SUNNYVALE, Calif.

AMD (NYSE: AMD) today publicly disclosed its strategy and roadmap to recapture market share in enterprise and data center servers by unveiling innovative products that address key technologies and meet the requirements of the fastest-growing data center and cloud computing workloads.

Additionally, AMD revealed details of its 2014 server portfolio including best-in-class Accelerated Processing Units (APUs), two- and four-socket CPUs, and details on what it expects to be the industry's premier ARM server processor. This is on the heels of announcing the general availability of the AMD Opteron™ X-Series processor, code named 'Kyoto,' which dominates the small-core server market on every performance benchmark. These forthcoming AMD Opteron™ processors bring important innovations to the rapidly changing compute market, including integrated CPU and GPU compute (APU); high core-count ARM servers for high-density compute in the data center; and substantial improvements in compute per-watt per-dollar and total cost of ownership.

'Our strategy is to differentiate ourselves by using our unique IP to build server processors that are particularly well matched to a target workload and thereby drive down the total cost of owning servers. This strategy unfolds across both the enterprise and data centers and includes leveraging our graphics processing capabilities and embracing both x86 and ARM instruction sets,' said Andrew Feldman, general manager of the Server Business Unit, AMD. 'AMD led the world in the transition to multicore processors and 64-bit computing, and we intend to do it again with our next-generation AMD Opteron families.'

In 2014, AMD will set the bar in power-efficient server compute with the industry's premier ARM server CPU. The 64-bit CPU, code named 'Seattle,' is based on ARM Cortex™-A57 cores and is expected to provide category-leading throughput as well as setting the bar in performance-per-watt. AMD will also deliver a best-in-class APU, code named 'Berlin.' 'Berlin' is an x86 CPU and APU, based on a new generation of cores named 'Steamroller.' Designed to double the performance of the recently available 'Kyoto' part, 'Berlin' will offer extraordinary compute-per-watt that will enable massive rack density. The third processor announced today is code named 'Warsaw,' AMD's next-generation 2P/4P offering. It is optimized to handle the heavily virtualized workloads found in enterprise environments including the more complex compute needs of data analytics, xSQL and traditional databases. 'Warsaw' will provide significantly improved performance-per-watt over today's AMD Opteron™ 6300 family.

Seattle

'Seattle' will be the industry's only 64-bit ARM-based server SoC from a proven server processor supplier. 'Seattle' is an 8- and then 16-core CPU based on the ARM Cortex-A57 core and is expected to run at or greater than 2 GHz. The 'Seattle' processor is expected to offer 2-4X the performance of AMD's recently announced AMD Opteron X-Series processor with significant improvement in compute-per-watt. It will deliver 128GB DRAM support, extensive offload engines for better power efficiency and reduced CPU loading, server caliber encryption, and compression and legacy networking including integrated 10GbE. It will be the first processor from AMD to integrate AMD's advanced Freedom™ Fabric for dense compute systems directly onto the chip. AMD plans to sample 'Seattle' in the first quarter of 2014 with production in the second half of the year.

Berlin

'Berlin' is an x86-based processor that will be available both as a CPU and APU. The processor boasts four next-generation 'Steamroller' cores and will offer almost 8X the gigaflops per-watt compared to current AMD Opteron™ 6386SE processor. It will be the first server APU built on AMD's revolutionary Heterogeneous System Architecture (HSA), which enables uniform memory access for the CPU and GPU and makes programming as easy as C++. 'Berlin' will offer extraordinary compute per-watt that enables massive rack density. It is expected to be available in the first half of 2014.

Warsaw

'Warsaw' is an enterprise server CPU optimized to deliver unparalleled performance and total cost of ownership for two- and four-socket servers. Designed for enterprise workloads, it will offer improved performance-per-watt, which drives down the cost of owning a 'Warsaw'-based server while enabling seamless migration from the AMD Opteron 6300 Series family. It is a fully compatible socket with identical software certifications, making it ideal for the AMD Open 3.0 Server – the industry's most cost effective Open Compute platform. It is expected to be available in the first quarter of 2014.

About AMD

AMD (NYSE: AMD) is a semiconductor design innovator leading the next era of vivid digital experiences with its ground-breaking AMD Accelerated Processing Units (APUs) that power a wide range of computing devices. AMD's server computing products are focused on driving industry-leading cloud computing and virtualization environments. AMD's superior graphics technologies are found in a variety of solutions ranging from game consoles, PCs to supercomputers. For more information, visit http://www.amd.com.

Cautionary Statement

This press release contains forward-looking statements concerning AMD, its server roadmap and strategy, its ability to recapture market share in enterprise and data center servers, and the timing, features and functionality of AMD's future products, which are made pursuant to the safe harbor provisions of the Private Securities Litigation Reform Act of 1995. Forward-looking statements are commonly identified by words such as "would," "may," "expects," "believes," "plans," "intends," "projects," and other terms with similar meaning. Investors are cautioned that the forward-looking statements in this document are based on current beliefs, assumptions and expectations, speak only as of the date of this document and involve risks and uncertainties that could cause actual results to differ materially from current expectations. Risks include the possibility that Intel Corporation's pricing, marketing and rebating programs, product bundling, standard setting, new product introductions or other activities may negatively impact the company's plans; the company may be unable to develop, launch and ramp new products and technologies in the volumes that are required by the market at mature yields on a timely basis; that the company's third party foundry suppliers will be unable to transition its products to advanced manufacturing process technologies in a timely and effective way or to manufacture the company's products on a timely basis in sufficient quantities and using competitive technologies; the company will be unable to obtain sufficient manufacturing capacity or components to meet demand for its products or will not fully utilize its commitment with respect to GLOBALFOUNDRIES microprocessor manufacturing facilities; that customers stop buying the company's products or materially reduce their operations or demand for the company's products; that the company may be unable to maintain the level of investment in research and development that is required to remain competitive; that there may be unexpected variations in the market growth and demand for its products and technologies in light of the product mix that the company may have available at any particular time or a decline in demand; that the company will require additional funding and may be unable to raise sufficient capital on favorable terms, or at all; that global business and economic conditions will not improve or will worsen; that demand for computers will be lower than currently expected; and the effect of political or economic instability, domestically or internationally, on the company's sales or supply chain. Investors are urged to review in detail the risks and uncertainties in the company's Securities and Exchange Commission filings, including but not limited to the Quarterly Report on Form 10-Q for the quarter ended March 31, 2013.

AMD, the AMD Arrow logo, AMD Opteron and combinations thereof, are trademarks of Advanced Micro Devices, Inc. Other names are for informational purposes only and may be trademarks of their respective owners.

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SAN JOSE, Calif. – Cypress Semiconductor Corp. (NASDAQ: CY) today announced that the editors of Embedded Computing Design magazine have named Cypress's new PSoC® 4 programmable system-on-chip architecture an Editor's Choice Product for the May issue. The architecture combines Cypress's best-in-class PSoC analog and digital fabric and industry-leading CapSense® capacitive touch technology with ARM®'s power-efficient Cortex™-M0 core. The truly scalable, cost-efficient architecture delivers PSoC's trademark flexibility, analog performance and integration, along with access to dozens of free PSoC Components™—'virtual chips' represented by icons in Cypress's PSoC Creator™ integrated design environment. The new PSoC 4 device class will challenge proprietary 8-bit and 16-bit microcontrollers (MCUs), along with other 32-bit devices.

Cypress recently announced the first two product families from its PSoC 4 architecture: the PSoC 4100 and PSoC 4200 families. The PSoC 4100 family, the lowest-cost ARM®-based PSoC, brings PSoC flexibility and integration to cost-sensitive, high-volume applications. The PSoC 4200 family features faster processor and ADC sampling speeds and PLD-based enhanced universal digital blocks (UDBs). In addition to capacitive sensing applications, PSoC 4 targets field-oriented control (FOC) motor control, temperature sensing, security access, portable medical, and many others. For more information, visit www.cypress.com/go/psoc4.

"We selected the PSoC 4 architecture as an Editor's Choice Product for its combination of flexible analog and digital resources with capacitive touch technology and the 32-bit ARM Cortex-M0 core,' said Warren Webb, Editorial Director at Embedded Computing Design.

'We are very pleased to earn this recognition from the esteemed editors of Embedded Computing Design,' said Bruce Weyer, Senior Vice President of Corporate Marketing at Cypress. 'With PSoC's trademark flexibility, best-in-class analog integration, low power and low cost, our new PSoC 4 families can address a huge range of applications for the embedded design community.'

The PSoC 4 architecture offers best-in-class power leakage of 150 nA while retaining SRAM memory, programmable logic, and the ability to wake up from an interrupt. In stop mode, it consumes only 20 nA while maintaining wake-up capability. It has the widest operating voltage range of any Cortex-M0-based device, enabling full analog and digital operation from 1.71V to 5.5V. The architecture facilitates integrated, high-performance custom signal chains and provides both configurable analog and flexible routing.

PSoC 4 leverages the PSoC Creator integrated design environment. The IDE's easy-to-use graphical interface enables designers to drag and drop pre-characterized, production-ready analog and digital IP blocks—PSoC Components—into a single PSoC device to create customized, feature-rich, and highly differentiated end products. Cypress's platform solution—PSoC 4, PSoC Creator and PSoC Components—simplifies and accelerates the design process, reduces bills of material, and provides extraordinary system value.

MCUs Can't. PSoC Can.
PSoC solutions bring the flash-based equivalent of a field-programmable ASIC to embedded designs without lead-time or NRE penalties. PSoC integrates configurable analog and digital circuits with an on-chip microcontroller, reducing component count and simplifying revisions. A single PSoC device can integrate as many as 100 peripheral functions, accelerating cycle time and improving quality while reducing board space, power consumption, and system cost.

PSoC 'future-proofs' designs, protecting them against last-minute specifications changes. It enables firmware-based changes at any point in the design cycle—even out in the field. All PSoC devices are dynamically reconfigurable, enabling designers to transform resources on-the-fly and to execute tasks with fewer ICs. For more information, please visit www.cypress.com/psoc. Free online training is available at www.cypress.com/psoctraining.

About OpenSystems Media
OpenSystems Media has been a leading publisher of electronics magazines, e-mail newsletters, websites, and product resource guides for more than 30 years. OpenSystems Media offers E-casts and Techcasts for engineers and provides interactive tools where engineers can communicate directly with presenters and top industry editors. Current publications include: DSP-FPGA.com, EDA Digest, Embedded Computing Design, Military Embedded Systems, PC/104 and Small Form Factors, VITA Technologies, Industrial Embedded Systems, and xTCA & CompactPCI Systems. For more information, visit www.opensystemsmedia.com.

About Cypress
Cypress delivers high-performance, mixed-signal, programmable solutions that provide customers with rapid time-to-market and exceptional system value. Cypress offerings include the flagship PSoC 1, PSoC 3, PSoC 4, and PSoC 5 programmable system-on-chip families. Cypress is the world leader in capacitive user interface solutions including CapSense touch sensing, TrueTouch® touchscreens, and trackpad solutions for notebook PCs and peripherals. Cypress is the world leader in USB controllers, which enhance connectivity and performance in a wide range of consumer and industrial products. Cypress is also the world leader in SRAM and nonvolatile RAM memories. Cypress serves numerous major markets, including consumer, mobile handsets, computation, data communications, automotive, industrial, and military. Cypress trades on the NASDAQ Global Select Market under the ticker symbol CY. Visit Cypress online at www.cypress.com.

# # #

Cypress, the Cypress logo, PSoC, CapSense, and TrueTouch are registered trademarks and PSoC Components and PSoC Creator are trademarks of Cypress Semiconductor Corp. All other trademarks are property of their owners.

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For applications that require more features, the SBench 6 Professional version is available for 1190 Euro (USD 1590 at the current exchange rate).

Key features of the Professional version  include:

Fast data acquisition supporting RAID disk arraysDesigned to acquire and handle GBytes of dataDisplay of analog data, digital data and frequency spectrumIntegrated analysis functionsImport and export filterEnhanced cursor functionsFast data preview functionState-of-the-art drag-and-drop technologyThread based program structureEasy usage with docking windows and context menus  The software is able to measure in oscilloscope mode as well as long time transient recording mode (streaming mode). A special feature of SBench 6 is the segmented view that allows display of segment based signals together with signals of a second timebase (ABA mode) as well as highly precise timestamps. Besides this SBench 6 data can be exported into ASCII, Wave and MATLAB, About Strategic TestThe company's first high-speed measurement board for PC's was designed in 1989. Today the product range consists of more than 300 Oscilloscope / Digitizer, Arbitrary Waveform Generator, high-speed Digital I/O and Digital Pattern Generator boards in the industry standard PCI Express, PCI, 3U PXI and 6U CompactPCI formats.

Strategic Test has offices in Boston USA and Stockholm Sweden.  A picture can be downloaded from the website at www.strategic-test.com/news  Press contacts:  Europe / Asia Nigel RobsonVortex Public RelationsUnited Kingdom Tel: +44 1481 233080Fax: +44 1481 233082Email: Nigel@vortexpr.com   Americas Leslie LoganPrecision CommunicationsUnited States Tel: 508-876-9400Mobile: 508-212-1266 Email: Leslie_Logan@comcast.net  

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'Consumers and automotive manufacturers have come to appreciate the benefits of connected cars, including improved safety and maintenance,' said John Sullivan, executive director of the M2M Platform Group for Verizon Enterprise Solutions. 'The AirPrime automotive module for the Verizon LTE network provides a cost-effective solution that enables automotive OEMs to take advantage of the higher bandwidth, lower latency, and network longevity LTE offers to provide better real-time navigation, location-based services, and streaming media as well as other infotainment services.'

4G LTE for in-vehicle connectivity

There is growing demand for the integration of 4G LTE technology into vehicles. The higher bandwidth and lower latency of 4G LTE deliver high performance in-vehicle wireless connectivity, meaning systems used for infotainment, navigation, and location-based services work more quickly and with less lag time. In addition, passengers can use the wireless connection for in-vehicle entertainment such as watching movies or playing games.

On the leading edge of network technologies, Verizon's 4G LTE is a logical choice for the automotive industry, where lengthy product development cycles and the expected longevity of a vehicle mean that OEMs require networking technology that is built for the future.

Sierra Wireless is a proven leader in providing LTE modules for integration into devices, having first delivered 4G LTE embedded modules in early 2011, including the MC7750 LTE/EVDO module for the Verizon Wireless network. The AirPrime AR7550 is part of the third generation of Sierra Wireless modules for LTE networks.

Multicore capability offers an entire M2M ecosystem on a module

The AirPrime AR7 offers an advanced, cost-effective solution for telematics and other in-vehicle connectivity needs. It includes a dedicated application processor to reduce design complexity and an application framework with specific automotive libraries to speed up development time. Additionally, integrated cloud connectivity simplifies ongoing management and maintenance over the lifetime of the vehicle. By eliminating the need for separate components to be sourced and assembled, the AR7 provides OEMs with simple and scalable wireless integration at a lower cost.

Automotive-grade for reliable long-term performance

Based on years of experience in working with automotive customers, Sierra Wireless developed the AirPrime AR7 module to meet demanding automotive manufacturing standards. It is designed and tested to real-world automotive scenarios, with TS 16949 certification, automotive quality processes (PPAP, 8D, FA) and low ppm rates, tolerance for extreme operating environments, and an extended operating temperature range of -40 degrees Celsius to +85 degrees Celsius.

With over a decade of experience, award-winning expertise and more than five million automotive-grade wireless modules shipped, Sierra Wireless is a market leader in wireless technologies for the automotive market.

'The AirPrime AR7 series leverages our expertise in both building devices for LTE networks and in providing modules that meet the needs of automotive OEMs,' said Didier Dutronc, Senior Vice President, M2M Embedded Solutions for Sierra Wireless. 'Combined with the power of the Verizon Wireless 4G LTE network, the AR7550 provides OEM customers with a simple, scalable way to build 4G into vehicles for both telematics and infotainment services.'

Availability

The Sierra Wireless AirPrime AR7550 module has achieved technical approval for operation on the Verizon Wireless network and samples are available to OEM customers now for testing and development purposes. Variants of the AirPrime AR7 module for LTE networks in other areas of the world are also sampling now.

For more information about the Sierra Wireless AirPrime AR7 embedded wireless module, please visit www.sierrawireless.com/NextGenModules or view a video about the new modules on the Sierra Wireless YouTube channel. To contact the Sierra Wireless Sales Desk, call +1 (604) 232-1488 or visit http://www.sierrawireless.com/sales.

Note to editors:

To view and download images of Sierra Wireless products, please visit http://www.sierrawireless.com/newsroom/productimages.aspx.

About Verizon Wireless

Verizon Wireless operates the nation's largest 4G LTE network and largest, most reliable 3G network. The company serves 98.9 million retail customers, including 93.2 million retail postpaid customers. Headquartered in Basking Ridge, N.J., with more than 73,000 employees nationwide, Verizon Wireless is a joint venture of Verizon Communications (NYSE, NASDAQ: VZ) and Vodafone (LSE, NASDAQ: VOD). For more information, visit www.verizonwireless.com. For the latest news and updates about Verizon Wireless, visit our News Center at http://news.verizonwireless.com or follow us on Twitter at http://twitter.com/VZWNews.

About Sierra Wireless

Sierra Wireless (NASDAQ: SWIR) (TSX: SW) is the global leader in machine-to-machine (M2M) devices and cloud services, delivering intelligent wireless solutions that simplify the connected world. We offer the industry's most comprehensive portfolio of 2G, 3G and 4G embedded modules and gateways, seamlessly integrated with our secure M2M cloud services. Customers worldwide, including OEMs, enterprises, and mobile network operators, trust our innovative solutions to get their connected products and services to market faster. Sierra Wireless has more than 850 employees globally and has R&D centers in North America, Europe and Asia. For more information, visit www.sierrawireless.com.

'AirPrime' and 'AirVantage' are trademarks of Sierra Wireless. Other product or service names mentioned herein may be the trademarks of their respective owners.

Forward Looking Statements

This press release contains forward-looking statements that involve risks and uncertainties. These forward-looking statements relate to, among other things, plans and timing for the introduction or enhancement of our services and products, statements about future market conditions, supply conditions, channel and end customer demand conditions, revenues, gross margins, operating expenses, profits, and other expectations, intentions, and plans contained in this press release that are not historical fact. Our expectations regarding future revenues and earnings depend in part upon our ability to successfully develop, manufacture, and supply products that we do not produce today and that meet defined specifications. When used in this press release, the words "plan", "expect", "believe", and similar expressions generally identify forward-looking statements. These statements reflect our current expectations. They are subject to a number of risks and uncertainties, including, but not limited to, changes in technology and changes in the wireless data communications market. In light of the many risks and uncertainties surrounding the wireless data communications market, you should understand that we cannot assure you that the forward-looking statements contained in this press release will be realized.

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CHANDLER, Ariz. [NASDAQ: MCHP] — Microchip Technology Inc., a leading provider of microcontroller, mixed-signal, analog and Flash-IP solutions, today introduced a family of serial EEPROM devices that feature a unique, pre-programmed 32-bit serial number for customers requiring unique IDs in their applications. For applications needing longer than 32-bit IDs, the unique ID can be extended to 48-bit, 64-bit, 96-bit, 128-bit and other lengths by increasing the number of bytes read from memory. Because the 32-bit ID is unique within these devices, any longer bit sequence is also unique. These 2 Kb serial EEPROM devices are available in standard busses, such as I2C™, SPI and Microwire, and come with up to 1.5 Kb of memory that can be used as a standard EEPROM. Additionally, Microchip released a 256 Kb I2C unique-ID device, which, in addition to the 32-bit serial number, also contains the IEEE EUI-48™ and IEEE EUI-64™ MAC addresses. These IDs are in a write-protected area of the memory, giving users up to 224 Kb of EEPROM to use in their applications. Microchip ensures this 32-bit ID is unique across the entire family of 24AA02UID, 24AA025UID, 11AA02UID, 25AA02UID and 24AA256UID unique-ID EEPROM devices.

Microchip also added to its existing EUI-48™ MAC Address portfolio by introducing a family with pre-programmed EUI-64™ MAC Addresses. These 2 Kb EEPROM devices are available in the I2C,SPI and UNI/O® bus, which provide easy and inexpensive access to MAC addresses, and feature up to 1.5 Kb of EEPROM that can be used for storing configuration settings, or as a scratch-pad area for buffering small amounts of data. The 24AA02E64, 24AA025E64, 11AA02E64 and 25AA02E64 serial EEPROM devices have a built-in 64-bit Extended Unique Identifier (EUI) that is needed to identify the network hardware's physical address. These built-in MAC addresses enable designers to buy addresses only when needed, and also eliminate the need for serialization and programming.

The EUI-64 networking applications for the new EEPROMs are best suited for those involving Ethernet, Wi-Fi®, Bluetooth®, FireWire, ZigBee® and Microchip's MiWi™ protocol. These devices excel in a broad range of applications, including those in the consumer (wireless radios and printers, Bluetooth headsets, Internet-enabled LCD TVs and home automation) and industrial (Ethernet, USB and industrial automation) markets. The applications for the new unique-ID devices include those in the consumer, medical, industrial, automotive and networking markets. Examples of ideal end applications include printers, handheld devices, remote sensor modules, audio headsets, device authentication and identification for medical devices, wireless products and battery-operated products.

'The need for unique IDs and serial numbers has risen with the growing number of applications needing secure keys for both authentication and identification purposes. These are used in a variety of medical, consumer, connectivity, networking, automotive and wireless applications,' said Randy Drwinga, vice president of Microchip's Memory Products Division. 'The unique ID devices offer customers an easy, low-cost, plug-and-play solution for adding a serial number or unique ID in their application. With the unique ID pre-programmed into the EEPROM, customers can get started with these devices right away.'

Development Support

Microchip's unique ID EEPROM devices are supported by the MPLAB® Starter Kit for Serial Memory Products (Part # DV243003, $79.98), which is available today.

Pricing & Availability

The 24AA02UID and 24AA025UID devices are available now for sampling in 5/6-pin SOT-23, and 8-pin SOIC and PDIP packages for $0.16 each, in 10,000-unit quantities. The 24AA0256UID device is available in 8-pin SOIC, TSSOP and PDIP packages for $0.64 each. Volume production for these devices is expected in August.

The 25AA02UID is available now for sampling and volume production in 8-pin SOIC and 6-pin SOT-23 packages for $0.28 each, in 10,000 quantities. The 11AA02UID device is available now for sampling and volume production in 3-pin SOT-23 and 8-pin SOIC packages, for $0.23 each, in 10,000-unit quantities. The 24AA02E64 and 24AA025E64 is available now for sampling and volume production in 8-pin SOIC and 5/6-pin SOT-23 packages, for $0.17 each, in 10,000 unit quantities. The 25AA02E64 is available now for sampling and volume production in 8-pin SOIC and 6-pin SOT-23 packages, for $0.29 each, in 10,000 packages. The 11AA02E64 is available now for sampling and volume production in 8-pin SOIC and 3-pin SOT-23 packages, for $0.25 each, in 10,000-unit quantities.

For additional information, contact any Microchip sales representative or authorized worldwide distributor, or visit Microchip's Web site at http://www.microchip.com/get/TK4D. To purchase products mentioned in this press release, go to microchipDIRECT or contact one of Microchip's authorized distribution partners.

Follow Microchip:

• RSS Feed for Microchip Product News: http://www.microchip.com/get/4NXG
• Twitter: http://www.microchip.com/get/WLW3
• Facebook: http://www.microchip.com/get/5VCE
• YouTube: http://www.microchip.com/get/LXHB

About Microchip Technology
Microchip Technology Inc. (NASDAQ: MCHP) is a leading provider of microcontroller, mixed-signal, analog and Flash-IP solutions, providing low-risk product development, lower total system cost and faster time to market for thousands of diverse customer applications worldwide. Headquartered in Chandler, Arizona, Microchip offers outstanding technical support along with dependable delivery and quality. For more information, visit the Microchip website at http://www.microchip.com/get/PQ51.

Note: The Microchip name and logo, MPLAB, and UNI/O are registered trademarks of Microchip Technology Incorporated in the U.S.A. and other countries. MiWi is a trademark of Microchip Technology Inc. in the U.S.A. and other countries. All other trademarks mentioned herein are the property of their respective companies.

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Striker is scheduled to present at 12:45 p.m. MT on June 7. His presentation, 'Cutting the Cord: Choosing a Battery Architecture to Satisfy Product & Safety Requirements,' will explore ways to safely and efficiently integrate batteries into an overall system design, and aspects to consider when designing and developing portable, compact devices.

Recently, Logic PD introduced a free, interactive battery power design tool to help product designers and developers predetermine the battery power requirements for new products. The company also made a significant advancement toward meeting the demand for instant-on devices. Logic PD developed proprietary software that enables Logic PD's System on Module (SOM) customers to reduce the boot time required for battery-powered devices to less than one second.

Logic PD also developed WattsonTM, a power measurement and performance monitoring application that delivers real-time graphical feedback and data logging capabilities without the need for external oscilloscopes and meters. Using this information guides designers to the lowest power and highest performance software combination for a particular product. Wattson is instrumental in helping to minimize power in all operational modes, which maximizes battery life in the end product.
 
To try Logic PD's battery power design tool, visit: http://powerdesign.logicpd.com/.
 
To learn more about battery power design considerations, listen to this podcast featuring Curt McNamara, a principal electrical engineer at Logic PD: http://www.logicpd.com/innovation/point-of-view/battery-powered-design-podcast/
 
About the Speaker
Ryan Striker is a senior electrical engineer at Logic PD with nearly 10 years of experience in systems engineering. His areas of expertise include battery safety, portable devices, and design for manufacturability and test. Striker focuses on battery powered and multi-radio systems for clients in various industries.
 
About Logic PD
Logic PD is a product innovation expert with the ability to discover, design, develop and deliver market-leading products under one roof. Logic PD's experienced team of creative problem solvers and cutting-edge modular technology products supported by its partner ecosystem enable companies to control costs, reduce risk and deliver innovative products to market faster. The company is headquartered in Minneapolis, with offices in Austin, Boston and San Diego. For more information, visit www.logicpd.com.

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Advanced radio frequency integration has been a key driver in the explosive growth of mobile device capability and sophistication. Millimeter-wave bandwidth has the ability to support Gb/s wireless communications, dramatically expanding opportunities for mobile backhaul, small cell infrastructure, and data center overlay network deployment.

The frequency range of the ICs is well suited for high-resolution radar imaging applications due to its short wavelength, relatively low atmospheric attenuation, and ability to penetrate debris. The ICs enable radar technology to be scaled down, giving pilots the ability to penetrate fog, dust and other vision impairing obstructions.

'This transceiver presents the highest level of integration achieved so far in a silicon-based solution for millimeter-wave frequency applications,' said Dr. Alberto Valdes-Garcia, IBM Research, Communications and Computation Subsystem Group. 'It is a key step toward phased-array systems of the future that are scalable, low-volume, light-weight, and low-cost.'

About the Integrated Circuit and Scalable Array Assembly Technology

The packaged transceiver operates at frequencies in the range of 90-94GHz and is implemented as a unit tile, integrating four phased array ICs and 64 dual-polarized antennas. By tiling packages next to one another on a circuit board, scalable phased arrays of large aperture can be created while maintaining uniform antenna element spacing. The beamforming capabilities enabled by hundreds of antenna elements will allow for communications and radar imaging applications that will extend over a range of kilometers.

Each of the four phased-array ICs in a tile integrates 32 receive and 16 transmit elements with dual outputs to support 16 dual polarized antennas. Multiple operating modes are supported, including the simultaneous reception of horizontal and vertical polarizations. Fabricated using an advanced IBM SiGe semiconductor process, the ICs also integrate frequency synthesis and conversion as well as digital control functions.

The complete scalable solution, which includes antennas, packaging, and transceiver ICs, transforms signals between millimeter-wave and baseband, all in a form factor smaller than an American nickel.

Mobile Back-Haul Technology

Mobile service providers have started to alleviate backhaul congestion issues by using E-band wireless links. E-Band spectrum, allocated by the FCC for point-to-point communications, covers frequencies in the range of 71-76 GHz, 81-86 GHz and 92-95 GHz, and enables wireless data transfer at very high rates. The atmospheric attenuation in this band is relatively low, making it well suited for supporting long-range communications links.

Today's E-band solutions consist of multi-chip modules and bulky mechanically aligned antennas. The newly developed compact scalable phased array solution provides electronic beam steering and the bandwidth to support Gb/s wireless communications.

Millimeter-wave Radar and Imaging Capabilities

Millimeter-wave spans 30 GHz to 300 GHz on the electromagnetic spectrum, 10 to 100 times higher than the frequencies used for mobile phones and Wi-Fi. Frequencies in the range of 90-94GHz are well suited for short and long range, high-resolution radar imaging.

Weather, debris and other vision impairing obstructions often leave aircraft pilots helpless, but 94GHz radar imaging technology could alleviate this problem. Moreover, the design's support for two antenna polarizations—with minimal increase in footprint—provides a further advantage while navigating through fog and rain.

IBM will debut the phased-array transceiver design at the IEEE Radio Frequency Integrated Circuit Symposium in Seattle, WA, on Tuesday, June 4th, 2013. The work was partially funded by the Defense Advanced Research Projects Agency (DARPA) Strategic Technology Office (STO).

The views, opinions, and/or findings contained in this document are those of the author and should not be interpreted as representing the official views or policies, either expressed or implied, of the Defense Advanced Research Projects Agency or the Department of Defense.

Related resources

Images

- IBM research scientists create expandable 64 antenna array chip for low-frequency bandwidth spectrum: http://www-03.ibm.com/press/us/en/photo/41229.wss

Packaged view of the intergrated circuit. The above photo depicts the size of the millimeter wave chip. Each of the 64 diamond shaped objects is an antenna. The spacing of these antennas is exact and allows for additional chips to be aligned next to the above one and expand the array.

- IBM researchers debut low-frequency wireless chip fabricated using IBM SiGe BiCMOS technology: http://www-03.ibm.com/press/us/en/photo/41230.wss

Fully integrated phased array IC. 6.7mm X 6.7mm. Fabricated in IBM SiGe BiCMOS technology. The IC integrates 32 receive and 16 transmit elements with dual outputs to support 16 dual polarized antennas

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TAIPEI, TAIWAN – Qualcomm Incorporated (NASDAQ: QCOM) today announced that its wholly-owned subsidiary, Qualcomm Technologies, Inc., has expanded its Qualcomm Snapdragon™ 800 processors portfolio to include support for Microsoft Windows RT 8.1. Qualcomm Snapdragon 800 processors feature an integrated multimode 3G/4G LTE modem and CPU speeds of up to 2.2 GHz per core. Other capabilities include USB 3.0 and support for Windows RT 8.1 features and services. Qualcomm Technologies and Microsoft will continue to work together on the next level of advanced mobile computing and Microsoft will offer a free software update to Windows RT 8.1. The free update will be available in the Windows Store later this year. Qualcomm Snapdragon 800 processors and Windows RT 8.1 are designed to enable OEMs to differentiate their newest products and offer outstanding mobile user experiences. New devices based on Qualcomm Snapdragon 800 processors and Windows RT 8.1 are expected to be available later this year.

Last year Microsoft Corp. reimagined and redesigned Windows, and, for the first time Windows ran on an ARM chip. The result of bringing Windows RT together with Qualcomm Snapdragon processors has enabled Qualcomm Technologies customers to build tablets, convertibles and notebooks that are thin and fan-less, and deliver speedy performance with long lasting battery life. At Computex Taipei 2013, Qualcomm Technologies is building on this innovation and collaboration with Microsoft by showing Qualcomm Snapdragon 800 processors running on an early version of Windows RT 8.1.

'Qualcomm Technologies is committed to the Windows ecosystem and we are excited to be supporting Windows RT 8.1 with our flagship Snapdragon 800 processors,' said Luis Pineda, senior vice president of product management, computing and consumer products at Qualcomm Technologies, Inc. 'Our Snapdragon 800 processors offer the best combination of high performance, efficient power usage and LTE network support and will help enable greater flexibility and connectivity options to Microsoft and device manufacturers. Snapdragon 800 processors deliver significant performance improvements across the entire SoC along with support for new Windows RT 8.1 features and services.'

'We are excited to continue working with Qualcomm Technologies on the next iteration of Windows RT 8.1 with their new Snapdragon 800 processors,' said Mike Anguilo, Corporate Vice President, Planning and PC Ecosystem, Microsoft Corp. 'The new Qualcomm Snapdragon 800 processors support our commitment to providing our customers with best-in-class capabilities. Our customers will now have the opportunity to leverage the numerous advantages of these new processors, including integrated 4G/LTE connectivity and outstanding device performance.'

Qualcomm Snapdragon 800 processors feature a tightly integrated system of leading-edge computing components. Please visit http://www.qualcomm.com/snapdragon/processors/800 for more details about Qualcomm Snapdragon 800 processors

About Qualcomm Incorporated
Qualcomm Incorporated (NASDAQ: QCOM) is the world leader in 3G, 4G and next-generation wireless technologies. Qualcomm Incorporated includes Qualcomm's licensing business, QTL, and the vast majority of its patent portfolio. Qualcomm Technologies, Inc., a wholly-owned subsidiary of Qualcomm Incorporated, operates, along with its subsidiaries, substantially all of Qualcomm's engineering, research and development functions, and substantially all of its products and services businesses, including its semiconductor business, QCT. For more than 25 years, Qualcomm ideas and inventions have driven the evolution of digital communications, linking people everywhere more closely to information, entertainment and each other. For more information, visit Qualcomm's website, OnQ blog, Twitter and Facebook pages.

Qualcomm and Snapdragon are trademarks of Qualcomm Incorporated, registered in the United States and other countries. All Qualcomm Incorporated trademarks are used with permission. Other products or brand names may be trademarks or registered trademarks of their respective owners.

— WebWireID175479 —

• 580 million mid-range smartphones and tablets are forecast to be sold in 2015

• Cortex-A12 processor delivers 40 percent more performance than Cortex-A9 and brings premium features such as virtualization to the mid-range mobile device market; efficiency profile also makes it ideal for DTV and home networking;

• Cortex-A12 processor brings optimum performance and maximum efficiency of big.LITTLE processing to mid-range smartphones and tablets;

• Mali-T622 GPU offers an efficient and qualified OpenGL ES 3.0 solution and smallest Full Profile GPU Compute solution, putting even greater compute power into the hands of more mobile users;

• Mali-V500 video IP solution reduces system bandwidth and power, while enabling the protection of premium video content with TrustZone support.

CAMBRIDGE, UK and TAIPEI - Today at Computex, ARM announced an optimized IP solution designed to power the 580 million mid-range mobile devices expected over the next two years. The mid-range market is projected to exceed the number of premium smartphones and tablets beginning in 2015. Targeted at the mid-range market, this new suite of ARM IP is optimized for power, performance and die size. Used together, this suite of IP will provide consumers with premium features like virtualization, big.LITTLE processing and GPU compute at mid-range price points.

The suite extends the ARM Cortex-A processor and ARM Mali-T GPU series with the Cortex-A12 processor and Mali-T622 GPU and introduces a new video IP product, the Mali-V500. With support from ARM POP technology and the ARM Development Studio 5 (DS-5) toolchain, ARM partners can deliver smartphones and tablets with higher efficiency and reduced time to market. Partners will announce their plans in due course, but ARM expects this IP solution will be in mobile devices by mid-2014.

"Mobile users expect a range of devices at different price points and for a mid-range mobile experience to include some high end mobile features. With a billion smartphones predicted to ship in 2013 and tablets projected to out-ship notebook PCs, device-makers can now provide quality, high-performance mobile products with the features that matter the most, at a range of price points, said Ian Drew, chief marketing officer and executive vice president, ARM. The market is evolving at an amazing rate and there is now a choice of solutions for semiconductor companies and for mobile device-makers. Our suite of optimized IP expands the choice for the mid-range mobile market."

Bringing Premium Features to the Mid-Range

The energy-saving technology known as ARM big.LITTLE processing is only just coming to high-end devices today, but now can be designed into mid-range smartphones, allowing users to do more with their devices. The Cortex-A12 processor offers ARM partners a 40 percent performance uplift in the same power envelope when compared to the successful Cortex-A9 processor. The Cortex-A12 processor builds on best-in-class efficiency as a standalone solution and additionally supports the innovative big.LITTLE processing technology with the Cortex-A7 processor. The Cortex-A12 introduces features found in premium smartphones and tablets to mid-range devices, including virtualization. Additional information for the Cortex-A12 processor can be found here: http://blogs.arm.com/smart-connected-devices/981-cortex-a12-diversification-in-the-mobile-market-serving-the-mid-range/

Ready for the Next Graphics Standards

The Mali-T622 GPU, is OpenGL ES 3.0 conformant, supports the Renderscript and OpenCL APIs, and is the smallest full profile GPU Compute solution available for mobile devices. The Mali-T622 GPU brings a rich, visual experience to mid-range mobile devices with functionality only now becoming available in the highest-end premium smartphones and tablets. It does all of this while providing a 50 percent energy-efficiency improvement over first-generation Mali-T600 series products. A closer look at the Mali-T622 GPU can be found here: blogs.arm.com/multimedia/979-mali-t622-bringing-full-profile-gpu-compute-to-mid-range-devices/

High-Quality Video in Mid-range Mobile

The energy-efficient Mali-V500 video solution provides dedicated video processing and reduces system bandwidth requirements by more than 50 percent compared to currently available solutions. The Mali-V500 is a multicore video solution, scaling from a single core capable of 1080p/60 encode and decode to multiple cores supporting ultra-high definition 4K at a blistering 120 frames per second. Additionally, the Mali-V500 video solution was architected with support for TrustZone security technology enabling efficient, hardware-backed security for movie and TV content from download to display. More details on the Mali-V500 video solution are available here: blogs.arm.com/multimedia/977-a-new-branch-for-the-mali-family-tree-mali-video-featuring-the-mali-v500/

ARM Brings it all Together

ARM is best positioned to ensure its IP can be combined together for optimal performance with minimal energy consumption across the entire SoC, thus allowing every task to be run on the right processor. System advances include:

• ARM POP IP supports leading 28-nanometer foundry processes. ARM POP IP is the only implementation solution which is co-developed and co-optimized, offering the best design points and fastest time to market for the Cortex-A12 processor and Mali-T622 GPU. More information on ARM POP IP, featuring Artisan physical IP, available for this optimized suite can be found here: http://blogs.arm.com/soc-design/975-pop-ip-for-the-cortex-a12-processor-enabling-the-next-billion-smartphones/

• ARM DS-5 toolchain to support development and optimization of software for systems based on the Cortex-A12 processor, Mali-T622 GPU, and CoreLink CCI-400 cache coherent interconnect. Complemented by the addition of the ARM Fast Models simulation library, the DS-5 toolchain enables early software development and system-wide performance and power optimization. Learn more about system software optimization here: blogs.arm.com/software-enablement/980-want-to-get-more-out-of-your-hardware-think-system/

"The immense success of Cortex-A9 processor-based SoCs, and the demand for highest performance at best energy efficiency, makes the new Cortex-A12 processor the perfect choice for VIA and will help drive our strong commitment to provide leading-edge platforms for our partners and the ARM ecosystem. The premium feature set of the Cortex-A12 processor will enable new use cases previously only limited to high-end devices and will allow the mid-range mobile device segment to continue growing rapidly," said Tzu-Mu Lin, senior vice president, VIA Technologies.

About ARM

ARM designs the technology that is at the heart of advanced digital products, from wireless, networking and consumer entertainment solutions to imaging, automotive, security and storage devices. ARMs comprehensive product offering includes RISC microprocessors, graphics processors, video engines, enabling software, cell libraries, embedded memories, high-speed connectivity products, peripherals and development tools. Combined with comprehensive design services, training, support and maintenance, and the companys broad Partner community, they provide a total system solution that offers a fast, reliable path to market for leading electronics companies. Find out more about ARM by following these links:

Download Shared Purpose 8 Leadership Lessons for the Ecosystem Age
The secrets of success from the Connected Community surrounding ARM

Find out more about ARM by following these links:
ARM website: http://www.arm.com/
ARM Connected Community®: http://www.arm.com/community/
ARM Blogs: http://blogs.arm.com/
ARMFlix on YouTube: http://www.youtube.com/user/armflix

ARM on Twitter:
• http://twitter.com/ARMPROffice
• http://twitter.com/ARMMultimedia
• http://twitter.com/ARMMobile
• http://twitter.com/ARMCommunity
• http://twitter.com/ARMEmbedded
• http://twitter.com/ARMSoC
• http://twitter.com/ARMTools
• http://twitter.com/SoftwareOnARM

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Presentation Covers Gold Spitting Contributing Factors
In the paper Developing a Fundamental Understanding of Gold Spitting During Evaporation, Dr. Duckham considers factors that can contribute to gold 'spitting.' During evaporation processes, and in particular, the process of being deposited as a thin film onto a semiconductor wafer, gold can be prone to eject droplets that solidify into solid particles on the wafer, otherwise known as spitting.

Top Recognition in Poster Session
In the Poster Session of the Show, Dr. Duckham's presentation was honored as the 'Best Poster Award' by ballot vote of conference attendees. The popular poster generated much traffic and numerous discussions with process engineers from the compound semiconductor industry regarding how gold spitting can impact sputtering yields and product quality.

Materion Continues R&D
The highly controlled, gold spitting experiments were conducted at the Applications Laboratory in Westford, MA. The new lab expands Materion's ability to work with other company facilities and its diverse experts. This collaboration is reflected in the gold spitting paper, which in addition to Dr. Duckham, was co-authored by Lawrence Luke, Applications Engineer, Materion Microelectronics & Services, and Robert Sprague, Director of Technology, Materion Barr Precision Optics & Thin Film Coatings.

Key Factors in Spitting
The Lab studies discovered that the factors affecting spitting can be divided into two broad groups: 1) evaporation process parameters and 2) material quality. If these parameters are not carefully regulated, a process results with significant variation in spitting. For a controlled process, the quality of the gold (Au) plays a significant role in the degree of spitting. That is why Materion's level of Au purity and cleanliness reduces the amount of spitting.

View the full technical paper…

Materion Microelectronics & Services is a Materion Corporation business.  Materion Corporation (NYSE: MTRN), is headquartered in Mayfield Heights, Ohio. The Company, through its wholly owned subsidiaries, supplies highly engineered advanced enabling materials to global markets. Products include precious and non-precious specialty metals, inorganic chemicals and powders, specialty coatings, specialty engineered beryllium alloys, beryllium and beryllium composites, and engineered clad and plated metal systems.

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Eindhoven, Netherlands — Building on its industry-leading position in in-vehicle networking (IVN), NXP Semiconductors N.V. (Nasdaq: NXPI) today introduced Mantis™, a new family of HS-CAN transceivers. Mantis (TJA1044T and TJA1057T) and Mantis GT (TJA1044GT and TJA1057GT) offer a feature set targeting 12 V automotive applications and deliver excellent EMC performance, with the high-end 'GT' variant guaranteeing critical parameters for CAN FD (Flexible Data rate) networks. All members of the Mantis family are dual-sourced from locations in the Netherlands and Singapore to provide an agile, high-capacity and secure manufacturing base.

With the market demanding continued productivity of basic CAN functions, Mantis offers a feature set tailored to fulfill the requirements of mainstream automotive applications. In particular, Mantis takes a step forward by uniquely meeting today's EMC emission limits at 500 kbps without requiring a common-mode choke – and with a choke, these same limits can be met at data rates of 2 Mbps in CAN FD networks. In addition, the devices' bus pins are tolerant to ±42 V, and ESD meets automotive requirements of 6 kV (IEC-61004-2) with typical standby currents of 10 µA.

'Mantis is designed as a best-in-class HS-CAN transceiver for standard automotive applications, both now and in the future. We continue to raise the bar in the industry,' said Toni Versluijs, vice president and general manager, in-vehicle networking business, NXP Semiconductors. 'As the industry continues to innovate to extract more from traditional CAN networks, Mantis GT addresses many of the concerns around CAN FD. With this product, NXP has shown that it's possible to also achieve excellent EMC performance at speeds of 2 Mbps and beyond, representing a major validation of the CAN FD standard.'

Mantis GT also introduces loop delay symmetry, a new parameter which guarantees the integrity of CAN communication is preserved at higher speeds, resulting in a transceiver that is optimized for data rates of 2 Mbps and over. This is an important development for the industry's adoption of CAN FD, which depends on semiconductor solutions being able to support CAN communication at higher speeds.
Features

• Fully ISO-11898-2 and ISO-11898-5 (TJA1044T and TJA1044GT only) compliant transceivers
• Dual sourced from ICN8 Nijmegen and SSMC Singapore
• Maximum voltage on CAN pins: ±42 V
• 6kV ESD handling capability on bus pins (IEC -61004-2 and HBM)
• EMC compliant up to 2 Mbps, according 'Hardware Requirements for LIN, CAN and FlexRay Interfaces in Automotive Application – Audi, BMW, Daimler, Porsche, Volkswagen – Revision 1.3 / 2012'
• Logic levels compatible with 3.3 V and 5 V microcontrollers
• Standby current (TJA1044T and TJA1044GT): 10 µA typical
• Fully automotive qualified to AEC-Q100
• Available in SO8 package

Links

• VIDEO: NXP Mantis: A New Standard for HS-CAN Transceivers: http://youtu.be/fD9vXPkw7j8
• NXP Mantis family of HS-CAN transceivers: http://www.nxp.com/products/interface_and_connectivity/transceivers/can_transceivers/series/TJA1044T_TJA1057T.html
• NXP CAN transceivers: http://www.nxp.com/products/automotive/transceivers/

About NXP Semiconductors

NXP Semiconductors N.V. (NASDAQ: NXPI) provides High Performance Mixed Signal and Standard Product solutions that leverage its leading RF, Analog, Power Management, Interface, Security and Digital Processing expertise. These innovations are used in a wide range of automotive, identification, wireless infrastructure, lighting, industrial, mobile, consumer and computing applications. A global semiconductor company with operations in more than 25 countries, NXP posted revenue of $4.36 billion in 2012. Additional information can be found by visiting www.nxp.com.

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TOKYO, Japan — Renesas Electronics Corporation (TSE: 6723), a premier supplier of advanced semiconductor solutions, today announced the development of the µPD720115 USB 2.0 hub controller chip, which supports simultaneous USB communication and charging of portable devices such as smartphones and tablet PCs via a single USB connector.

The most important feature of the µPD720115 is its implementation of USB ports with battery charging functionality which supports the USB Battery Charging Specification, Revision 1.2 (USB BC 1.2). The µPD720115 will make it easier to develop products that support simultaneous data communication complying with the USB 2.0 standard and charging portable devices via a single USB connector, such as PCs, digital TVs, and charging adapters. It can help shorten system architecture development cycles and reduce development costs.

In recent years, the USB communication market has become divided into two segments as a result of faster data transfer speeds. The first segment centers around storage devices, such as hard disk drives, which require high-speed data transfer. It utilizes the USB 3.0 standard, which supports data transfer speeds up to 5 gigabits per second (5 Gbps). The second segment includes applications such as digital TVs, printers, audio components, and industrial equipment. This segment employs the earlier USB 2.0 standard, which supports data transfer speeds up to 480 megabits per second (480 Mbps). USB 2.0 remains a widely used interface for connecting devices of all sorts.

The European Commission (the executive of the EU) has adopted Micro USB as the standard charger interface for mobile phones, smartphones and tablet PCs sold in Europe. As a result, applications in which the communication USB ports of PCs and docking stations are used for charging such portable devices are increasing. The market for products complying with the USB 2.0 standard in these application fields is growing rapidly, and it is expected to continue to expand moving forward.

In response to this demand, Renesas decided to develop and introduce to the market the µPD720115, utilizing technology accumulated over many years of developing products with USB support. Renesas has long devoted considerable attention to the USB interface, offering a broad lineup of microcontroller (MCU) products equipped with USB functions. The µPD720115 is a USB hub controller suitable for a wide variety of systems requiring USB functionality, and is also ideal for extending the number of ports of a USB MCU.

Key Features of the New µPD720115:

(1) Supporting the USB BC 1.2 standard, for easy development of USB charging system architectures
The µPD720115 implements a total of four USB ports with battery charging functionality. It supports the USB BC 1.2 standard [Note 1], which supports charging currents of up to 1.5 amperes (A). Since the µPD720115 supports both USB communication and rapid battery charging in this way, developing a USB charging system architecture is easy.

(2) Built-in dual voltage regulators and clock output function, making it possible to build more compact systems at a lower cost
Comparable earlier products required external voltage regulators, but the µPD720115 integrates a 5 volt (V) and a 3.3 volt (V) regulator on-chip. This allows the user to employ the 5 V from the USB cable as a power supply without modification. There is no need to include an external regulator in the system design.
The µPD720115 also has a clock output function (24 MHz) to enable cascade connection [Note 2] of the USB ports to other µPD720115 chips or connection to other chips used by USB peripheral devices. This eliminates the need to add an external crystal oscillator for the lower-level chip, as was previously the case. The µPD720115 makes it possible to create a USB charging system architecture that is both lower in cost and more compact.

(3) Operating temperature range extending down to −40°, enabling use in a wide range of application fields
Comparable earlier products had an operating temperature range with a lower limit of 0° or above, but the µPD720115 extends this down to −40°. This provides support for the operating temperature range requirements of typical industrial equipment.

Moving forward, Renesas plans to actively develop USB products to meet evolving market requirements and to market them in a timely manner.

Refer to the separate sheet for the main specifications of the µPD720115 USB 2.0 hub controller chip.

Pricing and Availability

Samples of the µPD720115 USB 2.0 hub controller chip will start in June 2013. Mass production of the µPD720115 is scheduled to begin in September 2013 and is expected to reach a scale of 1,000,000 units per month in 2014. (Availability is subject to change without notice.)

[Note 1] Battery charging via the USB port utilizes the VBUS pin the USB connector. To control the current used to charge the connected portable device, USB BC 1.2 defines a mechanism for detecting whether or not the port of the connected device supports charging. A charging current of up to 1.5 A can be used.
[Note 2] To extend the number of ports, a port is connected to the port of a USB hub.

(Remarks)
Names of products or services mentioned in this press release are trademarks or registered trademarks of their respective owners.
About Renesas Electronics Corporation

Renesas Electronics Corporation (TSE: 6723), the world's number one supplier of microcontrollers, is a premier supplier of advanced semiconductor solutions including microcontrollers, SoC solutions and a broad range of analog and power devices. Business operations began as Renesas Electronics in April 2010 through the integration of NEC Electronics Corporation (TSE:6723) and Renesas Technology Corp., with operations spanning research, development, design and manufacturing for a wide range of applications. Headquartered in Japan, Renesas Electronics has subsidiaries in 20 countries worldwide. More information can be found at www.renesas.com.

The content in the press release, including, but not limited to, product prices and specifications, is based on the information as of the date indicated on the document, but may be subject to change without prior notice.

— WebWireID175016 —

San Jose, Calif. – Cypress Semiconductor Corp. (NASDAQ: CY), today introduced PSoC® Designer™ 5.4, a new version of its Integrated Design Environment (IDE) for the PSoC 1 Programmable System-on-Chip architecture. The new version includes over 40 new or enhanced User Modules, which are free 'Virtual Chips,' represented by an icon, that are used to integrate multiple ICs and system interfaces into a single PSoC device. Version 5.4 also offers multiple new features to make designing with PSoC faster and easier, including an Auto-Complete feature that automatically suggests variables, functions, and keywords as users type. The version marks another significant first for PSoC Designer, as it now allows customers to create their own User Modules, with complete control over the hardware, firmware, and graphical user interface.

Version 5.4 includes three new SmartSense™ User Modules that simplify usage of Cypress's industry-leading CapSense® capacitive touch-sensing technology. The new SmartSense2X_EMC User Module supports both the CY8C2xx45 and CY8C28xxx PSoC 1 families. SmartSense2X_EMC not only saves time by automatically tuning capacitive sensors and dynamically adjusting the tuning during operation, it also increases end-systems' immunity to electromagnetic interference, providing the ability to operate in high-noise environments. This functionality is ideal for home appliances and a broad range of additional markets.

'PSoC Designer now makes it easier than ever to integrate sophisticated functionality in embedded designs, including Cypress's world-class CapSense capacitive touch controls,' said Kapil Rai, Senior Director of PSoC 1 Products for Cypress. 'Version 5.4 opens up a new world of designs by giving engineers the power to create their own User Modules and take full advantage of PSoC's flexibility.'

Other key new user modules include a programmable current source and a scanning successive approximation analog-to-digital converter (SAR ADC). Instead of having to manually configure the hardware and firmware, users can simply drag and drop the scanning SAR ADC into their design to have it automatically measure voltages on any number of inputs. Users can download PSoC Designer 5.4 free of charge at www.cypress.com/psocdesigner.

User Modules can be dragged and dropped as icons into a design using PSoC Designer's graphical user interface. They are pre-tested and pre-characterized, and each comes with a datasheet that designers can use to customize the functionality for their specific designs. PSoC Designer 5.4 includes more than 160 of these User Modules, making designing with PSoC 1 devices fast and easy. In addition, PSoC Designer 5.4 boosts engineering efficiency through design re-use by enabling engineers to develop their own User Modules containing their own unique hardware and firmware IP. Designers can also create a customized graphical user interface to configure their User Modules.

PSoC Designer 5.4 contains 15 new example projects that show users how to build a wide array of PSoC systems. This version also includes a new graphical interface that makes it easier for users to sort and filter these example projects to find those of interest.

About PSoC Designer
PSoC Designer helps users harness the power and flexibility of PSoC 1 devices. By operating at a higher level of abstraction and not requiring ground-up firmware development, it enables new designs to be created, simulated and programmed to the targeted PSoC device in hours or days instead of in weeks or months. It provides the user with a catalog of peripheral functions called 'User Modules.' User modules take the configurable PSoC devices and create useful functions as diverse as counters, timers and PWMs, analog converters, both ADCs and DACs, communications links like UARTs, SPI and I2C, as well as comparators, programmable gain blocks, filters and even bootloaders. Each user module includes the hardware configuration data, startup code, an interrupt service routine when applicable, and a set of APIs.

PSoC — Because Change Happens
PSoC 1 devices employ a highly configurable system-on-chip architecture for embedded control design, offering a flash-based equivalent of a field-programmable ASIC without lead-time or NRE penalties. PSoC devices integrate configurable analog and digital circuits, controlled by an on-chip microcontroller, providing both enhanced design revision capability and component count savings. They include up to 32 Kbytes of Flash memory, 2 Kbytes of SRAM, an 8x8 multiplier with 32-bit accumulator, power and sleep monitoring circuits, and hardware I2C communications. Additionally, PSoC devices contain powerful analog functionality, such as delta-sigma analog-to-digital converters, operational amplifiers, and programmable switched capacitor networks.

The flexible PSoC digital and analog blocks allow designers to future-proof their products by enabling firmware-based changes during design, validation, production, and in the field. The unique PSoC flexibility shortens design cycle time and allows for late-breaking feature enhancements. All PSoC devices are also dynamically reconfigurable, enabling designers to morph internal resources on-the-fly, utilizing fewer components to perform a given task.

A single PSoC device can integrate as many as 100 peripheral functions saving customers design time, board space and power consumption while improving system quality and reliability. Customers can save as much as $10 in system costs. Learn more about PSoC products at www.cypress.com/psoc and receive free online training at www.cypress.com/psoctraining.

About Cypress
Cypress delivers high-performance, mixed-signal, programmable solutions that provide customers with rapid time-to-market and exceptional system value. Cypress offerings include the flagship PSoC 1, PSoC 3, PSoC 4, and PSoC 5 programmable system-on-chip families. Cypress is the world leader in capacitive user interface solutions including CapSense touch sensing, TrueTouch® touchscreens, and trackpad solutions for notebook PCs and peripherals. Cypress is the world leader in USB controllers, which enhance connectivity and performance in a wide range of consumer and industrial products. Cypress is also the world leader in SRAM and nonvolatile RAM memories. Cypress serves numerous major markets, including consumer, mobile handsets, computation, data communications, automotive, industrial, and military. Cypress trades on the NASDAQ Global Select Market under the ticker symbol CY. Visit Cypress online at www.cypress.com.

Cypress, the Cypress logo, PSoC, CapSense, and TrueTouch are registered trademarks, and PSoC Designer and SmartSense are trademarks of Cypress Semiconductor Corp. All other trademarks are the property of their respective owners.

— WebWireID174988 —

TOKYO—Toshiba Corporation (TOKYO: 6502) today announced that the company has developed second generation 19 nanometer process technology that it will apply to mass production of 2-bit-per-cell 64 gigabit NAND memory chips later this month.

Toshiba has used the new generation technology to develop the world's smallest* 2-bit –per-cell 64 gigabit NAND memory chips, with an area of only 94 square millimeters. Using a unique high speed writing method, the next generation chips can achieve a write speed of up to 25 megabytes a second - the world's fastest class* in 2-bit-per-cell chips.

Toshiba is also developing 3-bit-per-cell chips by using this process technology and aims to start mass production in the second quarter of this fiscal year. The company will initially introduce 3-bit, multi-level-cell products for smartphones and tablets by developing a controller compatible with eMMC, and will subsequently extend application to notebook PCs by developing a controller compliant with solid state drives (SSD).

NAND flash memory is an essential component of a diverse line-up of consumer products, including memory cards, smartphones, tablets and notebook PCs, and is increasingly deployed in enterprise products, including SSD for data centers. Looking to the future, Toshiba will continue to promote product innovation and development as a leading company in the market, able to respond to a wide variety of clients' needs.

---
Information in the press releases, including product prices and specifications, content of services and contact information, is current on the date of the press announcement, but is subject to change without prior notice.

— WebWireID174966 —

Thousands of such systems are in use across the U.S. According to Sue Kelly, Sebastopol City Engineer, between 2006 and 2011, the City of Sebastopol has installed a total of 13 IRWL enhanced crosswalk safety solutions using the LightGuard Systems Smart Crosswalk™ at various intersections along State Highway 116 in Sebastopol as part of our "Street Smart Sebastopol" program. 

This program is aimed at improving "walkability" in our downtown areas and reducing the number of traffic and pedestrian crossing accidents downtown, where we have two state highways intersecting. During construction of the most recent phase (9 intersections) the city received great support from President/CEO Michael Harrison and his crew at LightGuard, when they had questions about proper installation and inspections of traffic calming solutions. The city has been highly pleased with the performance of the systems, most of which are now between 2-3 years old.

Although there is no specific data to support claims of "safer" streets, city officials can report plenty of anecdotal evidence that these street crossing safety systems have improved the pedestrian experience on this busy highway which also happens to be our Main Street. The public response and feedback have been overwhelmingly positive. When the City of Sebastopol applied for the Caltrans Encroachment Permit to install the first of these crossing systems in 2004, they were "non-standard" facilities for state highways, and the team at Crosswalks.com had to work through quite a long process with Caltrans to gain their approval.

More recently, the team actually received a call from a Caltrans engineer asking them to share the contract specifications for the LightGuard equipment, so that he could use it in the design of an improvement the State was working on in Marin County.

— WebWireID174925 —

Over the years, Tektronix has partnered in many ways with Oregon State to drive educational excellence," said Dr. Kevin Ilcisin, Chief Technology Officer, Tektronix. "In return, Tektronix has attracted productive and very innovative employees from OSU's undergraduate and graduate programs who are contributing to Tektronix's long term success. With the ever competitive environment of our business, it is imperative that universities educate graduates with broad technical skills, effective interpersonal and leadership skills, and ability to develop innovative solutions to the most challenging problems."

This latest gift to OSU by the Tektronix Foundation, a private foundation funded each year with a portion of Tektronix' profits, will support:

Creative Collaboratory - Modeled after the MIT media lab, the Oregon State Collaboratory enables teams of engineering students to develop working prototypes of new electrical systems. Project areas include sensing and informatics in living systems, personalized mobile platforms, and smart energy living. The latest commitment supplements the $80,000 seed funding provided by the Tektronix Foundation in September 2012 and supports Tektronix scholars through the end of the year.

SAE Vehicle Teams - OSU undergraduate and graduate students participating in this program design and build vehicles to compete in student competitions around the world. Vehicles include electric and internal combustion formula cars as well as a mini-Baja vehicle. The formula vehicles are designed, built, and compete in collaboration with DHBW-Ravensburg University in Germany. The SAE vehicle teams have achieved a remarkable total of six first-place finishes over the past two years alone. In addition, the SAE vehicle teams have also received a donation of a 289 Digital Multi Meter from Tektronix' sister company, Fluke.

Solar Car Challenge - Tektronix continues to support the OSU Solar Vehicle Team. Using funding from Tektronix, the team will be able to purchase new solar cells to upgrade its solar array in order to compete in the Formula Sun Grand Prix to be held October 2013 in Irvine, Calif. The OSU Phoenix is a three-wheeled, single passenger vehicle powered exclusively by solar energy. The team uses Tektronix oscilloscopes and Keithley meters SourceMeter® SMU instruments to help the vehicle achieve maximum efficiency.

"Support from industry partners like Tektronix is critical to the university," said Terri Feiz, head of OSU's School of Electrical Engineering and Computer Science. "Tektronix not only helps to fund valuable student research programs, but supports OSU in creative educational opportunities that prepare our students to enter the workforce to hit the ground running. This partnership is invaluable to our programs and students."

Wondering what else Tektronix is up to? Check out the Tektronix Bandwidth Banter blog and stay up to date on the latest news from Tektronix on Twitter and Facebook.

About Tektronix
For more than sixty-five years, engineers have turned to Tektronix for test, measurement and monitoring solutions to solve design challenges, improve productivity and dramatically reduce time to market. Tektronix is a leading supplier of test equipment for engineers focused on electronic design, manufacturing, and advanced technology development. Headquartered in Beaverton, Oregon, Tektronix serves customers worldwide and offers award-winning service and support. Stay on the leading edge at www.tektronix.com.

About OSU College of Engineering
Oregon State University's College of Engineering is among the nation's largest and most productive engineering programs. Since 1999, the college has more than tripled its research expenditures to $37.2 million by emphasizing highly collaborative research that solves global problems, spins out new companies, and produces opportunity for students through hands-on learning. To learn more about it and Oregon State University, go to: oregonstate.edu.

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