· Bosch know-how as basis for comprehensive foundry service

· Rapid ramp-up from prototype to mass-production

With its MEMS, Bosch continues to hold the uncontested position of world market leader for micromechanical sensors. What is less well known is that, since 2001, 'fabless companies' have also been making use of the Stuttgart-based company's MEMS manufacturing technology, which has been perfected over two decades. These many years of experience provide a solid foundation for high quality, and are a guarantee of reliable operation – whether in the automobile or in consumer electronics. MEMS start-ups can also turn to the foundry. They might do so once sampling has been successful and their processes need adjusting to industrial-scale mass-production. Fears that trade secrets might be given away are unfounded: dealing responsibly with sensitive project data is everyday routine for Bosch. If it were not, Bosch would never have become the world's largest supplier to nearly every automaker.

For Bosch, the core of its MEMS foundry service is its competent continuation of a process development started by the customer, its short ramp-up times, and its just-in-time production. Anyone taking advantage of this competence will usually receive their MEMS components on six-or eight-inch wafers for further processing. On request, however, Bosch can do more, providing support in the process development phase. Bosch know-how can also help once the wafers have been produced. It offers services such as testing the finished wafers, integrating CMOS evaluation electronics on the MEMS chip, or subsequently separating the wafers into chips and packaging them.

Since production began in 1995, Bosch has manufactured well over one billion MEMS components at its Reutlingen plant. Its position as world market leader was also confirmed by an analysis conducted by the market observer iSuppli in March 2009: with its MEMS sensors for the automotive industry, Bosch currently generates more sales than its two closest rivals together. For its innovative further development of MEMS production technology Bosch has won prestigious awards, most recently the German Future Prize, Federal President's Award for Technology and Innovation 2008.

Readers' contact:
Thomas Koch
Phone +49 7121 35-39632

The Bosch Group is a leading global supplier of technology and services. In the areas of automotive and industrial technology, consumer goods, and building technology, some 280,000 associates generated sales of 45.1 billion euros in fiscal 2008. The Bosch Group comprises Robert Bosch GmbH and its more than 300 subsidiaries and regional companies in over 60 countries. If its sales and service partners are included, then Bosch is represented in roughly 150 countries. This worldwide development, manufacturing, and sales network is the foundation for further growth. Each year, Bosch spends more than 3.5 billion euros, or eight percent of its sales revenue, for research and development, and applies for over 3,000 patents worldwide. With all its products and services, Bosch enhances the quality of life by providing solutions which are both innovative and beneficial.

The company was set up in Stuttgart in 1886 by Robert Bosch (1861-1942) as "Workshop for Precision Mechanics and Electrical Engineering." The special ownership structure of Robert Bosch GmbH guarantees the entrepreneurial freedom of the Bosch Group, making it possible for the company to plan over the long term and to undertake significant up-front investments in the safeguarding of its future. Ninety-two percent of the share capital of Robert Bosch GmbH is held by Robert Bosch Stiftung GmbH, a charitable foundation. The majority of voting rights are held by Robert Bosch Industrietreuhand KG, an industrial trust. The entrepreneurial ownership functions are carried out by the trust. The remaining shares are held by the Bosch family and by Robert Bosch GmbH.

Additional information can be accessed at www.bosch.com.

— WebWireID107233 —

'We are very pleased that we successfully finalized this transaction with Golden Gate Capital. I am glad to see our former WLC division well prepared and supported to take a leadership position in its core market. As Infineon, we actively assist a smooth transition process for our joint customers and partners from Infineon to Lantiq', said Peter Bauer, CEO of Infineon Technologies. 'This transaction is a positive example for our efforts to stronger focus our R&D investments in our lead business segments. Infineon will continue to drive its leading technological position in the three key sectors energy efficiency, communications and security.'

The new company, Lantiq, is a fabless semiconductor company with over 20 years of experience in Wireline communication and a strong technical foundation with over 800 patent families. Lantiq will continue to drive innovation for the Next-Generation Access and Home Networks.

'It is an exciting day and an important milestone for Lantiq. We are looking forward to developing our market presence further and serving our customers even better by enhancing our product portfolio', said Christian Wolff, CEO of Lantiq. 'Lantiq's recently announced first acquisition in the Home Networking segment shows our focus and commitment to the wireline communication market.'

The sale of Infineon WLC to Golden Gate Capital was announced in July this year. The final purchase price will amount to approximately EUR 243 Million resulting from customary adjustments in the asset purchase agreement with Golden Gate Capital. Infineon is expected to record a book gain of more than Euro 100 Million as a result of this transaction in the first quarter of its fiscal year ending September 30, 2010.

Lantiq is a market leader in the broadband access market and has approximately 900 employees around the globe. It is among the world's Top 15 fabless semiconductor companies and fifth largest among the companies headquartered in Europe.

About Lantiq
Lantiq offers a broad and innovative product portfolio for Next Generation Networks and the Digital Home. The company employs about 900 people in Europe, North America and the Asia Pacific region. Headquartered in Neubiberg, Germany, Lantiq specializes on broadband communications, encompassing analog, digital and mixed-signal ICs along with comprehensive software suites. Lantiq is a fabless company, and its semiconductor solutions are deployed by major carriers and in home networks in every region of the world. Further information is available at www.Lantiq.com

About Infineon
Infineon Technologies AG, Neubiberg, Germany, offers semiconductor and system solutions addressing three central challenges to modern society: energy efficiency, communications, and security. In the 2008 fiscal year (ending September), the company reported sales of Euro 4.3 billion with approximately 29,100 employees worldwide in continuing operations. With a global presence, Infineon operates through its subsidiaries in the U.S. from Milpitas, CA, in the Asia-Pacific region from Singapore, and in Japan from Tokyo. Infineon is listed on the Frankfurt Stock Exchange (ticker symbol: IFX) and in the USA on the over-the-counter market OTCQX International Premier (ticker symbol: IFNNY). Further information is available at www.infineon.com.

— WebWireID107203 —

ERIE, Pa. (November 6, 2009) – Bliley Technologies, Inc., a worldwide leader in crystal controlled frequency solutions, has introduced the NV45AD1725 OCVCXO (oven controlled voltage controlled crystal oscillator) configured specifically for ultra low phase noise results in vibration-rich environments.

Packaged with a standard, 1-inch-square footprint and with a .46 inch height, the 100 MHz NV45AD1725 offers the lowest phase noise available in its class, as well as design flexibility for electronics engineers specifying substitute components and upgrades. Well suited for microwave communication, radar, navigation and equipment systems, the NV45AD1725 is available in both leaded and RoHS compliant versions.

'Historically, phase noise has been a major, limiting factor related to the successful operation of sophisticated communication and radar systems subjected to vibration effects. The 100 MHz NV45AD1725 is designed to meet that specific engineering requirement. Although it is available as a standard part, customization is an option for advanced technology programs,' said Dennis Barrick, Bliley's Global Vice President of Marketing and Business Development.

To review complete NV45AD1725 OCVCXO specifications online, visit Bliley Technologies at www.bliley.com/datasheets/NV45AD1725_single_board_100MHz.pdf.

About Bliley Technologies, Inc.:

Bliley has been producing state-of-the-art, low phase noise products since 1930 and is recognized internationally as a provider of quality frequency generation solutions for these industries: SATCOM/space; military; aerospace electronics; wireless and wireline communication; instrumentation; and consumer electronics. The company specializes in producing frequency control components for demanding applications.

At its state-of-the-art, ISO 9001:2000 certified manufacturing facilities, Bliley designs and produces:

--Oven Controlled Crystal Oscillators (OCXOs)
--Temperature Compensated Crystal Oscillators (TCXOs)
--Voltage Controlled Crystal Oscillators (VCXOs)
--Crystal Oscillators (XOs)
--Precision AT, SC, IT & FC cut crystals
--Quartz Transducers.

For more information, contact Bliley (www.bliley.com) at 2545 West Grandview Boulevard, Erie, Pa., 16506-4512. Phone: (814) 838-3571.

###

CONTACT:

Dana Nwaizu
(814) 838-3571, Ext. 283
DanaN@bliley.com
www.bliley.com

— WebWireID107161 —

Print USB (www.PrintUSB.com) will place any company logo or personal message on its variety of flash drives giving businesses a new way to reach customers and people a new way to keep in touch with family and friends. In addition, Print USB can place a company's data on the flash drives, such as multi-media presentations, giving businesses a unique way to market their services and products.

Colleges and universities, motion picture studios including Miramax Films, large and small businesses, as well as private citizens are customizing flash drives and using them to market products and store important data in a safe, convenient method.

The customized flash drives aren't only for marketing businesses and products. Anyone can customize a flash drive with a special message on the outside and store their pictures, videos and other data on the inside and send them to family and friends all over the world.

Flash drives carry much more data than many e-mails services allow, giving corporations and private citizens the ability to send large files of pictures and videos, all on a customized flash drive.

Print USB uses only high quality materials and their flash drives have a lifetime guarantee. They come in a variety of shapes and styles, including: memory sticks, keys, pens, and thumbs. The company recently introduced its 'green' product line of flash drives made from sustainable wood.

For more information, go to: www.PrintUSB.com.

— WebWireID107078 —

KAWASAKI (Japan), DUESSELDORF and DORTMUND (Germany) - ELMOS Semiconductor AG (FSE: ELG) and NEC Electronics (TSE: 6723) today announced the availability of its four new single-chip IO-Link solutions for IO-Link slave applications. This project is based on a close cooperation with TMG-Karlsruhe. The new IO-Link solutions combine NEC Electronics' All Flash™ 78K0R 16-bit microcontroller and ELMOS IO-Link transceiver, with integrated IO-Link slave protocol stack in a single package. The part numbers differ according to their flash memory capacity; uPD78F8040 offers 32 kilobytes (KB), uPD78F8041 offers 64 KB, uPD78F8042 offers 96 KB, and uPD78F8043 offers 128 KB of flash memory.

IO-Link is the preferred standard serial digital communications protocol used for sensors and actuators in industrial automation systems. IO-Link offers the following advantages:

* Compatible integration into existing fieldbus or Industrial Ethernet environment
* Process, parameter and diagnosis data in one cable
* compatible cabling to existing sensor communication

One key advantage of using the IO-Link slave protocol stack offered with the NEC Electronics' solutions is that minor upgrades could be included if the IO-Link specification is enhanced, significantly reducing development time and effort. Alternatively, designers can opt to develop and maintain their own software stacks. The ELMOS transceiver integrates significant analogue components, which enable system designers to eliminate use of additional external components and develop a complete IO-Link slave product at low cost.

NEC Electronics provides extensive product range to include a choice of memory variants all in the same device package. Developers can choose from 4 pin-compatible memory configurations in an 8mm x 8mm 56-pin QFN package making it easy to switch to a larger memory if more software is needed. Flash sizes from 32 KB to 128 KB will be available. This also allows developers to use the same PCB for multiple designs even though different amounts of software may be required. A 32 KB device can easily be replaced by a 128 KB device without having to re-design the PCB.

To support system designers in using the IO-Link single-chip solution, NEC Electronics and ELMOS can also provide a comprehensive development kit at lower cost than most of the other kits in the market. The 78K0R Link-It! kit is available now.

The IO-Link market is now beginning to show real promise and ELMOS and NEC Electronics are working with several vendors some of whom are already engaged in development projects. ELMOS and NEC Electronics are well placed to enable system designers to quickly and easily achieve differentiated designs using the only single-chip IO-Link solution available on the market

Availability

Samples of the new single-chip IO-Link solutions are available now. Mass production of the new devices is slated to begin in April 2010, with expected monthly mass production of 500,000 units. (Availability is subject to change without notice.)

More information about ELMOS and NEC Electronics' solutions for the industrial automation market can be found at http://www.elmos.de/german/produkte/know-how/io-link.html or http://www.eu.necel.com/iolink

(Remark)

All Flash is a trademark or registered trademark of NEC Electronics in Japan, America, Singapore, Hong Kong, UK, German, and China. NEC Electronics is a registered trademark or trademark of NEC Corporation. All other marks are property of their respective owners.

About ELMOS Semiconductor AG
ELMOS Semiconductor AG (FSE: ELG) is a leading developer and producer of customer-specific system solutions in the automotive sector. Based on the modular high-voltage CMOS technology, a great amount of analog mixed-signal circuitry elements such as voltage regulators, analog/digital converters, power-drives and NVM storage offer a huge range of integration possibilities for customers' ideas. In addition, MEMS-based sensor systems and dedicated packages both developed and manufactured within the ELMOS-Group, enable ELMOS to supply silicon-based microsystems. About 90 percent of sales are achieved with ASICs for automotive electronics. ELMOS is listed on the Prime Standard of the German Stock Exchange. For additional information about ELMOS Semiconductor, visit www.elmos.de.

About NEC Electronics Corporation
NEC Electronics Corporation (TSE: 6723) specializes in semiconductor products encompassing advanced technology solutions for the high-end computing and broadband networking markets; system solutions for the mobile handset, PC peripheral, automotive and digital consumer markets; and multi-market solutions for a wide range of customer applications. NEC Electronics Corporation has subsidiaries worldwide including NEC Electronics America, Inc. (www.am.necel.com) and NEC Electronics (Europe) GmbH (www.eu.necel.com). More information about NEC Electronics worldwide can be found at www.necel.com.

— WebWireID107017 —

IRVINE, Calif. - Broadcom Corporation (Nasdaq: BRCM), a global leader in semiconductors for wired and wireless communications, today announced that Newton Peripherals, maker of the innovative MoGo Mouse, has selected Broadcom's Bluetooth® technology for the new MoGo Talk headset. MoGo Talk is a unique, next generation wireless headset that can be stored and recharged within the plastic bodies of notebook PCs and cellular handsets. Current MoGo Talk designs support the Apple iPhone, two popular BlackBerry devices (the Curve and the Javelin) and a host of notebook PCs with voice over IP (VoIP) capabilities. Based on Broadcom® Bluetooth technology, Newton will continue to add popular phones to its list of devices supported by MoGo Talk.

Highlights/Key Facts:

-- The Newton MoGo Talk product exemplifies the trend toward more
integrated and imaginative form factors for Bluetooth headset products,
delivering great performance in a user-friendly package.
-- Broadcom headset technology enables superior audio quality, low power
and small size to provide device makers with the flexibility to develop
popular products that are designed around how end users will experience
them.
-- Broadcom is leveraging its position as a leading Bluetooth supplier for
cellular handset, PC/peripheral and human interface device (HID)
products to further drive innovation in the headset segment.
-- Included in its offering is Broadcom's popular SmartAudio® sound and
voice enhancement technology. SmartAudio provides the following
benefits:
-- Significantly improved audio quality in noisy environments by
reducing background noise and unwanted acoustic echo while also
improving the wireless range of headset connections.
-- Near-end speech enhancements that automatically adjust volume level
for the headset user when moving in and out of noisy environments
-- Dynamic wind noise reduction algorithms that drastically improve the
audio quality in a windy environments.
-- Broadcom's unique packet loss concealment (PLC) that compensates for
lost data while delivering clearer digital voice communications.
-- The SmartAudio platform works in conjunction with Broadcom's
Bluetooth software, which is widely used in mobile phones and PCs,
ensuring that interoperability with Bluetooth audio sources has been
widely tested and field proven.
-- Broadcom has shipped over one billion Bluetooth products and offers the
broadest family of Bluetooth silicon and software solutions for mobile
phones, PCs, wireless headphones and headsets, peripherals, gaming and
other applications.
-- Broadcom Bluetooth headset solutions are gaining recognition as the
technology of choice for innovative, high volume headset products, and
the world's largest manufacturers of consumer electronics, mobile phones
and personal computer products rely on Broadcom Bluetooth technology to
provide their customers with a unique, intuitive and rich user
experience, increasingly free of wires and cables.

-- Click here to watch a video demo of Broadcom's latest headset
innovations.
http://www.youtube.com/BroadcomCorporation#p/u/0/e4ziB3X6wUI

Supporting Quotes:

Stuart Nixdorff, CEO of Newton Peripherals

"The MoGo family of mobile interface devices requires advanced Bluetooth solutions that can accommodate ultra-thin form factors, while still delivering a highly satisfying user experience. Broadcom is a strong partner for Newton Peripherals to integrate with as we continue to see broad adoption of MoGo Talk in the Bluetooth headset market," said Stuart Nixdorff, CEO of Newton Peripherals. "The integration of Broadcom's SmartAudio technology means that MoGo Talk headsets can effectively identify and filter out bothersome noise, improving audio quality and ensuring crisp and clear voice calls."

Craig Ochikubo, Vice President & General Manager, Wireless Personal Area Networking, Broadcom's Wireless Connectivity Group

"Our continued pursuit of technology superiority in the Bluetooth headset segment has resulted in innovative designs with some of the industry's leading makers of headset products. We are pleased that our Bluetooth silicon and software provides the design flexibility and audio quality required to enable innovative designs like Newton's MoGo Talk."

Subscribe to RSS Feed: Broadcom Wireless Connectivity Group

About Broadcom

Broadcom Corporation is a major technology innovator and global leader in semiconductors for wired and wireless communications. Broadcom products enable the delivery of voice, video, data and multimedia to and throughout the home, the office and the mobile environment. We provide the industry's broadest portfolio of state-of-the-art system-on-a-chip and software solutions to manufacturers of computing and networking equipment, digital entertainment and broadband access products, and mobile devices. These solutions support our core mission: Connecting everything(®).

Broadcom is one of the world's largest fabless semiconductor companies, with 2008 revenue of $4.66 billion, and holds over 3,650 U.S. and over 1,450 foreign patents, more than 7,750 additional pending patent applications, and one of the broadest intellectual property portfolios addressing both wired and wireless transmission of voice, video, data and multimedia.

A FORTUNE 500® company, Broadcom is headquartered in Irvine, Calif., and has offices and research facilities in North America, Asia and Europe. Broadcom may be contacted at +1.949.926.5000 or at www.broadcom.com.

Cautions regarding Forward Looking Statements:

All statements included or incorporated by reference in this release, other than statements or characterizations of historical fact, are forward-looking statements. These forward-looking statements are based on our current expectations, estimates and projections about our industry and business, management's beliefs, and certain assumptions made by us, all of which are subject to change. Forward-looking statements can often be identified by words such as "anticipates," "expects," "intends," "plans," "predicts," "believes," "seeks," "estimates," "may," "will," "should," "would," "could," "potential," "continue," "ongoing," similar expressions, and variations or negatives of these words. Examples of such forward-looking statements include, but are not limited to, the functionality and demand for Bluetooth headsets, our position in that market, and references to Newton's use of Broadcom technology in future products. These forward-looking statements are not guarantees of future results and are subject to risks, uncertainties and assumptions that could cause our actual results to differ materially and adversely from those expressed in any forward-looking statement.

Important factors that may cause such a difference for Broadcom in connection with the Bluetooth headset silicon and software, but are not limited to:

-- the rate at which our present and future customers and end-users adopt
Broadcom's Bluetooth technologies for wireless headset applications;
-- trends in the wireless networking markets in various geographic regions,
including seasonality in sales of consumer products into which our
products are incorporated, and possible disruption in commercial
activities related to terrorist activity or armed conflict in the United
States and other locations;
-- the gain or loss of a key customer, design win or order;
-- the volume of our product sales and pricing concessions on volume sales;
-- our ability to timely and accurately predict market requirements and
evolving industry standards and to identify opportunities in new
markets; and

-- competitive pressures and other factors such as the qualification,
availability and pricing of competing products and technologies and the
resulting effects on sales and pricing of our products.

Additional factors that may cause Broadcom's actual results to differ materially from those expressed in forward-looking statements include, but are not limited to the list that can be found at http://www.broadcom.com/press/additional_risk_factors/Q42009.php.

Our Annual Report on Form 10-K, subsequent Quarterly Reports on Form 10-Q, recent Current Reports on Form 8-K, and other Securities and Exchange Commission filings discuss the foregoing risks as well as other important risk factors that could contribute to such differences or otherwise affect our business, results of operations and financial condition. The forward-looking statements in this release speak only as of this date. We undertake no obligation to revise or update publicly any forward-looking statement, except as required by law.

Broadcom, the pulse logo, Connecting everything, the Connecting everything logo and SmartAudio® are among the trademarks of Broadcom Corporation and/or its affiliates in the United States, certain other countries and/or the EU. Any other trademarks or trade names mentioned are the property of their respective owners.

— WebWireID107007 —

SAN JOSE, Calif., Cadence Design Systems, Inc. (NASDAQ: CDNS), the leader in global design innovation, announced today that Exar Corporation (NASDAQ: EXAR) has signed an expanded business agreement to establish Cadence® as its leading chip planning and mixed-signal design solutions provider. As a result of the new multi-year agreement, the Cadence Virtuoso® and Encounter® platforms, as well as the Cadence Chip Planning Solution, will make up Exar's key mixed-signal design environment for designs at 65 nanometers and below.

'We have a longstanding relationship with Cadence as they have consistently provided the technology required for our project needs,' said George Apostol, senior vice president and CTO, Exar Corporation. 'We also believe that they have the technology leadership and outstanding technical support that is vital to helping us deliver highly differentiated silicon solutions to our customers. Cadence tools, especially for mixed-signal designs, are ideal for our forthcoming data communications, storage, interface and power-management products.'

With the new agreement, Exar has chosen the Cadence Virtuoso platform for its analog and custom design and implementation technology. Additionally, the company will use Cadence Multi-mode Simulation technology for RF, FastSpice, and mixed-signal simulations. Exar will use the Cadence Encounter Digital Implementation System for digital design prototyping and floorplanning. And lastly, Exar has adopted the Cadence Chip Planning Solution as the standard for its IC conceptualization, analysis, and planning activities across the organization.

'Companies like Exar succeed through their ability to create highly differentiated designs, and are justifiably selective when it comes to the partners with whom they entrust their design flows,' said Steve Carlson, vice president of marketing at Cadence. 'Cadence welcomes the opportunity for a long-term relationship with Exar, and we look forward to helping them further distinguish their products through technical innovation and rapid market introduction.'

About Cadence
Cadence enables global electronic design innovation and plays an essential role in the creation of today's integrated circuits and electronics. Customers use Cadence software and hardware, methodologies, and services to design and verify advanced semiconductors, consumer electronics, networking and telecommunications equipment, and computer systems. The company is headquartered in San Jose, Calif., with sales offices, design centers, and research facilities around the world to serve the global electronics industry. More information about the company, its products, and services is available at www.cadence.com.

About Exar
Exar Corporation delivers highly differentiated silicon, software and subsystem solutions for industrial, datacom and storage applications. For nearly 40 years, Exar's comprehensive knowledge of end-user markets along with the underlying analog, mixed signal and digital technology has enabled innovative solutions that meet the needs of the evolving connected world. Exar's product portfolio includes power management and interface components, communications products, storage optimization solutions, network security and applied service processors. Exar has locations worldwide providing real-time customer support to drive rapid product development. For more information about Exar, visit: www.exar.com.

— WebWireID107006 —

The SureSelect Human All Exon Kit extends the efficiency and cost-effectiveness of the SureSelect Target Enrichment System to studies of all human exons, a region totaling approximately 38 Mb. Available in kit sizes appropriate for studies comprised of a few to several thousand samples, Agilent's in-solution-based SureSelect Target Enrichment System easily scales up and is well-suited for automation.

"We're excited to extend our next-generation sequencing target enrichment portfolio even further with an optimized protocol for the Applied Biosystems SOLiD System in addition to the protocol for the Illumina GAII which was released last month," said Fred Ernani, Ph.D., Agilent emerging genomics applications product manager. "The performance, ease of use and scalability of the SureSelect Human All Exon Kit combines well with the increasing capacity and efficiency of both of these next-generation sequencers."

The SureSelect Human All Exon Kit design covers 1.22 percent of human genomic regions corresponding to the NCBI Consensus CDS Database (CCDS), including more than 700 human miRNAs from the Sanger v13 database and more than 300 additional human non-coding RNAs in a single tube.

"The SureSelect All Exon Kit enrichment for the Applied Biosystems SOLiD System worked in our hands extremely well," said Dr. Michal Schweiger, MD, Ph.D., Cancer Genomics Group of the Max Planck Institute for Molecular Genetics. "The amount of input DNA required is very low and the protocol straightforward to perform. We are very happy about the technology, especially in regard to our applications studying cancer where we have limited amounts of input DNA."

Agilent's SureSelect Target Enrichment System is now the platform with the most optimized protocols for a diverse set of sequencing protocols and platforms. It supports Illumina end-sequencing and paired-end sequencing protocols in addition to fragment library format sequencing on the SOLiD System. Users of Agilent's eArray online design tool can improve the efficiency of their research by easily designing custom products to target any genome of interest, all in a single tube.

— WebWireID106971 —

Applications for the Agilent E5061B, part of the ENA series of network analyzers, include general RF-network measurements, such as filters or amplifier tests, and LF (low frequency) measurements necessary for loop-gain evaluation of DC-DC converters. The E5061B's frequency coverage is suitable for power distribution networks (PDN) measurements, which evaluate the quality of a DC power supply circuit. This type of evaluation is increasingly important, especially in high-speed digital communication equipment.

Features of the Agilent E5061B include:

* S-parameter test port, 5 Hz to 3 GHz, with a wide dynamic range of 120 dB at more than 1MHz, 90 dB at less than 100 Hz;
* gain-phase test port, 5 Hz to 30 MHz, switchable 1 MO/50 O input;
* DC bias source from 0 to ±40 Vdc, which can be added to AC test signal (for both S-parameter and gain-phase test port) or can be used as a sweepable DC source; and
* compact form factor with a 254-mm depth, requiring less desktop space.

"The new E5061B represents an extension of a recognized industry standard in RF network analysis capabilities from Agilent," said Akira Nukiyama, vice president and general manager of Agilent's Component Test Division, Kobe. "Delivering the excellent RF performance that is common to the ENA series, the E5061B also offers accurate LF measurement capability. It's the ideal, general-purpose LF-to-RF network analyzer that meets a variety of network measurements."

Agilent's ENA Series addresses a broad array of component and circuit tests, including EMC-related applications and automotive, wireless communications, aerospace and defense, education and medical applications. The series includes the Agilent E5071C (9 kHz to 8.5 GHz /300 kHz to 20 GHz), the Agilent E5061A/62A (300 kHz to 1.5/3.0 GHz) and now the Agilent E5061B, expanding coverage to LF measurement requirements down to 5 Hz.

U.S. Pricing and Availability

The Agilent E5061B network analyzer is available now and is priced at $31,900.

— WebWireID106962 —

SANTA CLARA, Calif.- Agilent Technologies Inc. (NYSE: A) today announced it significantly enhanced its SuperSpeed USB test solution portfolio with the introduction of new test fixtures and the support of automated compliance tests and characterization with the new J-BERT N4903B. The new, compact setup will be unveiled at the USB-IF Compliance Workshop in Portland, Ore., Nov. 2-4.

USB 3.0 is an update of the well-established, widespread standard driven by USB Implementers Forum, Inc., a non-profit corporation founded by the group of companies that developed the Universal Serial Bus (USB) specification. USB receiver jitter tolerance testing became mandatory with the recent release of the USB 3.0 specification version 1.0. USB 3.0 is also known as SuperSpeed USB.

Agilent streamlined its USB 3.0 test solution for transmitter and receiver test, now comprised of a DSA91304A Infiniium oscilloscope, a USB 3.0 test fixture, a pattern checker and pattern generator based on the J-BERT N4903B high-performance serial BERT, and the N5990A test automation software platform from Agilent's partner BitifEye Digital Test Solutions. J-BERT's new internal SJ and SSC generation eliminates the need for external signal and noise generators used in the previous test setup.

"This live demo of the compact USB 3.0 transmitter and receiver test setup continues Agilent's phased introduction of its USB solution portfolio," said Jim Choate, USB program manager with Agilent's Digital Test Division. "With our first solution, introduced earlier this year, we successfully supported early adopters. With this new, compact setup, we are facilitating widespread adoption of USB 3.0 compliance testing."

"By supporting J-BERT N4903B High performance Serial BERT, the test automation software N5990A provides even more value to customers," said Alexander Schmitt, co-founder of the Agilent partner company BitifEye. "With J-BERT B's built-in jitter sources, system calibration is significantly reduced. This saves customers time and enhances productivity. With J-BERT B and N5990A, test parameters such as the random or sinusoidal jitter can be modified on the fly over a wide range, without the need for calculating and loading synthesized waveforms. This is especially important for characterization and troubleshooting."

Benefits of Agilent's USB 3.0 transmitter and receiver test solutions include:

* complete and accurate transmitter and receiver design and characterization test capability;
* investment protection due to signal generation and analysis capability for many popular serial bus standards such as USB, PCI Express(r), SATA and DisplayPort testing; and
* simplified, accurate and fast compliance testing.

U.S. Pricing and Availability

Pricing for Agilent's DSO91304A Infiniium oscilloscope USB 3.0 transmitter test solution starts at $102,819. The USB SuperSpeed receiver tolerance test is based on the Agilent J-BERT N4903A/B, starting at $137,000, and N5990A test automation software platform. The products are available now.

— WebWireID106952 —

Micron is currently sampling the 4Gb NAND-2Gb LPDDR MCP with customers and expects to be in volume production in early 2010. The 4Gb NAND-2Gb LPDDR combination is targeted at mainstream densities in today's mobile devices, but Micron has the flexibility to support higher densities – up to 8Gb NAND and 8Gb LPDDR – as the mobile market integrates sophisticated multimedia functionality. Visit the Micron Innovations blog to learn more about Micron's new MCP products and read an insider's perspective on the shifting mobile memory landscape.

'With Micron's 34nm 4Gb NAND and 50nm 2Gb LPDDR monolithic die used in this package, we are providing customers with the most advanced solution available in NAND-based MCPs,' said Eric Spanneut, director of mobile memory marketing. 'By combining the industry's leading NAND and DRAM processes within our new generation of MCPs, we are able to easily accommodate the shift to high-density NAND devices as the industry progresses toward multi-function mobile devices.'

In addition to its MCP portfolio, Micron also offers a host of memory products for the mobile market, including discrete NAND and LPDRAM parts, e∙MMC 4.4 managed NAND solutions and NANDcode software. By working closely with the entire mobile value chain, including operating system and chipset vendors, Micron is in a unique position to offer customers a rich portfolio of engineering support and solutions for their respective design needs.

Relevant Links
There are other ways to stay up-to-date on Micron news:

* Micron Innovations Blog: www.micronblogs.com
* Micron on Twitter: http://twitter.com/microntechnews
* Micron Pressroom: www.micron.com/media

About Micron
Micron Technology, Inc., is one of the world's leading providers of advanced semiconductor solutions. Through its worldwide operations, Micron manufactures and markets DRAMs, NAND flash memory, other semiconductor components, and memory modules for use in leading-edge computing, consumer, networking, and mobile products. Micron's common stock is traded on the New York Stock Exchange (NYSE) under the MU symbol. To learn more about Micron Technology, Inc., visit www.micron.com.

Micron and the Micron orbit logo are trademarks of Micron Technology, Inc. All other trademarks are the property of their respective owners.

This press release contains forward-looking statements regarding the production of Micron's new MCP portfolio. Actual events or results may differ materially from those contained in the forward-looking statements. Please refer to the documents Micron files on a consolidated basis from time to time with the Securities and Exchange Commission, specifically Micron's most recent Form 10-K and Form 10-Q. These documents contain and identify important factors that could cause the actual results for Micron on a consolidated basis to differ materially from those contained in our forward-looking statements (see Certain Factors). Although we believe that the expectations reflected in the forward-looking statements are reasonable, we cannot guarantee future results, levels of activity, performance or achievements.

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SUNNYVALE, Calif. - MIPS Technologies, Inc. (Nasdaq: MIPS), a leading provider of industry-standard processor architectures and cores, today introduced a new core family providing the highest levels of system performance for extremely cost-sensitive embedded applications such as 32-bit microcontrollers (MCUs), home entertainment, personal entertainment and home networking. The new MIPS32® M14KTM and M14KcTM cores are the first MIPS32-compatible cores that also execute the new microMIPSTM instruction set architecture (ISA), achieving high performance of
1.5 DMIPS/MHz with an advanced level of code compression. The microMIPS ISA maintains 98% of MIPS32 performance while reducing code size by 35%, translating to significant silicon cost savings.

According to Art Swift, vice president of marketing at MIPS Technologies, "Growing amounts of signal processing and higher speed connectivity are driving up the performance requirements in MCUs and many cost-sensitive embedded applications, while still requiring a very small silicon footprint. We're enabling our customers to develop high-performance devices in smaller form factors to significantly decrease development costs. We're pleased to enhance and expand our offering for MCU and system designers with these groundbreaking new cores."

"MCUs continue to migrate towards 32-bit to address the needs of more sophisticated, performance-intensive applications," said Tony Massimini, chief of technology, Semico Research. "Processors that support 32-bit MCUs and other high-performance, low-footprint embedded devices must not only provide the requisite performance and right feature set, but they also need to be extremely compact to keep flash memory and silicon costs down. This enables smaller die area which allows for further integration. The specifications of the new M14K cores suggest great promise for the next generation of these devices."

The M14K Core for Microcontrollers

The M14K core combines high performance with an advanced level of code compression for the 32-bit MCU market, achieving performance of 1.5 DMIPS/MHz and 180 MHz in 130nm. The M14K core offers advanced features that are optimized for MCU and real-time embedded applications, including reduced interrupt latency, flash acceleration, advanced debug features including iFlowTraceTM and support for AHB Lite as the interconnect interface. Designed on the MIPS32 4K® micro-architecture that is already proven in hundreds of millions of SoCs, the M14K core is highly configurable and extendable, offering a wide range of implementation options to minimize cost and maximize reusability.

"Microchip is delighted to see continued innovation and commitment from MIPS Technologies in the 32-bit MCU market. The new M14K and M14Kc cores, and the microMIPS ISA offer enhancements important to MCU users, including even faster interrupt latency and smaller code size," said Sumit Mitra, vice president, High Performance Microcontroller Division, Microchip Technology. "Microchip is pleased with the enthusiastic acceptance of its MIPS-based PIC32 MCU family offering best-in-class performance. As with our 8-bit and 16-bit microcontroller businesses, Microchip is committed to a long term roadmap with our MIPS-based 32-bit MCU products."

The M14Kc Core for High Performance, Low Footprint Applications

The M14Kc core builds on the base M14K core with additional features for embedded applications such as home entertainment, home networking and personal mobile entertainment. These applications require a compact footprint but also the ability to execute increasingly complex software algorithms on an RTOS or Linux. Based on the popular MIPS32 4KEcTM micro-architecture, which provides a powerful Linux and Java engine and superior performance for the Android platform, the M14Kc core has a full cache controller and translation lookaside buffer (TLB) memory management unit (MMU).

microMIPS ISA for Advanced Code Compression

At the heart of the M14K and M14Kc cores is the new microMIPS ISA that offers 32-bit performance with 16-bit code size for most instructions. The microMIPS ISA combines recoded and new 16- and 32-bit instructions to achieve an ideal balance of performance and code density. It incorporates all MIPS32 instructions and Application Specific Extensions (ASEs) including MIPS-3D® ASE, MIPS DSP ASE, MIPS MT ASE and SmartMIPS® ASE, as well as new instructions for advanced code size reduction. The microMIPS ISA is backward compatible, enabling reuse of optimized MIPS micro-architecture. With smaller memory accesses and efficient use of the instruction cache, the microMIPS ISA also helps to reduce system power consumption.

Ecosystem and Tool Support

MIPS Technologies is providing complete software development tool support for the new M14K and M14Kc cores, with the Eclipse-based MIPS NavigatorTM Integrated Component Suite (ICS) and System NavigatorTM probes for debugging. MIPS Technologies is also working with leading third party software vendors for broad tool and OS support.

"With Sourcery G++TM, CodeSourcery's industry-leading software development environment based on the GNU Toolchain and the Eclipse IDE, we already support the entire range of MIPS32 cores, and we will soon be providing support for the M14K and M14Kc cores (including the new MicroMIPS ISA) as well," said Mark Mitchell, chief sourcerer, CodeSourcery. "We are pleased to continue our partnership with MIPS Technologies to deliver the tools MIPS developers need to quickly bring products to market."

"The new MIPS32 M14K and M14Kc cores and microMIPS ISA provide the ultimate platforms to leverage the low power and high performance characteristics of the Nucleus OS," said Glenn Perry, general manager of the Embedded Systems Division of Mentor Graphics. "Combining cores like the M14Kc with Mentor's multiOS solutions for Linux, Android and Nucleus will enable our mutual customers to develop innovative multi-OS solutions with world-class support and performance quality from Mentor Graphics."

"Express Logic's ThreadX® RTOS is ideal for deeply embedded systems where small code size and real-time performance are critical, and the microMIPS ISA appears to be a great fit for enabling the next generation of these systems," said William E. Lamie, president and CEO ExpressLogic. "With ThreadX on MIPS cores, developers have a powerful solution to help them get to market quickly. We have worked closely with MIPS Technologies for many years, and we're continuing that work with them on microMIPS and the M14K family."

"Micrium currently provides embedded software support for the MIPS32 architecture with our small-footprint µC/OS-II RTOS," said Christian Legare, Micrium vice president. "Micrium is known for saving precious design time, resulting in a substantial cost advantage for such embedded applications as industrial, medical and automotive. With its M14K core, MIPS Technologies offers a unique value proposition for developers in these markets. Micrium recognizes the benefits and importance of porting to the M14K core."

"We recently announced support for MIPS32 cores in our new MontaVista Linux 6 Market Specific Distributions (MSDs), offering a tailored combination of features and functionality specific for those cores. MontaVista Linux 6 will also provide support for the M14Kc core to enable MIPS developers to quickly create differentiated products by building on an optimized, commercial-quality embedded Linux," said Scott Mullarkey, vice president, worldwide business development, MontaVista Software.

"With Timesys LinuxLink support for the complete family of MIPS32 cores, including the new M14Kc core, MIPS Technologies' licensees can provide Linux solutions for their processors and reference platforms within days," said Maciej Halasz, director of product management at Timesys. "Licensees can quickly assemble Linux images for reference kits, while their OEM customers can accelerate their time-to-market and build Linux-based products for a wide range of applications through the unique productivity features in the LinuxLink software development framework. We are pleased to extend our comprehensive support for the MIPS architecture by adding LinuxLink support for this new core."

Simulation Support

MIPS will also provide both accurate and fast simulation models for the M14K and M14Kc cores. SoC developers can leverage 100% cycle accurate models-built with technology from Carbon Design Systems-for verification in SystemC and co-simulation environments. Software developers can also take advantage of fast instruction set simulators-developed in conjunction with Imperas-for use in software development and virtual platforms.

"We are pleased to provide MIPS Technologies with our Carbon Model Studio tools to generate cycle accurate models of its new cores," said Bill Neifert, CTO and vice president, business development, Carbon Design Systems. "With models of the M14K and M14Kc cores created using Carbon's leading technology, SoC developers get 100 percent cycle accurate models that work in many different design environments, enabling accurate architectural analysis and pre-silicon performance analysis."

"We are working together with MIPS to create MIPS-VerifiedTM instruction-accurate models of its newest cores that MIPS will provide to its licensees," said Simon Davidmann, CEO of Imperas. "With our instruction accurate simulation technology and these models, developers can simulate complete embedded systems running real application code at very fast speeds on typical desktop PCs-helping them get to market quickly at the lowest possible cost."

Availability

The new M14K and M14Kc cores will be available in the first quarter of 2010. For more information, contact info@mips.com or visit www.mips.com/microcontrollers.

About MIPS Technologies, Inc.

MIPS Technologies, Inc. (NasdaqGS: MIPS) is a leading provider of industry-standard processor architectures and cores that power some of the world's most popular products for the home entertainment, communications, networking and portable multimedia markets. These include broadband devices from Linksys, DTVs and digital consumer devices from Sony, DVD recordable devices from Pioneer, digital set-top boxes from Motorola, network routers from Cisco, 32-bit microcontrollers from Microchip Technology and laser printers from Hewlett-Packard. Founded in 1998, MIPS Technologies is headquartered in Sunnyvale, California, with offices worldwide. For more information, contact (408) 530-5000 or visit www.mips.com.

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SANTA CLARA, Calif. - NVIDIA today announced that it is now accepting applications for its ninth annual NVIDIA Fellowship Program, to fund work that helps to solve complex visual computing challenges. Grants of $25,000 for each selected project will be announced in Spring 2010.

The program is open to applicants worldwide from today through Feb. 3, 2010. Eligibility criteria include completion of the first year of Ph.D. level studies in the areas of computer architecture, computer science, electrical engineering, high-performance computing, scientific computing, or a related area. In addition, applicants must hold a current membership on an active research team. For further information on eligibility and how to apply, please visit: http://www.nvidia.com/page/fellowship_programs.html or email: fellowship@nvidia.com.

'The Fellowship Program aims to provide funding to Ph.D. students who are researching topics that will lead to major advances in the graphics and high-performance computing industries,' said Bill Dally, chief scientist at NVIDIA. 'Award recipients will not only receive crucial funding for their research. They will also be able to conduct groundbreaking work with access to NVIDIA products, technology and some of the most talented minds in the field.'

Since its inception in 2002, the NVIDIA Fellowship program has awarded more than $1.8 million in funding to over 75 Ph.D. research students.

About NVIDIA Research
NVIDIA Research has a variety of initiatives and programs aimed at advancing visual, parallel and mobile computing. These include funding and board donations for university research projects through professor partnerships and graduate fellowships; working with faculty to develop curriculum, providing access to developer forums, pre-released tools and drivers through NVIDIA's Developer Relations Program; and providing free online access to some of NVIDIA's award-winning books and coursework. Current work being done by the group spans many domains that include: realistic rendering, ray tracing, physical simulation, scientific computing, computational photography, programming languages and systems, computer architecture, and VLSI circuits. NVIDIA Research is led by the company's chief scientist, Bill Dally. For more information, please visit www.nvidia.com/research.

About NVIDIA
NVIDIA (Nasdaq: NVDA) awakened the world to the power of computer graphics when it invented the graphics processing unit (GPU) in 1999. Since then, it has consistently set new standards in visual computing with breathtaking, interactive graphics available on devices ranging from portable media players to notebooks to workstations. NVIDIA's expertise in programmable GPUs has led to breakthroughs in parallel processing which make supercomputing inexpensive and widely accessible. Fortune magazine has ranked NVIDIA #1 in innovation in the semiconductor industry for two years in a row. For more information, see www.nvidia.com.

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NEW YORK — Juniper Networks® (NYSE: JNPR) today announced that Juniper has reached a significant milestone with its Original Equipment Manufacturer (OEM) relationship with IBM, announced in July. IBM is now delivering to customers a suite of Ethernet networking products manufactured by Juniper. In addition, the two companies have extended the OEM agreement to include Juniper's SRX Series Services Gateways, providing customers with a best-in-class choice of network offerings that can reduce costs, improve services and manage risk.

"We are continuing to combine breakthrough technology with a world class partnership to help customers reinvent the experience and economics of networking," said Mark Bauhaus, executive vice president and general manager, Service Layer Technology Business Group, Juniper Networks. "The continued expansion of the IBM and Juniper OEM demonstrates our joint commitment to propelling a dynamic infrastructure network that is open, scalable, simple and secure to address the exploding scale of Internet services for personal and business productivity."

"IBM is focused on providing its customers with the best networking choices and flexibility in their solutions, which is why we're pleased to offer IBM j-type Ethernet networking products running JUNOS Software as part of our data center networking portfolio," said Barry Rudolph, vice president, IBM System Storage. "The continued success of our relationship and expansion of our OEM partnership will help us reach our shared vision of advancing the economics of networking and the data center."

Today's data centers require higher performance and less complex networks as an essential element of their evolution. While there are extreme cost pressures on IT budgets, the demand on data centers only increases with exploding data volumes, demand for new services, speed and security, and always-on reliability. In addition, cloud computing will further drive the need for massive scale, efficiency, elasticity and security from networks and data center architectures. The IBM and Juniper relationship is further evidence of the growing importance of the high-performance network in the progression of data centers toward cloud computing or cloud-like infrastructures. Both companies agree a high-performance, secure network is vital to the operations of both the data center (enabling service production) and the global network (enabling service delivery).

IBM and Juniper entered into the OEM agreement in July 2009. The agreement allows the IBM System & Technology Group (STG) to brand, label and sell select Juniper EX Series Ethernet switches as IBM j-type e-series Ethernet switches and MX Series Ethernet Services routers as IBM j-type m-series Ethernet routers. The suite of six Ethernet networking products are now generally available within IBM's data center portfolio. The expanded OEM agreement adds the SRX Series Services Gateways, which will be available in the first half of 2010. For more information on IBM and Juniper, please visit: https://simplifymydatacenter.com/ibm.

About Juniper Networks

From devices to data centers, from consumers to the cloud, Juniper Networks delivers innovative software, silicon and systems that transform the experience and economics of networking. The company serves more than 30,000 customers and partners worldwide, and earned more than $3 billion in revenue over the last year. Additional information can be found at www.juniper.net.

Juniper Networks and Junos are registered trademarks of Juniper Networks, Inc. in the United States and other countries. The Juniper Networks and Junos logos are trademarks of Juniper Networks, Inc. All other trademarks, service marks, registered trademarks, or registered service marks are the property of their respective owners.

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SANTA CLARA, Calif., and GENEVA . – Intel Corporation and Numonyx B.V. today announced a key breakthrough in the research of phase change memory (PCM), a new non-volatile memory technology that combines many of the benefits of today's various memory types. For the first time, researchers have demonstrated a 64Mb test chip that enables the ability to stack, or place, multiple layers of PCM arrays within a single die. These findings pave the way for building memory devices with greater capacity, lower power consumption and optimal space savings for random access non-volatile memory and storage applications.

The achievements are a result of an ongoing joint research program between Numonyx and Intel that has been focusing on the exploration of multi-layered or stacked PCM cell arrays. Intel and Numonyx researchers are now able to demonstrate a vertically integrated memory cell – called PCMS (phase change memory and switch). PCMS is comprised of one PCM element layered with a newly used Ovonic Threshold Switch (OTS) in a true cross point array. The ability to layer or stack arrays of PCMS provides the scalability to higher memory densities while maintaining the performance characteristics of PCM, a challenge that is becoming increasingly more difficult to maintain with traditional memory technologies.

"We continue to develop the technology pipeline for memories in order to advance the computing platform," said Al Fazio, Intel Fellow and director, memory technology development. "We are encouraged by this research milestone and see future memory technologies, such as PCMS, as critical for extending the role of memory in computing solutions and in expanding the capabilities for performance and memory scaling."

"The results are extremely promising," said Greg Atwood, senior technology fellow at Numonyx. "The results show the potential for higher density, scalable arrays and NAND-like usage models for PCM products in the future. This is important as traditional flash memory technologies face certain physical limits and reliability issues, yet demand for memory continues to rise in everything from mobile phones to data centers."

Memory cells are built by stacking a storage element and a selector, with several cells creating memory arrays. Intel and Numonyx researchers were able to deploy a thin film, two-terminal OTS as the selector, matching the physical and electrical properties for PCM scaling. With the compatibility of thin-film PCMS, multiple layers of cross point memory arrays are now possible. Once integrated together and embedded in a true cross point array, layered arrays are combined with CMOS circuits for decoding, sensing and logic functions.

More information about the memory cell, cross point array, experiment and results will be published in a joint paper titled "A Stackable Cross Point Phase Change Memory," and will be presented at the 2009 International Electron Devices Meeting in Baltimore, Md., on Dec. 9. The paper is co-authored by Intel and Numonyx technologists and will be presented by DerChang Kau, Intel senior principal engineer.

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Tempe, Ariz.-Avnet Technology Solutions, the solutions distribution leader and an operating group of Avnet, Inc. (NYSE: AVT), announced today that it was named AMD's (NYSE:AMD) top-performing global distributor during the recent AMD Executive Forum 2009, held in Austin, Texas. AMD selected Avnet for this honor based on its ability to expand AMD's market presence and revenues globally. AMD also awarded Avnet three regional distinctions, naming Avnet as distributor of the year in ANZ, EMEA and North America.

"This prestigious award from AMD validates that Avnet's solutions-driven approach to technology sales and marketing is helping both our customers and suppliers accelerate their success around the globe," said Phil Gallagher, president, Avnet Technology Solutions global. "Avnet has helped support our OEM, system builder and value-added partners in the AMD market by offering the tools, technical expertise and distribution resources needed to develop complete white box solutions that leverage best-in-class technology from AMD and complementary suppliers."

Avnet has been supporting AMD's customers for more than 35 years and has consistently been recognized as one of its top distributor partners. Avnet focuses on creating growth opportunities for its customers through a solutions-based approach to selling AMD Opteron processors for white box servers, embedded applications and workstations, and AMD Athlon II and Phenom II processors for OEM and white box desktops. For example, Avnet provides its system builder, OEM and value-added partners with access to complementary supplier relationships and a variety of services, such as integration, logistics, design engineering and financing, to ensure they are able to offer complete solutions.

"Avnet understands the intricacies of the global technology market," said John Byrne, vice president, world-wide channel sales, AMD. "They work hand-in-hand with our customers to provide global supply chain support, coupled with the technology, knowledge and services required to enable long-term growth opportunities. Avnet has consistently proven that they are dedicated to helping us create an outstanding customer experience."

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SANTA CLARA, Calif.- Agilent Technologies Inc. (NYSE: A) today announced the addition of a 4-tap de-emphasis signal converter N4916B, an ultraflexible SSC injection and a SATA ISI channel to its J-BERT N4903B high-performance serial BERT. The new capabilities enable R&D and test engineers to accurately characterize receiver ports and channels of multigigabit serial bus interfaces, such as Quickpath Interconnect (QPI), Hypertransport, PCI Express(r), DisplayPort, SerialATA, USB3, CEI, 10GBASE-KR, 40GBASE-KR and memory interfaces.

4-Tap De-emphasis Signal Converter

The de-emphasis technique is used in the transmission of digital electrical signals at gigabit data rates. De-emphasis is a signal pre-distortion to compensate for signal degradations that occur when transmitting electrical signals with gigabit rates over PC board traces, backplanes or long cables.

Agilent's new de-emphasis signal converter, the N4916B, allows users to emulate transmitter de-emphasis with one pre- and two post-cursors, as well as individually adjust de-emphasis levels up to 12.0 dB. With its DC-coupled outputs, the signal converter tolerates even unbalanced pattern streams. The N4916B is transparent to jitter, enabling emulation of real-world de-emphasis and jitter conditions that a receiver is expected to tolerate. Agilent's new de-emphasis signal converter can be used as front-end for J-BERT N4903A/B, ParBERT or other gigabit pattern generators.

Besides its de-emphasis capabilities, the N4916B offers a unique clock-doubling option, which enables error, jitter and eye analysis with J-BERT N4903B of transmitters using half-rate clocks.

Ultraflexible SSC Injection

The spread spectrum clocking (SSC) injection is becoming more common for high-speed interconnects. SSC modulates the operating frequency of a circuit slightly to spread its radiated emissions over a range of frequencies.

J-BERT N4903B's SSC option now provides more flexible and arbitrary SSC injection capabilities that can be combined with sinusoidal jitter injection, helping R&D engineers emulate worst-case and real-world SSC conditions, especially for SATA, SAS and USB3 receivers.

SATA ISI Channel

The new Agilent SATA ISI Channel N4915-60001 helps R&D and test engineers easily reproduce precise SATA compliant stress conditions for the receiver stress test when used in combination with J-BERT N4903B.

"We are very proud to offer the industry's leading jitter tolerance test solution," said Jergen Beck, general manager of Agilent's Digital Photonic Test product line. "By adding multitap de-emphasis, ultraflexible SSC and SATA ISI channel, we significantly simplify the accurate characterization of the next-generation of serial interfaces operating above 5 Gb/s. With this introduction we confirm our commitment to enable R&D and validation teams to release robust high-speed digital interfaces for the next generation of computer, consumer and communication devices."

Benefits of the Agilent N4916B de-emphasis signal converter include:

* Easy-to-emulate transmitter de-emphasis with individually adjustable de-emphasis of 0.0 dB to 12.0 dB in 0.1 dB steps for one pre- and two post-cursors. Tolerates unbalanced pattern and is jitter transparent.
* Ability to optimize the receiver's jitter budget by compensating for signal degradations caused by the test setup, cabling and test board ("de-embedding") by using signal de-emphasis.
* Flexible usage as de-emphasis front-end for J-BERT N4903A/B, ParBERT or other gigabit pattern generators.
* Accurate eye, jitter and error analysis of half-rate clocked transmitters with J-BERT N4903B by using the clock-doubler option.

Benefits of the Agilent J-BERT N4903B Software 6.1 and SATA ISI Channel include:

* Robust receiver designs by emulating real-world SSC effects via file upload of arbitrary SSC profiles.
* Compliant SAS and SATA injection of SSC with an expanded SSC range of up to 10,000 ppm in center-spread mode, support of up-, down-, and center-spread SSC as well as new SATA ISI channel.
* Simplified setup for USB3 receiver stress test by simultaneous injection of SSC and SJ from J-BERT N4903B.

Additional information about Agilent's N4916B and J-BERT N4903B is available at www.agilent.com/find/n4916 and www.agilent.com/find/jbert. Information about the SATA ISI channel can be found at www.agilent.com/find/SATA_rx_test.

High resolution images of the Agilent N4916B are available at www.agilent.com/find/n4916B_images.

More product images are available at www.agilent.com/find/jbert_images.

U.S. Pricing and Availability

The Agilent N4916B de-emphasis signal converter with optional clock doubler is available now. Pricing starts at $39,400.

Agilent's J-BERT N4903B software rev. 6.1 for more flexible SSC/SJ injection (Option J11) can be downloaded from www.agilent.com/find/jbert at no charge.

The N4915-60001 SATA ISI Channel is available now at a price of $7,800.

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GENEVA, SWITZERLAND AND CAMBRIDGE, UK - STMicroelectronics (NYSE: STM), one of the world's leading set-top-box chip makers, and ARM [(LSE: ARM); (Nasdaq: ARMH)], announced today that ST has adopted the ARM® Cortex™-A9 MPCore™ processor, in addition to the Mali®-400 graphics processor, for its upcoming set-top-box and digital TV system-on-chip (SoC) ICs.

The Cortex-A9 MPCore processor provides ST with the scalable high performance required to enable the high-bandwidth broadband and broadcast content being streamed into homes, while significantly improving power efficiency when compared to alternative solutions. The adoption of ARM technology enables ST to build upon the expertise accumulated during its SoC development with its successful ST-40 processor, and also signals the company's intention to base its next-generation range of HDTV SoCs on ARM technology.

ST already has vast experience in developing cutting-edge complex SoCs based on ARM technology for various applications in wireless, computer, automotive and industrial markets. By adopting the Cortex-A9 MPCore processor for home-entertainment markets, ST is also able to access the comprehensive and expanding software ecosystem around the Cortex-A9 MPCore processor, including Adobe® Flash® technology and leading web browsers such as Opera, to provide compelling multimedia performance.

'Building our next-generation HDTV consumer devices around the high-performance ARM architecture will enable us to continue to deliver best-in-class devices for our customers, while providing a simple migration route from our existing ST-40 based chips,' said Philippe Lambinet, executive vice president, Home Entertainment and Display Group, STMicroelectronics. 'In addition, our customers now gain access to the broad ARM ecosystem of support around the processors.'

'The adoption of ARM technology by ST, one of the world leaders for home-entertainment ICs, is a highly visible demonstration of the growing momentum behind our Cortex processors and Mali GPUs (Graphics Processor Units) in applications such as DTV and set-top boxes,' said Mike Inglis, executive vice president, Processor Division, ARM. 'Our leadership position in the development of high-performance, low-power multicore technology enables ARM to provide the scalable performance demanded by next-generation consumer devices.'

'Sky welcomes the collaboration between ST and ARM to provide cost-effective, low-power set-top-box technology,' said Roger Lambert, BSkyB. 'Reducing power consumption across our business is a key pillar of Sky's strategy – utilizing the lowest power technology in our set-top boxes is a vital element of this ongoing strategy.'

ST has also licensed the ARM Mali-400 MP multicore scalable graphics processing unit (GPU) technology to meet the growing demand for exciting new graphical user interfaces and the needs of increasingly sophisticated web-based services. The Mali-400 GPU enables ST to provide '1080p' 3D user interfaces conforming to the Khronos OpenGL ES 2.0 API (Application Programming Interface), and helps deliver the seamless composition of graphics and video for the best possible user experience from the next wave of web-based interactive services.

'Flash Player 10 is essential to deliver rich, compelling Web content on advanced consumer devices,' said Danny Winokur, senior director, Business Development, Platform Business Unit at Adobe. 'ST and ARM are enabling the underlying hardware platform, based on Open GLES 2.0, and the high-performance ARM Cortex-A9 processor, to deliver the full Flash experience to consumer entertainment systems.'

The first ST devices for home entertainment applications integrating the Cortex-A9 MPCore and Mali-400MP will be available in mid-2010.

About ARM
ARM designs the technology that lies at the heart of advanced digital products, from wireless, networking and consumer entertainment solutions to imaging, automotive, security and storage devices. ARM's comprehensive product offering includes 32-bit RISC microprocessors, graphics processors, video engines, enabling software, cell libraries, embedded memories, high-speed connectivity products, peripherals and development tools. Combined with comprehensive design services, training, support and maintenance, and the company's broad Partner community, they provide a total system solution that offers a fast, reliable path to market for leading electronics companies. More information on ARM is available at http://www.arm.com.

About STMicroelectronics
STMicroelectronics is a global leader serving customers across the spectrum of electronics applications with innovative semiconductor solutions. ST aims to be the undisputed leader in multimedia convergence and power applications leveraging its vast array of technologies, design expertise and combination of intellectual property portfolio, strategic partnerships and manufacturing strength. In 2008, the Company's net revenues were $9.84 billion. Further information on ST can be found at www.st.com.

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SUNNYVALE, Calif. - MIPS Technologies, Inc. (Nasdaq: MIPS), a leading provider of industry-standard processor architectures and cores for digital consumer, home networking, wireless, communications and business applications, today announced that Avnet ASIC Israel (AAI), an ASIC and COT design, backend, and turnkey manufacturing services provider, has successfully obtained the highest level of accreditation as a certified design center for MIPS. Through the companies' expanding relationship, MIPS Technologies will support AAI with extensive training, tools and support.

AAI provides VLSI back-end and production management services, as well as front-end design services to the rapidly expanding base of MIPS licensees in Israel and worldwide. AAI was first selected by MIPS as an approved design center in 2005, and has worked extensively with a broad range of MIPS licensees including Amimon and BroadLight. Through these engagements, AAI has gained deep experience with MIPS cores, including MIPS32® 4KE®, M4K® and 24K® core implementations.

"This agreement is yet another step in broadening access to the MIPS architecture across the globe," said Art Swift, vice president of marketing, MIPS Technologies. "AAI continues to demonstrate deep technical knowledge, expertise and dedication to our customers, and we are pleased to work closely with the company to streamline and speed SoC development for our licensees."

"MIPS Technologies' industry-standard architecture and cores have established the company as a leading provider of processor IP, and we are proud to support its licensees as they continue to deliver cutting-edge designs to market," said Nadav Ben-Ezer, managing director, AAI. "The Israel SoC market is growing quickly, and we are seeing an increasing number of opportunities for MIPS-Based solutions."

About Avnet ASIC Israel, Ltd.
Avnet ASIC Israel Ltd. (AAI), is a wholly-owned subsidiary of Avnet Israel, the Israeli branch of Avnet, Inc., one of the largest global B2B distributors of the world's leading technology manufacturers. Avnet ASIC Israel is a leading provider of a complete range of design and turnkey manufacturing services for fabless companies and OEMs, which develop advanced SoC devices. AAI's portfolio includes design and manufacturing services for ASIC, COT, Analog, Structured ASIC, and FPGA. In the past 20 years AAI has successfully completed more than 250 tape-outs. Partnering with the world leading library, IP and manufacturing vendors, Avnet ASIC Israel secures to its customers access to the latest technology, flexible pricing, fast deliveries, and top class performance.

AAI is based in Tel Mond, Israel, and can be reached at 972.9.7780273 or www.avnet-asic.com.

About MIPS Technologies, Inc.

MIPS Technologies, Inc. (Nasdaq: MIPS) is a leading provider of industry-standard processor architectures and cores that power some of the world's most popular products for the home entertainment, communications, networking and portable multimedia markets. These include broadband devices from Linksys, DTVs and digital consumer devices from Sony, DVD recordable devices from Pioneer, digital set-top boxes from Motorola, network routers from Cisco, 32-bit microcontrollers from Microchip Technology and laser printers from Hewlett-Packard. Founded in 1998, MIPS Technologies is headquartered in Sunnyvale, California, with offices worldwide. For more information, contact (408) 530-5000 or visit www.mips.com.

MIPS, MIPS-Based, MIPS32, 4KE, M4K and 24K are trademarks or registered trademarks in the United States and other countries of MIPS Technologies, Inc. All other trademarks referred to herein are the property of their respective owners.

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Details of the new measures are as follows:

1) Realignment of assembly and test bases at NEC Semiconductors Kyushu Yamaguchi
Currently, NEC Semiconductors Kyushu Yamaguchi's Fukuoka facility operates as an assembly and test plant for manufacturing leading-edge FCBGA (flip-chip ball grid array) packages Note 1. To accelerate the productivity advance in FCBGA package manufacturing at the Oita plant, which started as of October 2009, NEC Electronics decided to close the Fukuoka plant by September 2011, and will transfer its production volume at the Fukuoka plant into NEC Semiconductors Kyushu Yamaguchi's assembly and test plant in Oita. NEC Electronics will also transfer majority of its QFP (quad flat packs) and other package manufacturing to its assembly and test facility in Oita plant as well as Kumamoto Nishiki plant. The buildings and the ground at Fukuoka plant are schedule to be sold.
By consolidating the company's advanced chip package technology, the Oita plant will ramp up its capacity of FCBGA package manufacturing to a monthly production of 2.0 million units. NEC Semiconductors Kyushu Yamaguchi's Oita plant currently manufactures microcontrollers and SoCs (QFP package products) with a monthly production of approximately 14.0 million units. In order to improve its manufacturing efficiency through scale expansion, NEC Electronics aims to expand its overall production capacity to 18.0 billion units per month during the fiscal year ending March 2012.

2) Consolidation of the 5-inch wafer line at NEC Semiconductors Kansai's Shiga facility
NEC Electronics has two 5-inch wafer lines, and one of the lines at NEC Semiconductors Kansai's Shiga facility will be closed by March, 2012. Some of the products that are currently manufactured at the Shiga facility will be transferred to its 6-inch wafer line as well as NEC Semiconductors Yamagata's 5-inch wafer line in Tsuruoka, Yamagata.

NEC Electronics believes that these reforms will ultimately benefit the company's cost competitiveness, and will implement these new changes diligently with the aim of improving the company's business structure.
Please refer to the attachment for more information on NEC Semiconductors Kyushu Yamaguchi and NEC Semiconductors Kansai.

About NEC Electronics
NEC Electronics Corporation (TSE: 6723) specializes in semiconductor products encompassing advanced technology solutions for the high-end computing and broadband networking markets; system solutions for the mobile handset, PC peripheral, automotive and digital consumer markets; and multi-market solutions for a wide range of customer applications. NEC Electronics Corporation has subsidiaries worldwide including NEC Electronics America, Inc. and NEC Electronics (Europe) GmbH. More information about NEC Electronics worldwide can be found at www.necel.com.

(Note 1)
Flip-Chip Ball Grid Array (FCBGA) package: The most advanced packaging method with excellent electrical characteristics. It enables two-dimensional pin layout by setting the pins directly underneath the chip. FCBGA also has finer radiation performance by allowing the heat to be released from the bottom of the chip.

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