with Cadence on our analog/mixed-signal reference flow,' said Yoshio Okamura, vice president of STARC's Development Department-2. 'The members of STARC agreed that Cadence was the obvious choice for this collaboration, and we're anticipating results that will be just as helpful to our customers as the digital design flow we developed with Cadence.'

The new reference flow will be introduced at client companies as STARC's standard design flow, delivering a comprehensive analog/mixed-signal environment and the potential for greater productivity and improved quality of results. Cadence will continuously provide STARC the best technology in the Virtuoso platform to help the consortium's client companies win in their highly competitive markets.

The new flow will support more advanced custom design techniques, including both schematic and constraint-driven layout and process variations to enable users to build more manufacturing-robust designs. These custom blocks can then be implemented and verified within larger SoCs.

'We are very proud that, having previously selected Cadence for our reference flow for digital designs, STARC now chose Cadence to team with on this important analog/mixed-signal project,' said Chi-Ping Hsu, senior vice president, Research and Development in the Cadence Implementation Group. 'STARC customers will be well-served by the reference flow we're designing with our latest Virtuoso technology. We look forward to helping make STARCAD-AMS an extremely successful and valuable project.'

About Cadence
Cadence enables global electronic design innovation and plays an essential role in the creation of today's integrated circuits and electronics. Customers use Cadence software and hardware, methodologies, and services to design and verify advanced semiconductors, consumer electronics, networking and telecommunications equipment, and computer systems. The company is headquartered in San Jose, Calif., with sales offices, design centers, and research facilities around the world to serve the global electronics industry. More information about the company, its products, and services is available at www.cadence.com.

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